Part Review and Mismatch Summary
Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
Worked for 4 mins 13 sec
I added the official TDK InvenSense datasheet URL and completed the part review. Main mismatches: the project description/package metadata appear to describe the wrong part (
6-Axis / 16-LGA vs ICP-10111 LGA-8), GND pins are typed as Power In, and pin descriptions/grouping metadata are missing. Full review is in ICP-10111 Part Review.Fix part metadata
Verify footprint pads
Run ERC/DRC
Update review note
Set Datasheet URL to "https://invensense.tdk.com/wp..."
Set Datasheet URL to "https://invensense.tdk.com/wp-content/uploads/2021/06/DS-000177-ICP-10111-v1.3.pdf"
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ICP-10111 Part Review
Actions completed
- Added the official Datasheet URL project property:
https://invensense.tdk.com/wp-content/uploads/2021/06/DS-000177-ICP-10111-v1.3.pdf. - Reviewed current project properties, terminal/symbol pins, footprint assets, and the official TDK InvenSense datasheet.
Datasheet source
- Manufacturer: InvenSense, a TDK Group Company
- Document:
DS-000177, Revision1.3, Release date05/03/2021 - Part:
ICP-10111 - Official description: High Accuracy, Low Power, Barometric Pressure and Temperature Sensor IC
- Package:
2.0 mm × 2.5 mm × 0.92 mm LGA-8L, 1-Hole - Pin count:
8
Key datasheet specs
Table
| Item | Datasheet value |
|---|---|
| Sensor type | Barometric pressure + temperature sensor IC |
| Interface | I²C Fast Mode |
| I²C address | 7-bit 0x63 / decimal 99; write header 0xC6 |
| SCL frequency | 0–400 kHz |
| VDD operating range | 1.71–1.89 V, nominal 1.8 V |
| Absolute max VDD | -0.3 V to 2.16 V |
| SDA/SCL max | -0.3 V to VDD + 0.3 V |
| Operating temperature | Maximum/operating range -40°C to +85°C; extended -20°C to +65°C; normal 0°C to +45°C |
| Pressure range | Maximum 25–115 kPa; extended 30–110 kPa; normal 95–105 kPa |
| Pressure accuracy | ±1 hPa normal, ±1.5 hPa extended |
| Pressure resolution | 0.01 Pa |
| Temperature accuracy | ±0.4°C extended |
| Idle current | typ 1.0 µA, max 2.5 µA |
| Measurement current | typ 210 µA, max 300 µA |
| Required external component | C1 = 100 nF ±10% X7R ceramic VDD bypass capacitor, placed as close to sensor as possible |
| I²C pull-ups | External pull-ups required on SDA/SCL, example value 10 kΩ, unless already provided by host I/O circuit |
Current project information reviewed
Project properties
Table
| Property | Current value | Datasheet check |
|---|---|---|
| Manufacturer Part Number | ICP-10111 | Correct |
| Part Type | Sensors | Acceptable, though Pressure Sensor / Barometric Pressure and Temperature Sensor would be more precise |
| Package or Case Code | 16-LGA | Mismatch — datasheet says LGA-8L, 2.0 × 2.5 × 0.92 mm, 8 pins |
| Designator Prefix | U | Correct for IC/sensor |
| Datasheet URL | Added official URL | Correct |
Description
Current project description includes:
6-Axis Ois/Eis Optimized Mems Sensor, ICG-20660L, and LGA-16 InvenSense.Mismatch: This appears to describe a different InvenSense 6-axis motion sensor, not the ICP-10111 pressure/temperature sensor. Recommended description:
High-accuracy low-power I²C barometric pressure and temperature sensor, 1.8 V supply, LGA-8.Datasheet pin table vs current symbol terminals
Table
| Pin # | Datasheet pin | Datasheet description | Current terminal | Current Pin Type | Review |
|---|---|---|---|---|---|
| 1 | GND | Connect to Ground | GND | Power In | Mismatch — should be Ground |
| 2 | RESV | No internal connection; can connect to VDD/VDDIO/GND/NC | RESV2 | Passive | Acceptable label; should have description and likely Not Connected or Passive depending library convention |
| 3 | SDA | I²C Serial Data | SDA | Bi-Directional | Correct |
| 4 | SCL | I²C Serial Clock | SCL | Input | Correct |
| 5 | RESV | Connect to Ground | RESV5 | Passive | Mismatch/needs note — this reserved pin is required to connect to GND, so its description should state that clearly; pin type may be better as Ground or at least flagged as reserved-connect-GND |
| 6 | RESV | No internal connection; can connect to VDD/VDDIO/GND/NC | RESV6 | Passive | Acceptable label; should have description and likely Not Connected or Passive depending library convention |
| 7 | GND | Connect to Ground | GND__1 | Power In | Mismatch — should be Ground; label should ideally be GND with pin number 7 or GND7 rather than generated suffix if possible |
| 8 | VDD | Power Supply VDD | VDD | Power In | Correct |
Missing terminal metadata
The symbol terminals do not expose these expected metadata fields:
Pin DescriptionSectionPin GroupPin Orientation
For a clean IC-style part, add at least short pin descriptions and functional grouping:
Table
| Pin | Suggested Pin Description | Suggested Section | Suggested Pin Group | Suggested Orientation |
|---|---|---|---|---|
| GND pin 1 | Ground return | Ground | Ground | Bottom |
| RESV pin 2 | Reserved no-connect option | Control / Reserved | Reserved | Right or Left |
| SDA | I²C serial data | Communication | I2C | Left |
| SCL | I²C serial clock | Communication | I2C | Left |
| RESV pin 5 | Reserved connect to GND | Ground / Reserved | Reserved | Bottom |
| RESV pin 6 | Reserved no-connect option | Control / Reserved | Reserved | Right or Left |
| GND pin 7 | Ground return | Ground | Ground | Bottom |
| VDD | 1.8 V supply input | Power | Power | Top |
Footprint review
Current footprint asset:
PSON65P250X200X100-8N.kicad_mod.Datasheet land pattern requirements:
- Package body:
2.0 mm × 2.5 mm × 0.92 mm - 8-pin LGA
- Pad size:
0.35 mm × 0.35 mm - Vertical pad pitch:
0.65 mm - Horizontal spacing between pad columns:
1.1 mm - Pin numbering in land pattern: left side top-to-bottom
8, 7, 6, 5; right side top-to-bottom1, 2, 3, 4
Review result:
- The footprint asset name appears dimensionally consistent with an 8-pin, 0.65 mm pitch, 2.5 mm × 2.0 mm × 1.0 mm package.
- The PCB layout contains 8 pad nodes named for the 8 terminals:
GND,RESV2,SDA,SCL,RESV5,RESV6,GND__1,VDD. - The available layout data did not expose pad coordinates, pad sizes, or numeric pad numbers, so I could not fully verify pin-1 orientation or exact pad geometry against the datasheet land pattern.
- Potential risk: footprint pads are named by terminal names rather than showing numeric pad numbers in the available data. The pin-number properties on the terminals appear to map 1–8 correctly, but the footprint should be checked visually/with pad geometry to ensure the right-side/left-side numbering matches the datasheet.
Mismatches / issues to fix
- Package property is wrong: current
16-LGA; datasheet saysLGA-8L,2.0 × 2.5 × 0.92 mm. - Project description is wrong: current text describes a 6-axis OIS/EIS MEMS sensor /
ICG-20660L, not ICP-10111. - GND pin types are wrong: pins 1 and 7 are set to
Power In; they should beGround. - Reserved pin 5 needs stronger handling: datasheet says pin 5
RESVmust connect to ground; current typePassivedoes not communicate that requirement. - Terminal metadata is incomplete: pin descriptions, section, pin group, and pin orientation are not set.
- Manufacturer Name property is missing: should be
InvenSense, a TDK Group CompanyorTDK InvenSense. - Footprint cannot be fully validated from exposed data: the footprint name looks plausible, but pad geometry/numbering was not exposed in the layout results.
Recommended property updates
Manufacturer Name:InvenSense, a TDK Group CompanyPackage or Case Code:LGA-8L, 2.0x2.5x0.92mmOperating Voltage:1.89 VOperating Temperature:-40°C to +85°CImplementation Details:Use 100 nF ±10% X7R VDD bypass capacitor placed close to sensor. SDA/SCL require pull-ups, example 10 kΩ. Pin 5 RESV must connect to GND; pins 2 and 6 RESV may connect to VDD/VDDIO/GND/NC.- Description:
High-accuracy low-power I²C barometric pressure and temperature sensor, 1.8 V supply, LGA-8
Overall status
The part is structurally close: it has the correct MPN and exactly 8 symbol terminals matching the datasheet pin count and pin numbers. However, it should be cleaned up before publishing/use because the package metadata, project description, GND pin types, and pin descriptions/groups are inaccurate or incomplete.
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