1. Review of available part information (from project context)

• MPN: SN74LVC245ANE4
• Manufacturer: Texas Instruments
• Description: Bus Transceivers — Octal bus transceiver with 3-state outputs
• Package family (from ordering info): N = PDIP, 20 pins (confirmed for SN74LVC245ANE4)
• Pin count (symbol): 20 terminals present
• Datasheet: Datasheet

2. Datasheet URL presence and update

• A datasheet URL is already set on this part. No change required.

3. Datasheet scan — summarized metadata

• Operates from 1.65 V to 3.6 V
• Inputs accept voltages to 5.5 V (5 V tolerant inputs)
• Max tpd of 6.3 ns at 3.3 V
• Ioff supports live insertion, partial-power-down mode, and back drive protection
• Mixed-mode operation (5 V input/output with 3.3 V VCC)
• Latch-up performance exceeds 250 mA per JESD 17
• ESD protection exceeds JESD 22: 2000 V HBM, 1000 V CDM

• VOH at VCC = 3.0 V:
  • IOH = −12 mA: 2.4 V (typ), 2.3 V (min at −40 to 125 C)
  • IOH = −24 mA: 2.3 V (typ), 2.1 V (min at −40 to 125 C)
• VOL at VCC = 3.0 V:
  • IOL = 24 mA: 0.55 V (typ), 0.75 V (max at −40 to 125 C)
• Input leakage (II) at VI = 0 to 5.5 V, VCC = 3.6 V: ±1 μA typ, ±10 μA max
• Ioff (VI or VO = 5.5 V, VCC = 0): ±1 μA typ, ±20 μA max
• ICC (all inputs at VCC or GND, IO = 0, VCC = 3.6 V): 1 μA typ, 30 μA max
• ΔICC (one input at VCC−0.6 V, others at rails, VCC = 2.7 to 3.6 V): 500 μA typ, 5000 μA max
• Capacitance: Ci (control) ≈ 4 pF (typ), Cio (I/O) ≈ 5.5 pF (typ)

• tpd: 1.5 ns (min), 6.1 ns (typ), 7.3 ns (max at −40 to 125 C)
• ten (OE to outputs): 1.5 ns (min), 8.3 ns (typ), 10 ns (max at −40 to 125 C)
• tdis (OE to Hi-Z): 1.7 ns (min), 7.3 ns (typ), 8.5 ns (max at −40 to 125 C)
• tsk(o) at 3.3 V: 1.5 ns (max)

• ESD (HBM): 2000 V
• ESD (CDM): 1000 V
• Latch-up per JESD 17: exceeds 250 mA

• L, L → B data to A bus
• L, H → A data to B bus
• H, X → Isolation

• RθJA (°C/W): 124.1 (DB), 92.9 (DGV), 78 (DW), 59.2 (N), 83.6 (NS), 108.1 (PW), 44.0 (RGY)
• RθJC(top) (°C/W): examples — 44.9 (N), 60.6 (DW), 43.0 (PW)
• RθJC(bot) (°C/W): 16.6 (RGY only)

• Package options mapping: DB = SSOP, DW = SOIC, PW = TSSOP, N = PDIP, NS = SOP, RGY = VQFN
• Orderable confirmation: SN74LVC245ANE4 is PDIP (N), 20-pin, tube.
• Mechanical drawings in this PDF focus on several SMD packages (e.g., SOIC/TSSOP/VQFN). The detailed PDIP N 20-pin mechanical drawing is not explicitly included here; use TI’s PDIP “N0020” mechanical drawing for exact dimensions and hole pattern.

4. Cross-check: schematic symbol and footprint vs datasheet

• Observed symbol pin numbers from the schematic:
  • DIR=1; A1=2; A2=3; A3=4; A4=5; A5=6; A6=7; A7=8; A8=9; GND=10; B8=11; B7=12; B6=13; B5=14; B4=15; B3=16; B2=17; B1=18; ~OE=19; VCC=20.
• Datasheet pinout for 20‑pin packages (DB/DW/PW/NS/N) matches exactly: DIR=1; A1–A8=2–9; GND=10; B8–B1=11–18; OE=19; VCC=20.
• Status: Symbol pin names and numbers match the datasheet.

• Pad list present (20 pads): DIR, A1, A2, A3, A4, A5, A6, A7, A8, GND, B8, B7, B6, B5, B4, B3, B2, B1, ~OE, VCC.
• Pad count alignment: 20 pads present, consistent with the device.
• Pad identification: Pads appear to be named by signal (e.g., “A1”, “B1”, “DIR”) rather than numbered “1–20”. For manufacturing outputs (pick-and-place, assembly), numeric pad numbering and a clear pin‑1 marker are critical. Risk: If the footprint lacks correct numeric pin numbers and a defined pin‑1 indicator tied to the package orientation, it can cause assembly and orientation errors.
• Package style: The orderable MPN SN74LVC245ANE4 is PDIP (N), 20-pin. The current footprint node is “defaultFootprint” and no package geometry (through-hole vs SMD, lead pitch, row spacing) is exposed in the layout data here. Risk: Cannot confirm that the footprint is a PDIP‑20 through-hole pattern sized to the correct TI PDIP N package. If this part is intended for DIP (through-hole), ensure:
  • Through‑hole DIP‑20 footprint with 20 plated holes
  • Correct pin numbering 1–20 following TI “N” package orientation
  • Proper pin 1 indicator
  • Hole size and pad size per TI PDIP N mechanical drawing
• Package dimensions: The PDIP (N) 20‑pin mechanical drawing is not explicitly included in this PDF. Use TI’s PDIP N0020 mechanical drawing to verify hole diameters, pad annular rings, pitch, and row spacing. Without this check, there is a risk of mismatch between package leads and PCB holes.

• Footprint pad numbering: Convert pad names to numeric pad numbers 1–20 and retain signal names as secondary labels if your workflow supports it. This avoids pick-and-place and orientation issues.
• Pin‑1 marking: Ensure the footprint has a silkscreen and/or copper pin‑1 indicator aligned to the datasheet orientation.
• Package style alignment: Because the orderable MPN is PDIP (N), confirm the footprint is PDIP‑20 through‑hole (not SOIC/TSSOP/VQFN). If you intend to use an SMD package variant instead, change the MPN accordingly (e.g., DW for SOIC‑20, PW for TSSOP‑20) and update the footprint to match.
• Mechanical verification: Cross‑check hole size, annular ring, pitch, and row spacing against TI’s PDIP N 20‑pin drawing (N0020). Update the footprint if any dimension deviates.

• Library search: SN74LVC245A