Part Review and Validation
Thought for 4 sec
I’ll review the part metadata, find and set the official datasheet if missing, then validate the symbol, footprint, and pin details against it.
Worked for 2 mins 28 sec
The part already has a Datasheet URL property, so I’m using that datasheet for validation rather than replacing it.
Worked for 2 mins 26 sec
Completed the part review and updated the project document:
part-review-ms580314ba01-00.Open items:
- Datasheet URL was already populated, so I did not replace it; it points to an uploaded PDF rather than the official TE URL.
- Symbol pins match the datasheet overall.
- Main flag: the footprint’s longer pad appears assigned to pad 3 / CSB, while extracted reference land-pattern data suggests it should be pad 7 / SDI/SDA; this should be verified against the TE package drawing before release.
- Pin Description properties are not populated.
Suggested next steps:
- Replace the Datasheet URL with the official TE datasheet URL for traceability.
- Fix or confirm the footprint long-pad assignment.
- Add Pin Description properties for all 8 terminals.
Fix docs and footprint
Use official datasheet
Add pin descriptions
Fix footprint mismatch
Run validation review
Refine this doc
Ask about this doc
Part Review: MS580314BA01-00
Reviewed Part Information
- Manufacturer Part Number (MPN): MS580314BA01-00
- Manufacturer: TE Connectivity Measurement Specialties
- Part type: Sensors
- Description: MS5803-14BA high-resolution digital absolute pressure sensor module, 14 bar, 24-bit ADC, I²C/SPI interface.
- Package / case: 8-SMD Module
- Mount: Surface Mount
- Pin count: 8
- Designator prefix: U
- Existing Datasheet URL property:
https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/a2816c4ed217ec4d5244e8ffc8a185b2fadec1bb35aee6bcf56a06003071179b.pdf - Official TE datasheet located during review:
https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocFormat=pdf&DocLang=English&DocNm=MS5803-14BA&DocType=Data+Sheet&PartCntxt=MS580314BA01-50
The Datasheet URL property was already populated, so it was not replaced. The official TE product page for
MS580314BA01-00 appears to expose a related/wrong MS5803-01BA datasheet link, while the official TE MS580314BA01-50 page exposes the correct MS5803-14BA datasheet for this device family.Key Datasheet Specifications
- Pressure range: 0 to 14 bar / 1400 kPa / 203 psi absolute
- Proof / overpressure: 30 bar
- ADC: 24-bit delta-sigma ADC
- Pressure resolution: down to 0.2 mbar RMS at OSR 4096
- Supply voltage: 1.8 V to 3.6 V, 3.0 V typical
- Operating temperature: -40 °C to +85 °C
- Interfaces: I²C and SPI
- I²C clock: up to 400 kHz
- SPI clock: up to 20 MHz; SPI mode 0 / mode 3
- Typical current: 12.5 µA at 1 sample/s, OSR 4096; 1.4 mA peak during conversion; standby <0.15 µA max
- Recommended bypass capacitor: 100 nF from VDD to GND
- Package size: approximately 6.4 mm × 6.2 mm × 2.8 mm
Datasheet Pin Table vs Current Symbol
Table
| Pin | Datasheet name | Datasheet function/type | Current symbol terminal | Current pin type | Result |
|---|---|---|---|---|---|
| 1 | SCLK | Serial clock, input | SCLK | Input | Match |
| 2 | GND | Ground | GND | Ground | Match |
| 3 | CSB | Chip select active low, input | CSB | Input | Match |
| 4 | NC | No connect | NC | Not Connected | Match |
| 5 | VDD | Positive supply | VDD | Power Input | Match |
| 6 | PS | Protocol select SPI/I²C, input | PS | Input | Match |
| 7 | SDI/SDA | SPI data input / I²C data | SDI/SDA | Bi-Directional | Acceptable; datasheet table lists input for SPI SDI, but SDA is bidirectional in I²C use |
| 8 | SDO | Serial data output | SDO | Output | Match |
Footprint Cross-Check
Current footprint asset:
MS580314BA0100.kicad_mod.Observed footprint characteristics:
- 8 SMD rectangular pads.
- Body/fab outline approximately 6.4 mm × 6.2 mm.
- Most pads are 0.90 mm × 2.25 mm.
- One longer pad is 0.90 mm × 2.80 mm.
- Courtyard in imported footprint is approximately 11.4 mm × 8.2 mm from
(-4.8, -4.1)to(6.6, 4.1).
Potential footprint issue:
- The footprint pad geometry assigns the longer 2.80 mm pad to pad 3 / CSB in the imported KiCad module. The extracted reference land pattern data indicates the longer pad is associated with pin 7 / SDI/SDA. This should be manually checked against Figure 18 / package outline in the official TE datasheet before release.
- The footprint otherwise has the correct 8-pad SMD style and overall body dimensions for the package.
Mismatches / Flags
- Datasheet property is populated but not an official TE URL. It points to an uploaded PDF asset. This may be acceptable if the PDF is the official TE datasheet, but for traceability an official TE URL could be preferred.
- Footprint long-pad assignment needs verification. Current footprint appears to place the extended pad on pad 3 / CSB; reference extracted data suggests the extended pad should be pin 7 / SDI/SDA.
- No pin descriptions are stored as Pin Description properties. Pin names and pin types are present, but per-pin descriptions/functions are not populated.
- SDI/SDA type is marked Bi-Directional. This is appropriate for I²C SDA use, although the datasheet table labels the pin as serial data input for SPI.
Overall Result
The part metadata, symbol pin numbering, terminal names, and electrical pin types are mostly consistent with the MS5803-14BA datasheet. The main item to resolve before publishing or using this footprint in production is the footprint land-pattern orientation / extended-pad assignment, especially the apparent pad 3 vs pad 7 discrepancy.
Reviewed Part Information
Key Datasheet Specifications
Datasheet Pin Table vs Current Symbol
Footprint Cross-Check
Mismatches / Flags
Overall Result
