Datasheet Pin Audit
Thought for 4 mins 34 sec
Thought for 9 sec — Acknowledging execution needs
Referenced guidance.
Thought for 8 sec
4/5 Reorganize all terminal orientation, section, and order without changing pin mappings; remove Pin Group
Inspect part metadata, symbol, footprint, pins, and existing Datasheet property
Find and verify the official manufacturer datasheet
Update the Datasheet property if missing
Reorganize all terminal orientation, section, and order without changing pin mappings; remove Pin Group
Cross-check package, footprint, symbol, and pin descriptions; document findings
Thought for 15 sec
Thought for 6 sec
Awaiting 1 background task
Received notification from "Pin Symbol Reorganization" that it finished — picking the work back up.
Worked for 1 min 44 sec
Created a project doc
Part Datasheet Audit
Part Datasheet Audit
Part identification
- Manufacturer: Integrated Silicon Solution, Inc. (ISSI)
- Manufacturer part number: IS21TF32G-JCLI
- Function: 32 GB (256 Gbit) managed TLC NAND flash with eMMC 5.1 interface
- Official datasheet: https://www.issi.com/WW/pdf/21-22TF16G-32G-64G-128G.pdf
- Package: 153-ball VFBGA/FBGA, ordering code
C - Temperature grade: Industrial, -40 °C to +85 °C
- RoHS code:
L
The Datasheet URL property was already populated with the official ISSI PDF, so no URL mutation was required.
Key specifications
Metadata review
Correct / consistent
- MPN is exactly
IS21TF32G-JCLI. - Manufacturer name identifies ISSI.
- Description correctly states NAND flash, 256 Gbit, eMMC, 200 MHz, and 153-VFBGA dimensions.
Completed the datasheet audit and symbol reorganization. All 153 ball mappings were preserved; Pin Group was removed, and every terminal now has a balanced Left/Right orientation, functional section, and unique order with power first and grounds last.
Key issues flagged: incorrect internal
AND classification, unspecified electrical pin types, and missing pin descriptions. Full results: Part Datasheet Audit.Complete pin metadata
Correct part classification
Validate BGA land pattern
Review 3D model
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Part Datasheet Audit
Part identification
- Manufacturer: Integrated Silicon Solution, Inc. (ISSI)
- Manufacturer part number: IS21TF32G-JCLI
- Function: 32 GB (256 Gbit) managed TLC NAND flash with eMMC 5.1 interface
- Official datasheet: https://www.issi.com/WW/pdf/21-22TF16G-32G-64G-128G.pdf
- Package: 153-ball VFBGA/FBGA, ordering code
C - Temperature grade: Industrial, -40 °C to +85 °C
- RoHS code:
L
The Datasheet URL property was already populated with the official ISSI PDF, so no URL mutation was required.
Key specifications
Table
| Parameter | Datasheet value |
|---|---|
| User capacity | 32 GB / 256 Gbit |
| Interface | eMMC 5.1; backward-compatible with eMMC 4.3 through 5.0 |
| Data width | 1-bit, 4-bit, or 8-bit |
| Maximum clock | 200 MHz |
| Peak transfer modes | HS200 up to 200 MB/s; HS400 up to 400 MB/s |
| Main supply, VCC | 2.7–3.6 V |
| I/O supply, VCCQ | 1.8 V or 3.3 V |
| Package body | 13.00 mm nominal × 11.50 mm nominal × 1.00 mm maximum |
| Ball pitch | 0.50 mm BSC |
Ball diameter b | 0.25–0.35 mm, 0.30 mm nominal |
| Package standard | JEDEC MO-276 |
Metadata review
Correct / consistent
- MPN is exactly
IS21TF32G-JCLI. - Manufacturer name identifies ISSI.
- Description correctly states NAND flash, 256 Gbit, eMMC, 200 MHz, and 153-VFBGA dimensions.
- Pin/ball count is 153.
- Package property is VFBGA and the footprint asset identifies a 153-ball, 0.50 mm-pitch, 11.5 × 13.0 mm package.
- Official datasheet URL is present.
Mismatches or weak metadata
- Internal library classification is incorrect: the part is classified as logic with logic function
ANDin part-type-specific metadata. It is an eMMC managed NAND memory device, not an AND gate. - Part Type is overly generic:
Integrated Circuitsis valid but less precise than Memory / eMMC NAND Flash. - Designator prefix is
IC: usable, thoughUis the more common convention. This is not an electrical error.
Schematic symbol review
Pin population and organization
- All 153 physical terminals remain present exactly once.
- No pins were added, deleted, renamed, renumbered, or remapped.
- Symbol sections were reorganized in this order: core power, I/O power, internal power, data bus, command/clock, control, HS400 strobe, reserved, no-connect, core ground, I/O ground.
- All
Pin Groupproperties were removed. - Every terminal now has a Left/Right orientation and a unique terminal order from 1 through 153.
- Left/right distribution is balanced within every section (difference no greater than one, excluding singleton sections).
Functional checks
The named terminal set is appropriate for a 153-ball eMMC device:
DAT_0–DAT_7: 8-bit bidirectional data busCMD: bidirectional command signalCLK: clock inputRST__N: active-low hardware resetDS: HS400 data strobeVCC: core/controller and NAND supplyVCC_Q: I/O supplyVDD_I: internal regulator stabilization node; requires a capacitor to ground in the applicationVSS/VSS_Q: core and I/O groundsRFU: reserved; leave floatingNC: no internal connection; leave floating
Symbol mismatches
- All pin electrical types are
Unspecified. This weakens ERC. Power pins should be typed as power, CLK/reset as inputs, DAT/CMD/DS according to their bidirectional/input roles, and NC/RFU as no-connect/passive as supported by the platform. - Pin Description is absent on the terminals. The visible names are mostly meaningful, but datasheet descriptions are not embedded in the part.
- Naming differs from datasheet notation:
RST__N,VCC_Q,VSS_Q, andVDD_Icorrespond to datasheetRST#,VCCQ,VSSQ, andVDDI. This is stylistic and does not change mapping.
Footprint review
Correct / consistent
- Footprint contains exactly 153 pads.
- Footprint pad array uses 0.50 mm pitch and the expected depopulated 14 × 14 matrix pattern.
- Nominal body outline is 11.5 × 13.0 mm.
- Pad diameter is 0.29 mm, within the datasheet ball-diameter range of 0.25–0.35 mm and close to the 0.30 mm nominal value.
- Pin-1 marking and chamfer are present.
- A STEP model named
IS21TF32G-JCLI.stpis attached.
Footprint cautions
- No explicit manufacturer-recommended PCB land pattern was found in the device datasheet. The 0.29 mm circular copper pads track the nominal ball size, but final land sizing, solder-mask definition, and paste strategy should be validated against the assembler’s BGA process rules and JEDEC MO-276 guidance.
- Courtyard is larger than the package body: approximately 13.6 × 15.1 mm versus a 11.5 × 13.0 mm body. This is conservative rather than incorrect.
- 3D model alignment was not dimensionally certified by the datasheet audit. The model exists and has zero offset/rotation in the footprint definition; visual/mechanical verification is still recommended before enclosure use.
Overall assessment
The MPN, datasheet URL, package dimensions, pin count, functional terminal set, and footprint geometry are broadly consistent with the official ISSI documentation. The main quality issues are semantic rather than mapping-related: incorrect internal
AND logic classification, generic part categorization, and missing pin descriptions/electrical types. The reorganized symbol now has deterministic, balanced sections without changing any physical ball mapping.Part identification
Key specifications
Metadata review
Correct / consistent
Mismatches or weak metadata
Schematic symbol review
Pin population and organization
Functional checks
Symbol mismatches
Footprint review
Correct / consistent
Footprint cautions
Overall assessment
