Airwire Fill Error
The "Airwires" review flagged a error on Fill:Fill, U1:DEVSLP.
Reports missing routed traces between pads in a net.
Designators: Fill:Fill, U1:DEVSLP
Context: Reports missing routed traces between pads in a net.
Help me fix this.
Thought for 9 sec
I’ll inspect the DEVSLP net and the reported fill connection, repair the missing route, then rerun the airwire check.
Worked for 1 min 20 sec
I confirmed the reported connection is U1:DEVSLP to the GND copper fill; the GND fill is not physically connected to that pad. Routing is currently blocked by a board-definition validation error, and I couldn’t continue because the account has no available ACUs.
Remaining: resolve the board validation error, then add a short GND connection or via from U1:DEVSLP into the GND fill and rerun the Airwires review.
Inspect validation error
Locate DEVSLP fill
Verify DEVSLP grounding
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Block Diagram
5V IN / GND IN terminals → eFuse (4.5 A nominal limit; reverse-current behavior per datasheet) → Protected 5V OUT / GND OUT terminalsProtected output shunts to GND through:
- BOM-configurable 1.5KE unidirectional TVS (DO-201 axial)
- 100 nF through-hole ceramic
- Two parallel alternative-fit radial electrolytic footprints (DNP one; mutually exclusive assembly)
- Optional LED + BOM-configurable series resistor
Mechanical/layout: compact 2-layer board, four corner M3 mounting holes, direct left-to-right high-current flow, broad top/bottom copper and thermal vias where required.
