6.8 µH Shielded Molded Inductor 9 A 20.8mOhm Nonstandard

The XAL6060-682MEC specification defines the engineering requirements for a shielded surface-mount power inductor designed for high-efficiency energy storage and power conversion applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure stable inductance characteristics, efficient current handling, low electromagnetic interference, and long-term operational reliability.

The component is intended for use in DC-DC converters, voltage regulator modules, power management systems, industrial automation equipment, automotive electronics, telecommunications infrastructure, and embedded electronic applications requiring compact, high-current inductive components. The magnetically shielded construction minimizes stray magnetic fields while supporting efficient switching performance and stable energy transfer in high-frequency power circuits.

Engineering Requirements

The power inductor shall be manufactured using high-quality magnetic core materials and precision-wound conductors to ensure consistent inductance, low core losses, and dependable long-term reliability. The construction shall maintain stable electrical and magnetic characteristics throughout the specified operating voltage, current, frequency, and temperature ranges.

Electrical characteristics shall provide accurate inductance, low direct current resistance, high saturation current capability, and low core loss to maximize power conversion efficiency. The component shall maintain stable performance during continuous operation, transient load conditions, and dynamic switching without significant degradation of inductance or current-handling capability.

The shielded magnetic structure shall minimize electromagnetic emissions and magnetic coupling with adjacent components while improving electromagnetic compatibility in densely populated printed circuit board assemblies. Thermal performance shall support efficient heat dissipation and continuous operation within the specified operating temperature range while maintaining electrical integrity and structural stability.

Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall withstand thermal cycling, vibration, mechanical shock, and handling without degradation of electrical or mechanical performance. Workmanship shall be free from defects including cracks, contamination, core damage, winding irregularities, plating defects, or structural inconsistencies that could adversely affect functionality or reliability.

Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with all applicable engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation.

Documentation

Supporting documentation shall include engineering drawings, electrical performance specifications, magnetic characterization reports, thermal performance data, qualification records, inspection reports, material declarations, reliability data, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability.

Revision Control

Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards.

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