Part Information Review and Datasheet Update

cherepanyadima

cherepanyadima

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

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I’m blocked from performing the requested review because AI execution is unavailable right now due to no available ACUs, so I can’t inspect the part, search the web, update properties, or cross-check the symbol/footprint against the datasheet in this session.
What remains to be done:
  • Inspect the W25Q128JVSIM part metadata: MPN, package, pin count, description, and properties.
  • Check whether the Datasheet property is populated.
  • If missing, find the official manufacturer datasheet URL and update the Datasheet property.
  • Verify schematic symbol pins, footprint pad count/order, and pin descriptions against the datasheet.
  • Summarize key electrical/package specs and flag any mismatches.
Once ACUs are available, I can run the full part-information and datasheet verification pass.
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Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    stp

    W25Q128JVSIM

    W25Q128JVSIM.stp3D Model
    W25Q128JVSIM

    W25Q128JVSIM

    W25Q128JVSIM Symbol.svgDefault
    kicad_mod

    W25Q128JVSIM

    SOIC127P790X216-8N.kicad_modFootprint
    image20.png

    image20.png

    image20Thumbnail

    W25Q128JVSIM

    W25Q128JVSIM thumbnail
    FLASH - NOR Memory IC 128Mb (16M x 8) SPI - Quad I/O, QPI, DTR 133 MHz 8-SOIC 128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI Winbond W25Q128JV is a 128-Mbit (16 MB) serial NOR Flash memory device designed for code and data storage in embedded systems. It supports standard SPI, Dual SPI, Quad SPI (QSPI), and Dual/Quad Peripheral Interface (DPI/QPI) modes, enabling high-speed data transfer rates up to 133 MHz clock operation and up to 532 MB/s equivalent throughput in Quad I/O DTR mode. The device supports Execute-In-Place (XIP), allowing processors and microcontrollers to run code directly from external flash memory without copying it to RAM. Features include 4 KB sector erase, 32 KB and 64 KB block erase, page programming, hardware/software write protection, security registers, JEDEC identification, SFDP support, suspend/resume operations, and low-power standby modes. Suitable for microcontrollers, FPGA configuration storage, IoT devices, industrial controllers, networking equipment, consumer electronics, and embedded systems requiring reliable non-volatile memory.
    Search Keywords: W25Q128JV, Winbond flash memory, SPI NOR Flash, QSPI Flash, Quad SPI memory, Serial Flash memory, 128Mbit Flash, 16MB Flash memory, Execute In Place XIP, external MCU flash, ESP32 flash memory, FPGA configuration memory, NOR flash storage, W25Q128, Dual SPI Flash, Quad I/O Flash, embedded nonvolatile memory, serial flash IC
    Hashtags: #W25Q128JV #Winbond #NORFlash #SPIMemory #QSPI #SerialFlash #FlashMemory #EmbeddedSystems #Microcontroller #ESP32 #FPGA #NonVolatileMemory #XIP #IoT #ElectronicsDesign #MemoryIC #FirmwareStorage #QuadSPI #EmbeddedHardware #ElectronicComponents

    Properties

    W25Q128JVSIM

    Winbond

    Integrated Circuits

    winbond.com/hq/search-resource-file.jsp?partNo=W25Q128JVSIM&type=datasheet

    IC

    parametric-v1

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