The session has ended.
Work completed:
- Project description and “System Architecture” mermaid diagram updated.
- All major ICs (STM32WB55, STUSB4500, DRV8353S, TPS56339), MOSFETs, sense amps, sensors, connectors, protection, and passives were added and configured.
- Nets between MCU, gate drivers, MOSFETs, Hall sensors, shunts, buck converter, and USB-C PD controller have been fully wired.
- BOM finalized, footprints assigned, 4-layer stackup selected, board size set (60×40×1.6 mm), and mounting holes placed.
Tasks that I cannot automate in this session:
- Assign inner layers as power/ground planes and configure ground fills.
- Place and arrange components on the PCB.
- Route all nets (power loops, signal, RF/analog isolation).
- Perform ERC/DRC, power-integrity, and thermal review on the routed layout.
Success criteria status:
- Schematic supports dual-motor Hall-sensor FOC control, BLE telemetry, and USB-C PD 12 V input: ✅
- BLE telemetry and PD protection circuits included: ✅
- Board footprint and thermal/layout strategy defined: ✓ (stackup and dimension set, but routing/thermal pours pending)
Next steps: you’ll need to assign planes, place parts, route traces, and review the PCB to fully meet the thermal-performance and manufacturability criteria.