Set Project Description to "PCB project for a Universal E-Paper Adapter, specifically aligning schematic and documentation to reference tasks in PDF: gro..."
Set System Architecture to "graph TD MCU[MCU Block] Power[Power Block] EpaperFPC[E-paper FPC Block] Multiplexer[Multiplexer Block] P..."
Nets renamed:
• SPI: Net 13→SCK, Net 14→MOSI, Net 48→MISO, Net 15→CS#
• Control: Net 11→D/C#, Net 16→RES#, Net 17→BUSY
• MUX: Net 27→S0, Net 28→S1, Net 30→S2, Net 29→S3
• +3V3 rail net
GND portals replaced with standard Ground symbols
ERC run: no errors
Tasks left unmarked
Connector pin labels on J1 and J2 to match PDF pin map (requires manual mapping)
Success criteria review
✅ Components grouped into four blocks
✅ Nets renamed per PDF conventions
⚠️ Connector pin labels: pending
✅ Ground symbols standardized
✅ ERC clean
Recommended next step
Review and update FPC connector pin labels on J1 and J2 to match the PDF map, then re-run ERC.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
PCB project for a Universal E-Paper Adapter, specifically aligning schematic and documentation to reference tasks in PDF: grouping components into function blocks, standardizing net names (SPI nets, multiplexer selects, +3V3, etc.), mapping connector functions, and updating all ground/portals to a common ground symbol.