Part Review and Datasheet Verification
Populate all terminal pin types and descriptions from the ISSI datasheet. and fix B1 mismatch
Thought for 6 sec
I’ll update the terminal metadata from the ISSI datasheet and correct B1 so the 3.0V BLL variant treats it as RFU/no-connect.
Thought for 19 sec
I confirmed the current terminal list: B1 is still labeled CK#, and all 24 terminals need datasheet-derived pin metadata.
Worked for 1 min 13 sec
Updated all 24 terminal pin types and descriptions from the ISSI datasheet, using Flux-standard pin type values. Fixed the B1 mismatch by renaming
CK# to RFU_6 and marking it Not Connected with a BLL-specific RFU description.Open items:
- None for the requested metadata update.
Suggested next steps:
- Verify the rendered symbol still has the desired visual grouping after
CK#→RFU_6. - Re-check the footprint pad geometry/pitch before publishing the part.
Verify symbol and footprint
Check visual grouping
Inspect footprint geometry
Run ERC and DRC
Update review document
Refine this doc
Ask about this doc
Part Review: IS66WVH64M8DBLL-166B1LI-TR
Reviewed part information
- Manufacturer: Integrated Silicon Solution Inc. (ISSI)
- MPN: IS66WVH64M8DBLL-166B1LI-TR
- Description in project: DRAM 512Mb, HyperRAM, 64Mbx8, 3.0V, 166MHz, 24-ball TFBGA, RoHS
- Part type: Integrated Circuits
- Pin / terminal count in project: 24
- Existing Datasheet URL: https://www.mouser.com/datasheet/2/198/66_67WVH64M8DALL_BLL-3392684.pdf
- Official ISSI datasheet found: https://www.issi.com/WW/pdf/66-67WVH64M8DALL-BLL.pdf
Note: the part already had a Datasheet URL before review, so the existing datasheet property was not required to be populated from scratch. The official ISSI URL should be preferred if project-level Datasheet URL editing is available.
Datasheet key specs
- Device family: IS66/67WVH64M8DALL/BLL 512Mb HyperRAM
- Organization: 64M x 8
- Interface: HyperBus, 8-bit DDR data bus, CS#, CK/CK#, RWDS, RESET#
- Voltage variant for BLL: 3.0V device; VCC/VCCQ operating range 2.7V to 3.6V
- Speed grade: 166MHz for this MPN
- Package: B1 = 24-ball TFBGA, 6mm x 8mm body, 5 x 5 ball array, 1.0mm pitch
- Temperature code: I = Industrial, -40°C to +85°C
- Compliance: green/RoHS, halogen-free, TSCA compliant per datasheet ordering information
- Active read current at 3.6V, 200MHz: max 40mA
- Active write current at 3.6V, 200MHz: max 35mA
- Standby current over -40°C to +85°C: max 1500µA; +105°C grade max 1800µA
- Reset current: max 20mA
- Power-up wait: up to 150µs from VCC/VCCQ valid and RESET# high to first access
Symbol / terminal cross-check
Project terminals present:
- Control/clock: CS# A3, RESET# A4, CK B2, CK# B1
- Data/strobe: DQ0 D3, DQ1 D2, DQ2 C4, DQ3 D4, DQ4 D5, DQ5 E3, DQ6 E2, DQ7 E1, RWDS C3
- Power: VCC B4, VCCQ D1/E4, VSS B3, VSSQ C1/E5
- RFU: A2, A5, B5, C2, C5
Datasheet-confirmed signal descriptions:
- CS#: slave input chip select, active low
- CK/CK#: clock input; differential clock optional, single-ended CK supported
- DQ[7:0]: bidirectional command/address/data bus
- RWDS: bidirectional read/write data strobe and write data mask
- RESET#: input with internal weak pull-up
- VCC: array/core power
- VCCQ: I/O power; must be same voltage as VCC
- VSS/VSSQ: grounds
- RFU: no-connect/reserved; leave unconnected and do not use as routing channel
Footprint cross-check
- Footprint pad count: 24 pads present in layout.
- Datasheet package: 24-ball FBGA/TBGA-style 5x5 array with one missing ball site, 1.0mm pitch, 6mm x 8mm body.
- Layout shows a BGA-style body outline and 24 pad nodes. The available flat layout rendering did not expose each pad center/diameter, so the exact 1.0mm pitch and ball diameter were not fully machine-verified from the layout data.
Mismatches / issues flagged
- B1 assignment mismatch for this exact BLL 3.0V part: the datasheet note states B1 is CK# on the 1.8V device, but B1 is RFU on the 3.0V device. The project currently defines B1 as
CK#. For IS66WVH64M8DBLL-166B1LI-TR, B1 should be treated as RFU/no-connect unless ISSI provides a variant-specific drawing contradicting this note. - Pin descriptions are missing: all terminals show
Pin Type: Unspecifiedand noPin Descriptionproperty. These should be populated from Table 3.1: input, bidirectional I/O, power, ground, or no-connect/RFU. - Datasheet URL is distributor-hosted: the existing project Datasheet URL points to Mouser. An official ISSI PDF exists and should be preferred for the Datasheet URL when editing the part-level property is available.
- RFU handling should be explicit: RFU balls should be named/typed as no-connect and documented as “leave unconnected; do not route through for future compatibility.”
- Footprint dimensions only partially verified: pad count and body outline are consistent with 24-ball 6mm x 8mm package, but exact pad positions/pitch were not visible in the layout inspection output.
Recommended corrections
- Rename/reclassify B1 from
CK#to an RFU/no-connect terminal for the BLL 3.0V part, or verify with ISSI if differential clock on B1 is actually bonded for this ordering code. - Populate
Pin TypeandPin Descriptionfor every terminal based on datasheet Table 3.1. - Prefer the official ISSI datasheet URL: https://www.issi.com/WW/pdf/66-67WVH64M8DALL-BLL.pdf
- Re-run footprint inspection with detailed pad geometry visible before publishing, confirming 5x5 1.0mm-pitch array and 6mm x 8mm body.
Reviewed part information
Datasheet key specs
Symbol / terminal cross-check
Footprint cross-check
Mismatches / issues flagged
Recommended corrections
