Part Data Review and Update

flux

I reviewed the part project, corrected the datasheet link, and cross-checked the current metadata, symbol, and footprint against the LMS7002M datasheet. I followed the standard part-project audit flow of verifying the datasheet URL first, then checking metadata and terminal data against the datasheet pin/package info
Updated
  • I updated Datasheet URL to:
    • https://www.mouser.com/datasheet/2/982/LMS7002M-Data-Sheet-v3.1r00-1600568.pdf
Key specs confirmed from the datasheet

Table

ItemDatasheet value
MPNLMS7002M
ManufacturerLime Microsystems
FunctionField-programmable RF transceiver IC, dual transceiver for 2x2 MIMO
Frequency range100 kHz to 3.8 GHz
RF bandwidthUp to 160 MHz analog, up to 96 MHz digital
ADC/DAC12-bit ADC, 12-bit DAC
Package261-pin aQFN, 11.5 mm x 11.5 mm
Temperature range-40 C to +85 C
SuppliesInternal domains around 1.2 V / 1.25 V / 1.4 V / 1.8 V, digital peripheral IO up to 3.6 V
What matches
  • MPN matches: LMS7002M
  • Footprint naming is broadly consistent with the datasheet package:
    • current footprint: AQFN261_11P5X11P5_LIM
    • datasheet: 261-pin aQFN, 11.5 mm x 11.5 mm
  • Terminal count structure is broadly in-family for this package.
  • The symbol is already split into 3 sub-symbols, which is reasonable for a large RF IC.
Mismatches / issues flagged

Table

AreaFindingSeverity
Datasheet propertyThe previous datasheet link appeared to point to a different part; now correctedHigh
Project descriptionCurrent description reads more like a long marketing summary and includes wording like cellular/module language that does not cleanly match a concise IC part descriptionMedium
Package metadataI did not find a populated Package or Case Code project property, even though the datasheet clearly gives 261-pin aQFN, 11.5 x 11.5 mmMedium
Pin descriptionsNone of the terminals appear to have Pin Description populatedHigh
Ground pin typingSeveral ground-related terminals are typed as Power Out instead of GroundHigh
Numbering consistencyThe project mixes alphanumeric package coordinates with a numeric 262 pin for GND; datasheet package is 261-pinHigh
Symbol grouping qualitySub-symbols exist, but they are generic (LMS7002M_1_1, etc.) rather than functional groupsLow
Concrete pin-level checks
These specific pins were checked against the datasheet:

Table

TerminalCurrent projectDatasheet checkResult
pa1on_1Pin A7, type OutputA7, PA driver output RF padMatch
pa2op_1Pin A9, type OutputA9, PA driver output RF padMatch
pa2on_1Pin B10, type OutputB10, PA driver output RF padMatch
DIQ2_D10Pin P30, type Bi-DirectionalP30, DIQ bus bit 10, IOMatch
LOGIC_RESETPin V30, type Not ConnectedDatasheet says not usedMatch
CORE_LDO_ENPin U33, type Power InDatasheet says external enable control signalSuspicious
GND_TLOBUF_TRFPin C7, type Power OutDatasheet says TX LO buffer groundMismatch
DIGPRGND1/DIGPRGND2Pin T30, type Power OutDatasheet says pad-ring groundMismatch
Symbol / terminal audit summary
  • Total terminals: 261
  • Pin Number populated: 261/261
  • Pin Type populated: 261/261
  • Pin Description populated: 0/261
  • Sub-symbol count: 3
For IC-style parts, pin descriptions and structured grouping are part of a complete audit target, and every terminal should be checked against the datasheet rather than inferred
Main takeaway
The part is partially well-formed:
  • package family looks right
  • many pin names/numbers are already aligned
  • terminal count is close to the expected package structure
But it still has important quality issues:
  • ground pins mis-typed
  • no pin descriptions
  • inconsistent pin numbering around 262
  • metadata is incomplete/unclear in places
  • project description should be cleaned up
If you want, I can next fix the part metadata and terminal properties:
  • add Package or Case Code
  • rewrite the description
  • convert ground terminals from Power Out to Ground
  • populate concise Pin Description fields for the terminals that need them
Fix metadata and pins
Add package details
Check numbering issue

No files yet

Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    LMS7002M

    LMS7002M LMS7002M_1_1 Symbol.svg
    LMS7002M-thumb.png

    LMS7002M-thumb.png

    LMS7002M-thumbThumbnail

    LMS7002M

    LMS7002M LMS7002M_3_1 Symbol.svg

    LMS7002M

    AQFN261_11P5X11P5_LIM.kicad_modFootprint

    LMS7002M

    LMS7002M LMS7002M_2_1 Symbol.svg
    LMS7002M

    LMS7002M

    AQFN261_11P5X11P5_LIM.step3D Model

    LMS7002M

    LMS7002M thumbnail
    IC RF TxRx + MCU Cellular CDMA, GSM, HSPA, LTE, TD-SCDMA, WCDMA 100kHz ~ 3.8GHz 261-SMD Module The LMS7002M is a Field Programmable RF (FPRF) transceiver that can both transmit and receive radio signals over a very wide frequency range. It integrates most of the RF front-end and baseband processing functions into a single chip, minimizing the need for external components. Frequency range: 100 kHz to 3.8 GHz Architecture: Dual transceiver (2 TX + 2 RX) supporting 2×2 MIMO Bandwidth: Up to ~120–160 MHz RF bandwidth depending on configuration Technology: CMOS-based for low cost and power consumption Integrated blocks: ADCs & DACs (12-bit) LNAs and PA drivers Mixers, PLL synthesizers Filters and gain control On-chip DSP and microcontroller Transmit path: Digital baseband → DAC → filtering → RF upconversion → output Receive path: RF input → LNA → downconversion → filtering → ADC → digital processing This zero-IF (direct conversion) architecture simplifies design and supports wideband operation. #CommonPartsLibrary #IntegratedCircuit #LMS7002

    Properties

    LMS7002M

    Lime Microsystems Ltd

    Integrated Circuit

    mouser.com/datasheet/2/982/LMS7002M-Data-Sheet-v3.1r00-1600568.pdf

    IC

    creativecommons.org/licenses/by/4.0/

    Pricing & Availability

    DPN

    Stock

    Qty 1

    1

    0

    $190.5737

    1

    0

    $150.97

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