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Assets
kicad_mod
TSW-106-06-T-S
TSW-106-XX-YY-S.kicad_modFootprint
TSW-106-06-T-S
TSW-106-06-T-S.stp3D Model
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TSW-106-06-T-S
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TSW-106-06-T-S
Connector Header Through Hole 6 position 0.100" (2.54mm)
The TSW-106-06-T-S is a through-hole, single-row, 6-position header from Samtec’s TSW series, designed for board-to-board or wire-to-board interconnections. It features a standard 2.54 mm (0.100") pitch and utilizes square posts for reliable mating with female sockets or IDC connectors. This header is commonly used in prototyping, development boards, and general-purpose PCB designs requiring robust and cost-effective interconnect solutions.
Key Features
Single-row vertical header
6 positions (1x6 configuration)
Standard 2.54 mm pitch spacing
Through-hole mounting for strong mechanical retention
Tin-plated contacts for cost efficiency
Square post design for reliable electrical contact
Compatible with a wide range of mating connectors
Electrical Characteristics
Current Rating: ~3 A per contact (typical, depending on application)
Contact Resistance: ≤ 10 mΩ (initial)
Insulation Resistance: ≥ 1000 MΩ
Withstanding Voltage: ~500 VAC
Mechanical Characteristics
Number of Positions: 6
Rows: 1
Pitch: 2.54 mm (0.100")
Mounting Type: Through-hole
Contact Type: Male pin (square post)
Post Length Style: Standard (06)
Tail Length: ~3.18 mm (0.125") typical
Mating Pin Size: ~0.64 mm square
Material and Plating
Contact Material: Phosphor Bronze
Plating: Tin over Nickel
Insulator Material: Glass-filled thermoplastic (UL94 V-0 rated)
Environmental Specifications
Operating Temperature Range: -55°C to +105°C
RoHS Compliant: Yes
Lead-Free: Yes
Applications
PCB prototyping and development boards
Embedded systems and microcontroller headers
Board-to-board connections
General-purpose signal connections
Packaging
Typically supplied in bulk or tube packaging depending on order quantity