Part Data Review and Update

I reviewed the part project, corrected the datasheet link, and cross-checked the current metadata, symbol, and footprint against the LMS7002M datasheet. I followed the standard part-project audit flow of verifying the datasheet URL first, then checking metadata and terminal data against the datasheet pin/package info
Updated
  • I updated Datasheet URL to:
    • https://www.mouser.com/datasheet/2/982/LMS7002M-Data-Sheet-v3.1r00-1600568.pdf
Key specs confirmed from the datasheet

Table


ItemDatasheet value
MPNLMS7002M
ManufacturerLime Microsystems
FunctionField-programmable RF transceiver IC, dual transceiver for 2x2 MIMO
Frequency range100 kHz to 3.8 GHz
RF bandwidthUp to 160 MHz analog, up to 96 MHz digital
ADC/DAC12-bit ADC, 12-bit DAC
Package261-pin aQFN, 11.5 mm x 11.5 mm
Temperature range-40 C to +85 C
SuppliesInternal domains around 1.2 V / 1.25 V / 1.4 V / 1.8 V, digital peripheral IO up to 3.6 V
What matches
  • MPN matches: LMS7002M
  • Footprint naming is broadly consistent with the datasheet package:
    • current footprint: AQFN261_11P5X11P5_LIM
    • datasheet: 261-pin aQFN, 11.5 mm x 11.5 mm
  • Terminal count structure is broadly in-family for this package.
  • The symbol is already split into 3 sub-symbols, which is reasonable for a large RF IC.
Mismatches / issues flagged

Table


AreaFindingSeverity
Datasheet propertyThe previous datasheet link appeared to point to a different part; now correctedHigh
Project descriptionCurrent description reads more like a long marketing summary and includes wording like cellular/module language that does not cleanly match a concise IC part descriptionMedium
Package metadataI did not find a populated Package or Case Code project property, even though the datasheet clearly gives 261-pin aQFN, 11.5 x 11.5 mmMedium
Pin descriptionsNone of the terminals appear to have Pin Description populatedHigh
Ground pin typingSeveral ground-related terminals are typed as Power Out instead of GroundHigh
Numbering consistencyThe project mixes alphanumeric package coordinates with a numeric 262 pin for GND; datasheet package is 261-pinHigh
Symbol grouping qualitySub-symbols exist, but they are generic (LMS7002M_1_1, etc.) rather than functional groupsLow
Concrete pin-level checks
These specific pins were checked against the datasheet:

Table


TerminalCurrent projectDatasheet checkResult
pa1on_1Pin A7, type OutputA7, PA driver output RF padMatch
pa2op_1Pin A9, type OutputA9, PA driver output RF padMatch
pa2on_1Pin B10, type OutputB10, PA driver output RF padMatch
DIQ2_D10Pin P30, type Bi-DirectionalP30, DIQ bus bit 10, IOMatch
LOGIC_RESETPin V30, type Not ConnectedDatasheet says not usedMatch
CORE_LDO_ENPin U33, type Power InDatasheet says external enable control signalSuspicious
GND_TLOBUF_TRFPin C7, type Power OutDatasheet says TX LO buffer groundMismatch
DIGPRGND1/DIGPRGND2Pin T30, type Power OutDatasheet says pad-ring groundMismatch
Symbol / terminal audit summary
  • Total terminals: 261
  • Pin Number populated: 261/261
  • Pin Type populated: 261/261
  • Pin Description populated: 0/261
  • Sub-symbol count: 3
For IC-style parts, pin descriptions and structured grouping are part of a complete audit target, and every terminal should be checked against the datasheet rather than inferred
Main takeaway
The part is partially well-formed:
  • package family looks right
  • many pin names/numbers are already aligned
  • terminal count is close to the expected package structure
But it still has important quality issues:
  • ground pins mis-typed
  • no pin descriptions
  • inconsistent pin numbering around 262
  • metadata is incomplete/unclear in places
  • project description should be cleaned up
If you want, I can next fix the part metadata and terminal properties:
  • add Package or Case Code
  • rewrite the description
  • convert ground terminals from Power Out to Ground
  • populate concise Pin Description fields for the terminals that need them
Fix metadata and pins
Add package details
Check numbering issue

Set Datasheet URL to "https://www.mouser.com/datash..."

0:02

Set Datasheet URL to "https://www.mouser.com/datasheet/2/982/LMS7002M-Data-Sheet-v3.1r00-1600568.pdf"

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Documents

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    Assets

    LMS7002M

    LMS7002M

    LMS7002M LMS7002M_1_1 Symbol.svg
    LMS7002M-thumb.png

    LMS7002M-thumb.png

    LMS7002M-thumbThumbnail
    LMS7002M

    LMS7002M

    LMS7002M LMS7002M_3_1 Symbol.svg
    kicad_mod

    LMS7002M

    AQFN261_11P5X11P5_LIM.kicad_modFootprint
    LMS7002M

    LMS7002M

    LMS7002M LMS7002M_2_1 Symbol.svg
    step

    LMS7002M

    AQFN261_11P5X11P5_LIM.step3D Model

    LMS7002M

    LMS7002M thumbnail
    IC RF TxRx + MCU Cellular CDMA, GSM, HSPA, LTE, TD-SCDMA, WCDMA 100kHz ~ 3.8GHz 261-SMD Module The LMS7002M is a Field Programmable RF (FPRF) transceiver that can both transmit and receive radio signals over a very wide frequency range. It integrates most of the RF front-end and baseband processing functions into a single chip, minimizing the need for external components. Frequency range: 100 kHz to 3.8 GHz Architecture: Dual transceiver (2 TX + 2 RX) supporting 2×2 MIMO Bandwidth: Up to ~120–160 MHz RF bandwidth depending on configuration Technology: CMOS-based for low cost and power consumption Integrated blocks: ADCs & DACs (12-bit) LNAs and PA drivers Mixers, PLL synthesizers Filters and gain control On-chip DSP and microcontroller Transmit path: Digital baseband → DAC → filtering → RF upconversion → output Receive path: RF input → LNA → downconversion → filtering → ADC → digital processing This zero-IF (direct conversion) architecture simplifies design and supports wideband operation. #CommonPartsLibrary #IntegratedCircuit #LMS7002

    Properties

    LMS7002M

    Lime Microsystems Ltd

    Integrated Circuit

    IC

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