This needs Agent mode to retrieve the official connector datasheet, audit all pins/pads and mechanical dimensions, then correct J4’s VPP/S5 pin type and the 3D model scale/alignment. Click the button to continue; I’ll verify the footprint and 3D envelope before applying only necessary fixes.

I’ll verify the connector’s official pinout, land pattern, and mechanical envelope, then correct the ERC pin classification and any 3D-model scaling/alignment errors and re-check the part.

The datasheet/geometry audit is still running; the electrical pin correction and the 3D asset need to be validated together so the footprint remains the manufacturing source of truth.

I’m reconciling the completed audit now, then I’ll independently re-check the terminal type, footprint geometry, model bounds, and ERC before closing.

Corrected and verified the Molex 104224-0820 part:

The downstream BLE-module overlap must update after this part revision is refreshed in the parent board. Full evidence is in Nano-SIM Connector Audit.