Connector Header Through Hole 13 position 0.100" (2.54mm) pin header 1x13 2.54mm
The TSW-113-07-F-S is a surface-mount, dual-row header designed for reliable board-to-board or board-to-wire connections in compact electronic assemblies. It is commonly used in applications where space efficiency, mechanical stability, and consistent electrical performance are required. The component features a low-profile design suited for automated assembly processes and is compatible with standard reflow soldering techniques.
Configuration and Design
This connector is configured as a dual-row header with a fine pitch layout, enabling high-density interconnections while maintaining signal integrity. The surface-mount termination style allows for direct placement onto printed circuit boards without the need for through-hole mounting, supporting modern manufacturing practices and reducing assembly time.
Material and Construction
The housing is typically constructed from a high-temperature thermoplastic material suitable for reflow soldering environments. Contacts are manufactured from a conductive alloy and are plated to enhance durability, corrosion resistance, and electrical conductivity. The plating material is selected to ensure long-term reliability under normal operating conditions.
Electrical Characteristics
The connector supports low-voltage signal transmission and is designed to maintain consistent contact resistance throughout its service life. It is suitable for general-purpose electronic applications where stable electrical connections are essential.
Mechanical Properties
The component is engineered to provide secure mating retention and resistance to mechanical stress during handling and operation. Its surface-mount design contributes to improved alignment and stability on the PCB, especially in high-vibration environments when properly soldered.
Environmental Considerations
The device is capable of operating within standard commercial temperature ranges and is designed to withstand typical environmental conditions encountered in electronic assemblies. Materials used are compliant with common industry standards for environmental safety and manufacturing.
