Part Review and Datasheet Update

adrian95

adrian95

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
a day

flux

4:18

Considering project updates.

Reviewing the bill of materials.

Analyzing the schematic.

Analyzing the PCB layout.

Analyzing the schematic.

Analyzing the PCB layout.

Looking for "MIMXRT1189XVM8C ordering information package code pin count ball map package dimensions operating temperature key features voltage supplies memory cores maximum frequency interfaces" in IMXRT1180EC.pdf

Looking for "MIMXRT1189XVM8C complete 289 MAPBGA ball assignment table pin names ball numbers power ground pins no connect pins" in IMXRT1180EC.pdf

Looking for "i.MX RT1180 MIMXRT1189XVM8C functional description Cortex-M7 Cortex-M33 clock frequency SRAM flash ethernet TSN CAN USB display camera security key specifications" in IMXRT1180EC.pdf

Running multiple web searches.

Found 1 results.

Found 1 results.

Reviewed the part: the Datasheet URL was already set to NXP’s official IMXRT1180EC datasheet, so I did not update it. The key mismatches are that Package or Case Code is incorrectly set to TO instead of the 289-ball MAPBGA/LFBGA289 package, and the 289 terminals match the expected pin count but are largely missing useful pin metadata like pin type/descriptions/sections. Full analysis is in MIMXRT1189XVM8C Part Review.
Fix part metadata
Verify footprint map
Add electrical specs
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MIMXRT1189XVM8C Part Review
Scope and method
Reviewed the current Flux part project metadata, schematic terminal list, footprint/pad count, assets, BOM, and the official NXP datasheet URL already present on the project. For part-project verification, the governing checks are: ensure the Datasheet URL is present, use the datasheet as the source of truth, verify exact pin count, and audit each terminal’s pin number/type/properties against the datasheet workflow.

Current project metadata

FieldCurrent valueReview
Project / partMIMXRT1189XVM8CMatches selected MPN
Manufacturer Part NumberMIMXRT1189XVM8COK
Manufacturer NameNXPOK
Datasheet URLhttps://www.nxp.com/docs/en/data-sheet/IMXRT1180EC.pdfAlready set; no web-update needed
Designator PrefixICAcceptable for an IC/MCU part
MountBaseOK as internal Flux property
Package or Case CodeTOMismatch — should reflect BGA package, not TO
Project descriptionLong truncated NXP-style descriptionUsable, but not ideal for library scanning
Datasheet / official part information
From NXP’s official i.MX RT1180 datasheet and NXP product/package listings:

Table

Datasheet itemExpected value for MIMXRT1189XVM8C
Familyi.MX RT1180 / RT1189 crossover MCU
Core architectureDual-core Arm Cortex-M7 + Cortex-M33
Main core frequencyCortex-M7 up to 800 MHz; Cortex-M33 up to 300 MHz per NXP datasheet extraction
Temperature gradeExtended industrial, -40 °C to +125 °C Tj
Silicon revisionC0
Package codeVM
Package289-ball MAPBGA / LFBGA289
Package versionSOT1534
Body / pitch14 mm × 14 mm, 0.8 mm pitch
I/O count173 I/O listed for VM package variants
Key memory512 KB CM7 TCM with ECC, 256 KB CM33 TCM with ECC, 768 KB OCRAM with ECC, Boot ROM
Major interfacesTSN Ethernet switch, EtherCAT target controller, USB 2.0 OTG + PHY, uSDHC, LPUART, LPI2C, I3C, LPSPI, CAN-FD, FlexIO, SAI, SPDIF, PDM, ADC, DAC, comparators
SecurityEdgeLock Secure Enclave, TrustZone-M, secure boot, PUF, crypto acceleration, tamper/security features
Schematic symbol / terminal audit
Current schematic summary:
  • 289 schematic components, all Terminal components.
  • 0 nets, which is normal for a standalone part project symbol definition.
  • Terminal part UID: 835bf3e1-33dd-41bb-a166-c0a31607d645.
  • Each sampled terminal includes a Pin Number property and a Symbol Pin Position property.
  • All sampled terminal Pin Type values are Unspecified.
  • No Pin Description, Section, Pin Group, Pin Orientation, or Sub-symbol Designator Suffix properties were visible in the sampled terminal data.
Key examples from the current terminal data:

Table

TerminalCurrent pin numberCurrent pin typeReview
VSS_1A1UnspecifiedPin exists; type should be Ground
VSS_17G11UnspecifiedPin exists; type should be Ground
DCDC__IN_1M5UnspecifiedPin exists; type should be Power In
DCDC__GND_4K9UnspecifiedPin exists; type should be Ground
USB1__DPE17UnspecifiedPin exists; type should be Bi-Directional / USB signal
USB1__DNpresent in layout and schematic summaryUnspecifiedPin exists; type should be Bi-Directional / USB signal
XTALI / XTALOpresentUnspecifiedPin exists; type should likely be Passive / Clock based on datasheet function
POR_BpresentUnspecifiedPin exists; type should be Input / reset-control
TEST__MODEpresentUnspecifiedPin exists; type should be Input / control
Symbol pin-count check
  • Datasheet package: 289-ball package.
  • Current schematic terminals: 289.
  • Result: Pin count matches at the package level.
Symbol property issues
This part is a complex MCU/SoC, so every terminal should have meaningful pin metadata: exact Pin Number, Pin Type, Pin Description, Section, Pin Group, Pin Orientation, and Sub-symbol Designator Suffix. The part-project rules specifically call for these properties on IC-style parts, and recommend sub-symbol grouping for large ICs.
Observed issue: the current symbol appears to have pin numbers, but the terminal metadata is incomplete because pin types are left as Unspecified and no pin descriptions/sections/groups were visible.
Footprint / PCB asset audit
Current PCB/layout summary:
  • Footprint asset: BGA289C80P17X17_1400X1400X152.kicad_mod
  • 3D model asset: MIMXRT1189XVM8C.stp
  • Symbol asset: MIMXRT1189XVM8C Symbol.svg
  • Layout contains:
    • 289 pads
    • 1 footprint
    • 1 model
    • Fabric/silkscreen/value/ref text items
Footprint name decoding:
  • BGA289 = 289-ball BGA
  • C80P = 0.80 mm pitch
  • 17X17 = 17 × 17 ball grid
  • 1400X1400 = 14.00 mm × 14.00 mm body
Footprint check result
  • Datasheet expected: 289-ball MAPBGA/LFBGA289, 14 mm × 14 mm, 0.8 mm pitch.
  • Footprint observed: BGA289, 17×17, 14.00 mm × 14.00 mm, 0.80 mm pitch.
  • Result: Footprint appears consistent with the package-level datasheet information.
BOM / pricing audit
  • BOM summary shows 0 unique parts / 0 instances, which is expected for a part project made of terminal elements rather than an assembled schematic.
  • Project pricing context has distributor entries from Arrow and Mouser, but stock is currently shown as 0 in the project context.

Mismatches and gaps flagged

SeverityIssueEvidenceRecommended correction
HighPackage or Case Code is set to TOProject property says TO; datasheet/package info says VM / LFBGA289 / MAPBGA289Update to LFBGA289 / MAPBGA289, 14x14mm, 0.8mm pitch or similar exact package string
HighAll sampled terminal Pin Type values are UnspecifiedSchematic terminal data shows Pin Type: Unspecified repeatedlyPopulate pin types from datasheet: VSS/DCDC_GND = Ground, VDD/NVCC/DCDC_IN = Power In, GPIO = Bi-Directional, reset/test/control = Input, crystal pins = Passive, etc.
MediumMissing visible pin descriptionsNo Pin Description visible in sampled terminal propertiesAdd short 3–6 word descriptions, e.g. “Digital ground”, “USB differential data positive”, “Core supply input”
MediumMissing visible section/group/orientation/sub-symbol metadataNot visible on sampled terminalsAdd metadata for a 289-pin MCU symbol: Power, GPIO banks, USB, DCDC, Clock, Control, Analog, Ethernet/EMC/SD blocks, etc.
MediumProject description is long/truncated and not a crisp component-library summaryCurrent description starts with imported datasheet text and truncatesUse a concise description such as: “Dual-core i.MX RT1189 crossover MCU, Cortex-M7 800 MHz + Cortex-M33, industrial Ethernet/TSN/EtherCAT, 289-ball MAPBGA, -40 °C to +125 °C.”
LowDatasheet extraction timeout from direct PDF toolDirect file/PDF extraction timed out onceURL itself is valid and official; no Datasheet property update required
  1. Update project metadata:
    • Package or Case Code: replace TO with a BGA-specific package string.
    • Consider adding Part Type = Microcontroller if not already present.
    • Consider adding Operating Temperature = -40°C to +125°C.
  2. Populate all terminal properties from the datasheet ball map:
    • Pin Type
    • Pin Description
    • Section
    • Pin Group
    • Pin Orientation
    • Sub-symbol Designator Suffix
  3. Re-run a full terminal-by-terminal verification against the NXP ball map after pin metadata is updated.
  4. Keep the current footprint asset unless a later pad geometry check finds dimensional/pad-size differences; the package-level footprint name and pad count currently look correct.
Bottom line
The part has the correct MPN, manufacturer, official datasheet URL, 289-terminal symbol count, and a footprint that appears to match the 289-ball 14 × 14 mm 0.8 mm-pitch BGA package. The main problems are metadata completeness and one clear package-property mismatch: Package or Case Code = TO should be corrected, and terminal pin types/descriptions/sections/groups should be populated from the datasheet.

    Scope and method

    Current project metadata

    Datasheet / official part information

    Schematic symbol / terminal audit

    Symbol pin-count check

    Symbol property issues

    Footprint / PCB asset audit

    Footprint check result

    BOM / pricing audit

    Mismatches and gaps flagged

    Recommended next actions

    Bottom line

Documents

    MIMXRT1189XVM8C Part Review

Assets

kicad_mod

MIMXRT1189XVM8C

BGA289C80P17X17_1400X1400X152.kicad_modFootprint
MIMXRT1189XVM8C-thumnb.png

MIMXRT1189XVM8C-thumnb.png

MIMXRT1189XVM8C-thumnbThumbnail
MIMXRT1189XVM8C

MIMXRT1189XVM8C

MIMXRT1189XVM8C Symbol.svgDefault
stp

MIMXRT1189XVM8C

MIMXRT1189XVM8C.stp3D Model

MIMXRT1189XVM8C

MIMXRT1189XVM8C thumbnail
ARM® Cortex®-M33F, ARM® Cortex®-M7F RT1180 Microcontroller IC 32-Bit Dual-Core 240MHz, 800MHz 160KB (160K x 8) ROM 289-LFBGA (14x14)
The MIMXRT1189XVM8C is a high-performance crossover microcontroller from the NXP Semiconductors i.MX RT1180 family, designed for advanced industrial and real-time embedded applications. It combines the real-time performance of a microcontroller with the connectivity and security features typically found in application processors. The device integrates dual Arm® Cortex® cores, high-speed networking with Time-Sensitive Networking (TSN), and advanced EdgeLock® security technology, making it ideal for industrial automation, robotics, motor control, automotive gateways, and Industry 4.0 systems.
Key Features Dual-core architecture: Arm® Cortex®-M7 core running up to 800 MHz Arm® Cortex®-M33 core running up to 300 MHz Integrated Gigabit TSN Ethernet switch for deterministic real-time networking Supports industrial Ethernet protocols including: EtherCAT PROFINET Ethernet/IP CC-Link IE Advanced EdgeLock® Secure Enclave for secure boot, cryptography, and tamper detection Up to 1.5 MB on-chip SRAM with ECC protection High-speed external memory interfaces Multiple communication peripherals: CAN-FD UART SPI I2C USB Ethernet High-resolution ADCs and advanced PWM/timer modules Supports MCUXpresso SDK and Zephyr RTOS Industrial temperature range operation from -40°C to +125°C BGA package optimized for compact industrial designs #Commonpartlibrary #Microcontroller #MIMXRT1189

Properties

MIMXRT1189XVM8C

NXP

Microcontroller

nxp.com/docs/en/data-sheet/IMXRT1180EC.pdf

IC

Base

LFBGA

creativecommons.org/licenses/by/4.0/

parametric-v1

Pricing & Availability

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