Part Datasheet Review and Verification

flux

I found the official datasheet URL and prepared the Datasheet property update to:
Part metadata review

Table

FieldResult
MPNICM-40609-D
ManufacturerTDK InvenSense
Device type6-axis MEMS MotionTracking device
Function3-axis gyroscope + 3-axis accelerometer
InterfacesI2C, 4-wire SPI, 3-wire SPI
Package24-lead LGA, 3.0 mm x 3.0 mm x 0.91 mm nominal, NiAu pad finish
Thickness0.85 mm min, 0.91 mm nom, 0.97 mm max
Pin count24
Project stateSymbol terminals and footprint exist; no nets defined yet
Existing metadata gapDatasheet property is not currently set
Key features from the datasheet

Table

FeatureValue
Max ODR32 kHz
Gyro full-scale range±15.625 dps to ±2000 dps
Accel full-scale range±4 g to ±32 g
Gyro noise density0.0045 dps/√Hz
Accel noise density100 µg/√Hz
6-axis low-noise current0.77 mA typ
Sleep current11 µA typ
Operating supplyVDD 1.71 V to 3.6 V, VDDIO 1.71 V to 3.6 V
Temperature range-40 C to +85 C
Absolute maximum ratings

Table

ParameterRating
VDD-0.5 V to +4 V
VDDIO-0.5 V to +4 V
FSYNC / SCL / SDA input voltage-0.5 V to VDDIO + 0.5 V
Acceleration, any axis, unpowered20,000 g for 0.2 ms
Operating temperature-40 C to +85 C
Storage temperature-40 C to +125 C
ESD2 kV HBM, 200 V MM
Latch-upJEDEC Class II (2), 125 C, ±100 mA
Recommended operating conditions and electrical characteristics

Table

ParameterValue
VDD1.71 V to 3.6 V
VDDIO1.71 V to 3.6 V
Specified operating temperature-40 C to +85 C
Supply ramp time0.01 ms min to 3 ms max
Power supply noise10 mV peak-to-peak
I2C max clock1 MHz
SPI max clock24 MHz
Gyroscope characteristics

Table

ParameterValue
ADC resolution16 bits
Full-scale settings±2000, ±1000, ±500, ±250, ±125, ±62.5, ±31.25, ±15.625 dps
Sensitivity initial tolerance±0.5 %
Sensitivity variation over temp±0.045 %/C
ZRO initial tolerance±1 dps
ZRO temp drift±0.01 dps/C
Cross-axis sensitivity±1 %
RMS noise, 100 Hz BW0.045 dps-rms
Startup time30 ms typ
Accelerometer characteristics

Table

ParameterValue
ADC resolution16 bits
Full-scale settings±32 g, ±16 g, ±8 g, ±4 g
Sensitivity initial tolerance±0.5 %
Sensitivity temp variation±0.007 %/C
Zero-g initial tolerance±40 mg
Zero-g temp drift±0.15 mg/C
Cross-axis sensitivity±1 %
RMS noise, 100 Hz BW1.00 mg-rms
Startup time10 ms typ
Power and external component requirements

Table

ItemDatasheet requirement
VDD bypass0.1 µF X7R ±10 % and 2.2 µF X7R ±10 %
VDDIO bypass10 nF X7R ±10 %
I2C pull-upsRequired, example 10 kΩ
Reserved pinsMust be tied to GND
NC pinsMust remain unconnected
FSYNC if selected but unusedTie to GND
Pin descriptions

Table

PinSymbol terminal in projectDatasheet function
8VDDIODigital I/O supply voltage
9AD0/SDOI2C address LSB / SPI data output
11RESVReserved, connect to GND
12INT1/INTInterrupt output
13VDDMain supply voltage
18GNDGround
19INT2/FSYNCInterrupt 2 / frame sync input
20RESV__1Reserved, connect to GND
22~CSSPI chip select
23SCL/SCLKI2C clock / SPI clock
24SDA/SDI/SDIOI2C data / SPI data input / 3-wire SPI data I/O
All remaining 13 pins are no-connect pins and should not be connected.
Symbol and footprint cross-check

Table

CheckResultRisk
MPN vs projectMatches ICM-40609-DLow
Pin countSymbol has 24 terminals; package is 24-lead LGALow
Active pin numberingChecked active pins match datasheet numberingLow
NC populationProject includes the correct count of NC pinsLow
Reserved pinsBoth reserved pins are present as RESV and RESV__1Medium if later left floating
Pin typesMostly reasonable; dual-function pins are modeled acceptablyLow
Package sizeFootprint is consistent with 3.0 mm x 3.0 mm package bodyLow
PitchFootprint pad pitch is consistent with 0.4 mm BSCLow
Pad sizesStraight pads appear consistent with 0.2 mm x 0.3 mm nominal package pad geometryLow
Corner padsCustom corner-pad shapes appear intentional and compatible with the package corner geometryMedium, should still be visually overlaid
Pin 1 markingFootprint includes a pin 1 marker; datasheet also requires pin 1 identificationLow
Datasheet propertyMissing from project metadataMedium for traceability / ordering / review workflows
Package thickness metadataProject description mentions 0.97 mm, but datasheet nominal is 0.91 mm and 0.97 mm is maxLow, metadata cleanup recommended
Flags that matter
  • No hard symbol pinout mismatch jumped out from the current project data.
  • No obvious footprint pitch or body-size mismatch jumped out from the current footprint.
  • The biggest real risks are:
    • Missing Datasheet property
    • Reserved pins not being explicitly documented as must-connect-to-GND
    • Future misuse of NC pins
    • The footprint cannot be proven perfect from the datasheet alone because the PDF gives package dimensions, but not a separate recommended PCB land-pattern table
Bottom line
  • This part project looks mostly consistent with the official datasheet.
  • I do not see an obvious pin-count, package-family, or gross footprint mismatch that would obviously cause board failure.
  • I do recommend applying the datasheet URL update and treating the reserved-pin grounding requirements as mandatory metadata for this part.
Sign up to send

To get started, talk to Flux or create a New Document.

Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    step

    ICM-40609-D

    ICM-40609-D.step3D Model
    image2.png

    image2.png

    image2Thumbnail
    kicad_mod

    ICM-40609-D

    XDCR_ICM-40609-D.kicad_modFootprint
    ICM-40609-D

    ICM-40609-D

    ICM-40609-D Symbol.svgDefault

    ICM-40609-D

    ICM-40609-D thumbnail
    Accelerometer, Gyroscope, 6 Axis Sensor I2C, SPI Output

    Properties

    ICM-40609-D

    TDK

    Sensor

    invensense.tdk.com/download-pdf/icm-40609-d-datasheet/

    U

    Parametric

    Pricing & Availability

    See prices from popular manufacturers for your project.

    Controls