Initial PCB placement is complete, with no overlap or out-of-board placement issues: thermocouple connectors along the top edge, battery/fuse/regulator on the left, fan/servo connectors and drivers on the right, ESP32 centered, and MAX31855 devices grouped near the ESP32. Estimated time saved vs. manual EDA workflow: ~2–4 hours.
Open items:
Airwires remain because routing was intentionally not performed.
Placement concern: the design spans most of the 160 mm board width, so keep BAT_12V routing wide and thermocouple traces physically separated from fan/servo current paths during routing.
Suggested next steps:
Set high-current trace-width rules for BAT_12V, FAN_GND, and servo power.
Add/confirm GND plane setup on the 4-layer stackup.
Route power first, then sensitive thermocouple/SPI signals.
Final hardware review is complete and saved as Final Hardware Design Review Before PCB Routing. Highest-priority items before routing are reverse-polarity protection, fuse/current sizing, LM2596 module-vs-IC confirmation, and high-current trace-width rules; no design changes were made.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant