Part Review and Datasheet Update

flux

I’ll review the connector metadata, find and set the official datasheet URL if missing, then compare the symbol/footprint/pins against the datasheet and summarize any mismatches.

flux

I found official Samtec TW/TW-TH documents; the part currently lacks a Datasheet URL property, so I’m updating it to the official Samtec catalog PDF and using the print/spec PDFs for cross-checking.

flux

Completed the part review and added the official Samtec TW-TH catalog PDF as the Datasheet URL on terminal 01 since no top-level part property target was visible. I created the full report here: Part Review: Samtec TW-08-02-L-D-185-100.
Open items:
  • Package or Case Code = TO looks incorrect for this connector.
  • Pin descriptions are missing.
  • Drill/pad dimensions could not be fully verified from the retrieved official documents or layout output.
Suggested next steps:
  1. Update the package descriptor to a connector/header-specific value.
  2. Add Contact 01–Contact 16 pin descriptions.
  3. Verify drill and pad dimensions from Samtec support or a trusted CAD model before production use.
Fix metadata and verify
Fix part issues
Find drill dimensions
Run validation review
Update review report

Refine this doc
Ask about this doc
Part Review: Samtec TW-08-02-L-D-185-100
Reviewed project metadata
  • Project / part name: TW-08-02-L-D-185-100
  • Manufacturer: Samtec
  • Manufacturer part number: TW-08-02-L-D-185-100
  • Mount: Through hole
  • Designator prefix: J
  • Existing package / case code: TO
  • Pads: 16
  • Schematic terminals: 16 terminals numbered 01 through 16
  • Nets: none
  • Datasheet URL added: https://suddendocs.samtec.com/catalog_english/tw_th.pdf
Note: this part project is represented as individual terminal components rather than one schematic component body. The Datasheet URL was added to terminal 01 because no separate top-level component body/property target was available through the schematic data.
Official Samtec sources used
  • TW-TH catalog page / datasheet: https://suddendocs.samtec.com/catalog_english/tw_th.pdf
  • Product specification: https://suddendocs.samtec.com/productspecs/mms-tmm.pdf
  • Product print / mechanical drawing: https://suddendocs.samtec.com/prints/tw-xx-xx-x-x-xxx-xxx-xxx-xx-mkt.pdf
  • Samtec product page checked: https://www.samtec.com/products/tw-08-02-l-d-185-100
Part-number decoding
TW-08-02-L-D-185-100 decodes as:

Table

FieldValue
SeriesTW / TW-TH high-temp 2 mm board stacking terminal strip
Positions per row8
Total contacts16
Lead style02
PlatingL: 10 µin / 0.25 µm gold on post, matte tin on tail, over nickel
RowsD: double row
Stacker height.185 in / about 4.70 mm
Tail length.100 in / 2.54 mm
Pitch2.00 mm
Contact materialPhosphor bronze
Insulator materialBlack liquid crystal polymer
Key specifications

Table

SpecValue
Current rating3.9 A per pin / one pin powered per row; catalog also states 3.9 A per pin with 2 pins powered
Voltage rating350 VAC; catalog also lists 495 VDC
Operating temperature-55 °C to +125 °C for gold plating; catalog notes -55 °C to +105 °C with tin
DurabilityProduct spec lists 500 cycles for S plating; verify applicability if using L plating for production claims
Mechanical grid2.00 mm pitch along row × 2.00 mm row spacing, 8 columns × 2 rows
Pin numbering conventionOdd/even pins paired by column, increasing along the row; drawing top view shows odd pins on one row and even pins on the other
Symbol cross-check
Observed schematic symbol implementation:
  • 16 terminal entries exist and are numbered 01–16.
  • Pin type is Passive on every terminal, appropriate for a connector/header.
  • Symbol pin positions show odd pins on one side and even pins on the other, consistent with a double-row connector convention.
  • No Pin Description property is present on the terminals.
  • Terminal Pins field displays as undefined in inspection, but the terminal properties include correct Pin Number values.
Symbol result: generally consistent for pin count and passive electrical type. Missing descriptive pin labels are the main documentation gap.
Footprint cross-check
Observed footprint/layout implementation:
  • 16 PCB pad nodes exist, numbered 01–16.
  • Silkscreen/body outline corresponds approximately to a 16 mm × 4 mm body region, consistent with an 8-position 2 mm pitch double-row connector footprint envelope.
  • Flat layout view shows the footprint outline and pin-1 marker/indicator.
  • The detailed flat view did not expose plated-hole drill diameter or pad diameter values.
Datasheet / print expectations:
  • 8 columns × 2 rows.
  • 2.00 mm pitch along the row.
  • 2.00 mm row spacing for D double-row option.
  • Pin numbering follows paired odd/even columns.
  • Official print content available to this review did not provide recommended PCB drill or land diameter.
Footprint result: pad count and inferred outline/grid are consistent with the official mechanical data available. Drill/pad diameter could not be fully verified because neither the Flux inspection output nor the retrieved official print exposed a recommended hole/land diameter.
Mismatches / issues flagged
  1. Package or Case Code is set to TO
    • This appears inappropriate for this connector. A better descriptor would be a connector/header style such as 2.00mm double-row through-hole board stacker if the property schema allows it.
  2. No top-level Datasheet URL property target was visible
    • I added the official catalog PDF URL to terminal 01; if this part project supports a true top-level part Datasheet URL field elsewhere, it should also be set there.
  3. Pin descriptions are missing
    • All terminals are generic passive pins with pin numbers only. This is electrically acceptable for a generic board-to-board header, but descriptions such as Contact 01, Contact 02, etc. would improve library quality.
  4. Footprint hole and pad diameter not verified
    • The official drawing data retrieved confirmed 2.00 mm × 2.00 mm grid and mechanical constraints, but not a recommended PCB drill/land size. The Flux layout inspection did not expose hole/pad dimensions in the returned view.
  5. Durability rating ambiguity
    • The product spec mentions 500 cycles for S plating; this exact part uses L plating. Avoid stating 500 mating cycles for this exact L-plated variant unless Samtec confirms applicability.
Overall conclusion
The part is broadly consistent with Samtec official data for MPN, manufacturer, through-hole mount, 16 contacts, double-row 2.00 mm pitch, stack height, tail length, and passive terminal behavior. The main corrections recommended are improving the package descriptor, adding pin descriptions, and verifying/recording the actual through-hole drill and pad dimensions if manufacturing-grade footprint validation is required.

  • Reviewed project metadata

  • Official Samtec sources used

  • Part-number decoding

  • Key specifications

  • Symbol cross-check

  • Footprint cross-check

  • Mismatches / issues flagged

  • Overall conclusion

Documents

Assets

TW-08-02-L-D-185-100-thumb.png

TW-08-02-L-D-185-100-thumb.png

TW-08-02-L-D-185-100-thumbThumbnail
stp

TW-08-02-L-D-185-100

TW-08-02-L-D-185-100.stp3D Model
TW-08-02-L-D-185-100

TW-08-02-L-D-185-100

TW-08-02-L-D-185-100 TW-08-02-L-D-185-100_0_0 Symbol.svgDefault
kicad_mod

TW-08-02-L-D-185-100

SAMTEC_TW-08-02-L-D-185-100.kicad_modFootprint

TW-08-02-L-D-185-100

TW-08-02-L-D-185-100 thumbnail
16 Position Header Spacer Connector 0.079" (2.00mm) Gold Through Hole
TW-08-02-L-D-185-100 is a 16-position, dual-row board-to-board stacking header from the Samtec TW series. Designed for elevated board stacking applications, it features a 2.00 mm pitch, a 0.185" (4.70 mm) stack height, and gold-plated contacts for reliable electrical performance. The connector uses a through-hole mounting style with solder termination and is suitable for embedded systems, industrial controls, communications equipment, and other high-density PCB interconnect applications. Its flexible stacking architecture allows designers to achieve custom board spacing while maintaining mechanical stability and signal integrity.
Key Features 16-position (2 × 8) dual-row board stacking header 2.00 mm (0.079") contact pitch 0.185" (4.70 mm) board stack height Through-hole mounting with solder termination Gold-plated contacts for enhanced durability and conductivity Black insulating housing Flexible board-to-board stacking design Suitable for elevated PCB stacking applications High-speed performance capability up to 8 Gbps within the TW family Reliable mechanical and electrical connection for embedded and industrial systems
#Samtec #BoardToBoardConnector #StackingHeader #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #ElectronicsDesign #ThroughHoleConnector #TWSeries

Properties

TW-08-02-L-D-185-100

Samtec

Connector

suddendocs.samtec.com/catalog_english/tw_th.pdf

J

Through Hole

TO

parametric-v1

creativecommons.org/licenses/by/4.0/

Pricing & Availability

See prices from popular manufacturers for your project.

Controls