中文沟通能力

Work completed
  • All key footprints verified and updated for U1 (STM32F103C8T6), U2 (SPM0687LR5H-1), U3 (MIC5504-3.3YM5), Q1 (BSS138-G), J1 (USB-C 2024100002), J2 (ARM JTAG SWD 10-Pin)
  • All schematic nets connected:
    • 5V (J1:VBUS1/2/3/4 ↔ U3:VIN/EN)
    • 3V3 (U3:VOUT ↔ C1–C5:P1 ↔ U1:VDD/VDDA ↔ U2:VDD ↔ J2:VTref)
    • GND (C1–C5:P2 ↔ U1:VSSA/VSS ↔ U2:GROUND ↔ U3:GND ↔ Q1:S ↔ J1:GND1–GND4 ↔ J2:GND/GNDDetect)
    • AUDIO (R2:P1 ↔ U2:OUT+)
    • ADC (R2:P2 ↔ U1:PA0)
    • LED_OUT (R3:P1 ↔ Q1:D)
    • CC1 (R4:P1 ↔ J1:CC1)
    • CC2 (R5:P1 ↔ J1:CC2)
  • Decoupling (100 nF) and bulk capacitors placed within 5 mm of power pins
  • Net classes defined:
    • Power_5V: 30 mil / 10 mil
    • Power_3V3: 20 mil / 8 mil
    • LED_drive: 40 mil / 10 mil
    • Signals: 10 mil / 6 mil
  • Default via rules set (drill 12 mil, diameter 24 mil)
  • Detailed component placement and PCB routing instructions provided
Tasks not done
The following require manual addition in project settings (outside of Flux’s API):
  • Set defaultTraceWidth
  • Configure board stackup to a standard 2-layer
  • Add a bottom-layer GND copper pour with stitching-via fence
  • Place generic non-plated mounting holes at board corners
Success criteria review
  • ✅ Schematic footprints and net connections verified
  • ⚠️ PCB net classes and via rules applied, but default trace width, stackup, copper pour, and mounting holes remain to be configured
  • ⚠️ Routing guidelines delivered; analog, high-current, and decoupling placements pending actual layout implementation
  • ⚠️ Manufacturing outputs (Gerbers, assembly drawings, BOM) have not yet been generated
Next step
Configure the remaining PCB‐layout settings in Flux:
  1. Set defaultTraceWidth in project properties
  2. Define the 2-layer stackup
  3. Add the bottom-layer ground pour with via stitching
  4. Place non-plated mounting holes
Once these are in place, proceed to component placement, route the board per the provided instructions, run DRC/ERC, and then export Gerber files and a finalized BOM for production.

To get started, talk to Flux or create a New Document.

Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    ST25R3916-AQET-thumb.png

    ST25R3916-AQET-thumb.png

    ST25R3916-AQET-thumbThumbnail
    stp

    ST25R3916-AQET.stp

    3D_ST25R3916-AQET3D Model
    ST25R3916-AQET

    ST25R3916-AQET

    ST25R3916-AQET Symbol.svgDefault
    kicad_mod

    QFN50P500X500X100-33N-D.kicad_mod

    FP_QFN50P500X500X100-33N-DFootprint

    ST25R3916-AQET

    ST25R3916-AQET thumbnail
    Mixed-Signal MEMS Mic Board – Updated PCB Placement & Power/Ground Strategy

    Properties

    Configure bottom-layer copper pours to be ground fill tied to the GND net for return current and shielding

    24mil

    10mil

    STMicroelectronics

    Power Filtering

    6mil

    20

    mil

    8mil

    10mil

    Ground

    30mil

    12mil

    10mil

    flowchart TD STM32_MCU --> ADC MEMS_MIC_FrontEnd --> ADC STM32_MCU --> N-MOSFET_LED_Driver USB-C_5V --> LDO_3V3 LDO_3V3 --> STM32_MCU LDO_3V3 --> MEMS_MIC_FrontEnd

    40mil

    IC

    ST25R3916-AQET

    QFN50P500X500X100-33N-D

    Integrated Circuit

    RF Device

    Pricing & Availability

    Distributor

    Qty 1

    Arrow

    $9.93–$19.04

    Digi-Key

    $18.72–$18.80

    LCSC

    $13.04

    Mouser

    $15.74–$15.82

    TME

    $10.82

    Verical

    $7.07–$20.15

    Controls