Completed the datasheet review for TLE92466EDXUMA1. The official Infineon datasheet URL was already set, and the symbol pin-number/name mapping matches the datasheet’s 36 leads plus exposed cooling tap.
Open items flagged:
Part Type is inaccurate: currently “Electromechanical Components”; should be an integrated low-side solenoid driver IC / power switch driver.
Description is misleading: it says “1:1 N-Channel 2.7A,” but this is a six-channel solenoid driver; 2.7 A applies to parallel-channel capability.
Pin Type and Pin Description properties are not populated.
Pin 37 is electrically OK as GND, but should be described as Cooling Tap / exposed pad.
I’ll update the part metadata and terminal pin properties from the Infineon datasheet, then re-inspect the schematic symbol and footprint for mismatches.
Fixed the metadata and populated all 37 terminal Pin Description and Pin Type properties from the Infineon datasheet. I reran the review: symbol pin mapping and footprint pad count now match the datasheet, with no remaining pin-name/number/description mismatches.
Open items:
Exact footprint copper/mask/stencil geometry could not be numerically verified from the exposed layout data, but pad count/designators and visible package form are consistent with PG-DSO-36-72.
Terminals: 36 leads plus exposed cooling tap/paddle, represented as pin/pad 37.
Function: Integrated MOSFET low-side drivers with current sensing for six linear solenoids.
Channels: 6 independent low-side channels.
Current control: 0 mA to 1.5 A programmable setpoint, 15-bit resolution.
Dither/load capability: Up to 1.8 A including dither in single-channel operation.
Parallel-channel measurement/current capability: Up to 2.7 A.
Typical RDS(on): 115 mΩ; max 200 mΩ at TJ = 150°C and ILOADx = 2 A.
Integrated shunt: typ 140 mΩ.
SPI: 32-bit SPI with 8-bit CRC and watchdog.
Logic levels: SPI/control inputs support 3.3 V or 5 V logic where applicable.
Functional ranges: VDD 4.5–5.5 V nominal, VBAT 6–18 V nominal, VIO 3.0–5.5 V nominal.
Extended ranges: VDD 3.5–19 V, VBAT 4–38 V, VIO up to 19 V per datasheet conditions.
Temperature: -40°C to 175°C junction range noted in features; AEC-Q100 Grade 0.
Safety: ISO 26262 Safety Element out of Context up to ASIL C.
Symbol pin review after fixes
The schematic symbol contains 37 terminal components, matching the datasheet's 36 package leads plus exposed cooling tap. Pin number/name mapping matches the datasheet, and every terminal now has a datasheet-derived Pin Description and a valid Flux Pin Type.
Table
Pin
Datasheet symbol
Project terminal
Pin Type
Status
1
LOAD0
LOAD0
Output
OK
2
FWD0
FWD0
Output
OK
3
GNDP0
GNDP0
Ground
OK
4
GND
GND_1
Ground
OK
5
CSN
CSN
Input
OK
6
SCK
SCK
Input
OK
7
SI
SI
Input
OK
8
VIO
VIO
Power In
OK
9
SO
SO
Output
OK
10
GND
GND_2
Ground
OK
11
FAULTN
FAULTN
Open Collector
OK; used to represent open-drain status output
12
GND
GND_3
Ground
OK
13
LOAD5
LOAD5
Output
OK
14
FWD5
FWD5
Output
OK
15
GNDP5
GNDP5
Ground
OK
16
GNDP1
GNDP1
Ground
OK
17
FWD1
FWD1
Output
OK
18
LOAD1
LOAD1
Output
OK
19
LOAD2
LOAD2
Output
OK
20
FWD2
FWD2
Output
OK
21
GNDP2
GNDP2
Ground
OK
22
VBAT
VBAT
Power In
OK
23
GND
GND_4
Ground
OK
24
CLK
CLK
Input
OK
25
DRV0
DRV0
Input
OK
26
RESN
RESN
Input
OK
27
EN
EN
Input
OK
28
DRV1
DRV1
Input
OK
29
VDD
VDD
Power In
OK
30
GND
GND_5
Ground
OK
31
LOAD4
LOAD4
Output
OK
32
FWD4
FWD4
Output
OK
33
GNDP4
GNDP4
Ground
OK
34
GNDP3
GNDP3
Ground
OK
35
FWD3
FWD3
Output
OK
36
LOAD3
LOAD3
Output
OK
37
Cooling Tap
GND_6
Ground
OK; description identifies Cooling Tap / exposed pad
Footprint review after fixes
Layout contains 37 pads matching the datasheet's 36 leads plus exposed cooling tap.
Pad designators match all symbol terminals.
Package family/variant remains consistent with PG-DSO-36-72.
Visible outline/lead pitch pattern remains consistent with PG-DSO-36 exposed-pad footprint.
Detailed pad geometry values were not fully exposed in the layout inspection output, so exact copper/solder-mask/stencil dimensions were not numerically revalidated.
Remaining notes
No symbol pin-number, pin-name, pin-description, or footprint pad-count mismatches were found after the fixes. The only remaining limitation is that exact footprint geometry could not be numerically verified from the currently exposed layout data.