802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount
The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements.
Key Features
Integrated Bluetooth® Low Energy (BLE) 5.x compliant module
Based on Nordic Semiconductor nRF52 series SoC
Built-in chip antenna (no external antenna required)
Ultra-low power consumption suitable for battery-powered devices
Integrated RF matching and shielding
Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer)
Compact surface-mount package
Pre-certified RF module (reduces certification effort)
Electrical Characteristics
Supply Voltage
Operating Voltage: 1.7 V to 3.6 V
Current Consumption
TX Mode: ~5–10 mA (depending on output power)
RX Mode: ~5 mA
Sleep Mode: < 2 µA
RF Characteristics
Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz)
Output Power: up to +4 dBm
Sensitivity: approx. -96 dBm
Interfaces
UART
SPI
I²C (TWI)
GPIO (multiplexed)
ADC inputs
PWM
Mechanical Specifications
Package Type: Surface Mount Module (SMD)
Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.)
Integrated antenna and shielding
Environmental Ratings
Operating Temperature: -40°C to +85°C
Storage Temperature: -40°C to +125°C
Compliance & Certifications
Bluetooth SIG qualified
FCC / IC / CE (module-level certification, varies by variant)
RoHS compliant
Applications
IoT devices
Wearables
Smart home products
Wireless sensors
Industrial monitoring systems
Pin Configuration (Summary)
Power: VDD, GND
Communication: UART, SPI, I²C
GPIOs: Configurable digital I/O
RF: Integrated antenna (no RF pin required)
Design Considerations
Follow recommended PCB layout for antenna clearance
Avoid copper under antenna region
Provide stable power supply with proper decoupling capacitors
Ensure proper grounding for RF performance
