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ICP-10111 Part Review
Actions completed
  • Added the official Datasheet URL project property: https://invensense.tdk.com/wp-content/uploads/2021/06/DS-000177-ICP-10111-v1.3.pdf.
  • Reviewed current project properties, terminal/symbol pins, footprint assets, and the official TDK InvenSense datasheet.
Datasheet source
  • Manufacturer: InvenSense, a TDK Group Company
  • Document: DS-000177, Revision 1.3, Release date 05/03/2021
  • Part: ICP-10111
  • Official description: High Accuracy, Low Power, Barometric Pressure and Temperature Sensor IC
  • Package: 2.0 mm × 2.5 mm × 0.92 mm LGA-8L, 1-Hole
  • Pin count: 8
Key datasheet specs

Table

ItemDatasheet value
Sensor typeBarometric pressure + temperature sensor IC
InterfaceI²C Fast Mode
I²C address7-bit 0x63 / decimal 99; write header 0xC6
SCL frequency0–400 kHz
VDD operating range1.71–1.89 V, nominal 1.8 V
Absolute max VDD-0.3 V to 2.16 V
SDA/SCL max-0.3 V to VDD + 0.3 V
Operating temperatureMaximum/operating range -40°C to +85°C; extended -20°C to +65°C; normal 0°C to +45°C
Pressure rangeMaximum 25–115 kPa; extended 30–110 kPa; normal 95–105 kPa
Pressure accuracy±1 hPa normal, ±1.5 hPa extended
Pressure resolution0.01 Pa
Temperature accuracy±0.4°C extended
Idle currenttyp 1.0 µA, max 2.5 µA
Measurement currenttyp 210 µA, max 300 µA
Required external componentC1 = 100 nF ±10% X7R ceramic VDD bypass capacitor, placed as close to sensor as possible
I²C pull-upsExternal pull-ups required on SDA/SCL, example value 10 kΩ, unless already provided by host I/O circuit
Current project information reviewed
Project properties

Table

PropertyCurrent valueDatasheet check
Manufacturer Part NumberICP-10111Correct
Part TypeSensorsAcceptable, though Pressure Sensor / Barometric Pressure and Temperature Sensor would be more precise
Package or Case Code16-LGAMismatch — datasheet says LGA-8L, 2.0 × 2.5 × 0.92 mm, 8 pins
Designator PrefixUCorrect for IC/sensor
Datasheet URLAdded official URLCorrect
Description
Current project description includes: 6-Axis Ois/Eis Optimized Mems Sensor, ICG-20660L, and LGA-16 InvenSense.
Mismatch: This appears to describe a different InvenSense 6-axis motion sensor, not the ICP-10111 pressure/temperature sensor. Recommended description: High-accuracy low-power I²C barometric pressure and temperature sensor, 1.8 V supply, LGA-8.
Datasheet pin table vs current symbol terminals

Table

Pin #Datasheet pinDatasheet descriptionCurrent terminalCurrent Pin TypeReview
1GNDConnect to GroundGNDPower InMismatch — should be Ground
2RESVNo internal connection; can connect to VDD/VDDIO/GND/NCRESV2PassiveAcceptable label; should have description and likely Not Connected or Passive depending library convention
3SDAI²C Serial DataSDABi-DirectionalCorrect
4SCLI²C Serial ClockSCLInputCorrect
5RESVConnect to GroundRESV5PassiveMismatch/needs note — this reserved pin is required to connect to GND, so its description should state that clearly; pin type may be better as Ground or at least flagged as reserved-connect-GND
6RESVNo internal connection; can connect to VDD/VDDIO/GND/NCRESV6PassiveAcceptable label; should have description and likely Not Connected or Passive depending library convention
7GNDConnect to GroundGND__1Power InMismatch — should be Ground; label should ideally be GND with pin number 7 or GND7 rather than generated suffix if possible
8VDDPower Supply VDDVDDPower InCorrect
Missing terminal metadata
The symbol terminals do not expose these expected metadata fields:
  • Pin Description
  • Section
  • Pin Group
  • Pin Orientation
For a clean IC-style part, add at least short pin descriptions and functional grouping:

Table

PinSuggested Pin DescriptionSuggested SectionSuggested Pin GroupSuggested Orientation
GND pin 1Ground returnGroundGroundBottom
RESV pin 2Reserved no-connect optionControl / ReservedReservedRight or Left
SDAI²C serial dataCommunicationI2CLeft
SCLI²C serial clockCommunicationI2CLeft
RESV pin 5Reserved connect to GNDGround / ReservedReservedBottom
RESV pin 6Reserved no-connect optionControl / ReservedReservedRight or Left
GND pin 7Ground returnGroundGroundBottom
VDD1.8 V supply inputPowerPowerTop
Footprint review
Current footprint asset: PSON65P250X200X100-8N.kicad_mod.
Datasheet land pattern requirements:
  • Package body: 2.0 mm × 2.5 mm × 0.92 mm
  • 8-pin LGA
  • Pad size: 0.35 mm × 0.35 mm
  • Vertical pad pitch: 0.65 mm
  • Horizontal spacing between pad columns: 1.1 mm
  • Pin numbering in land pattern: left side top-to-bottom 8, 7, 6, 5; right side top-to-bottom 1, 2, 3, 4
Review result:
  • The footprint asset name appears dimensionally consistent with an 8-pin, 0.65 mm pitch, 2.5 mm × 2.0 mm × 1.0 mm package.
  • The PCB layout contains 8 pad nodes named for the 8 terminals: GND, RESV2, SDA, SCL, RESV5, RESV6, GND__1, VDD.
  • The available layout data did not expose pad coordinates, pad sizes, or numeric pad numbers, so I could not fully verify pin-1 orientation or exact pad geometry against the datasheet land pattern.
  • Potential risk: footprint pads are named by terminal names rather than showing numeric pad numbers in the available data. The pin-number properties on the terminals appear to map 1–8 correctly, but the footprint should be checked visually/with pad geometry to ensure the right-side/left-side numbering matches the datasheet.
Mismatches / issues to fix
  1. Package property is wrong: current 16-LGA; datasheet says LGA-8L, 2.0 × 2.5 × 0.92 mm.
  2. Project description is wrong: current text describes a 6-axis OIS/EIS MEMS sensor / ICG-20660L, not ICP-10111.
  3. GND pin types are wrong: pins 1 and 7 are set to Power In; they should be Ground.
  4. Reserved pin 5 needs stronger handling: datasheet says pin 5 RESV must connect to ground; current type Passive does not communicate that requirement.
  5. Terminal metadata is incomplete: pin descriptions, section, pin group, and pin orientation are not set.
  6. Manufacturer Name property is missing: should be InvenSense, a TDK Group Company or TDK InvenSense.
  7. Footprint cannot be fully validated from exposed data: the footprint name looks plausible, but pad geometry/numbering was not exposed in the layout results.
  • Manufacturer Name: InvenSense, a TDK Group Company
  • Package or Case Code: LGA-8L, 2.0x2.5x0.92mm
  • Operating Voltage: 1.89 V
  • Operating Temperature: -40°C to +85°C
  • Implementation Details: Use 100 nF ±10% X7R VDD bypass capacitor placed close to sensor. SDA/SCL require pull-ups, example 10 kΩ. Pin 5 RESV must connect to GND; pins 2 and 6 RESV may connect to VDD/VDDIO/GND/NC.
  • Description: High-accuracy low-power I²C barometric pressure and temperature sensor, 1.8 V supply, LGA-8
Overall status
The part is structurally close: it has the correct MPN and exactly 8 symbol terminals matching the datasheet pin count and pin numbers. However, it should be cleaned up before publishing/use because the package metadata, project description, GND pin types, and pin descriptions/groups are inaccurate or incomplete.

  • Actions completed

  • Datasheet source

  • Key datasheet specs

  • Current project information reviewed

  • Project properties

  • Description

  • Datasheet pin table vs current symbol terminals

  • Missing terminal metadata

  • Footprint review

  • Mismatches / issues to fix

  • Recommended property updates

  • Overall status