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    Assets

    IM69D130V01XTSA1

    IM69D130V01XTSA1

    IM69D130V01XTSA1 Symbol.svgDefault
    kicad_mod

    MIC_IM69D130V01XTSA1.kicad_mod

    FP_MIC_IM69D130V01XTSA1Footprint
    IM69D130V01XTSA1.png

    IM69D130V01XTSA1.png

    IM69D130V01XTSA1Thumbnail
    step

    IM69D130V01XTSA1.step

    3D_IM69D130V01XTSA13D Model

    IM69D130V01XTSA1

    IM69D130V01XTSA1 thumbnail
    20 Hz ~ 20 kHz Digital, PDM Microphone MEMS (Silicon) 1.62 V ~ 3.6 V Omnidirectional (-36dB ±1dB @ 94dB SPL) Solder Pads
    The IM69D130V01XTSA1 is a high-performance digital MEMS microphone designed for applications requiring compact size, low power consumption, and reliable acoustic performance. The device integrates a MEMS sensing element with signal conditioning and digital output functionality within a surface-mount package suitable for automated assembly processes.
    The component is intended for use in voice-enabled systems, consumer electronics, industrial equipment, communication devices, and embedded audio applications where consistent sensitivity, low noise operation, and environmental robustness are required. The microphone supports digital audio interfacing and is optimized for far-field voice capture and speech recognition environments.
    The device construction is designed to provide stable operation under standard environmental and mechanical conditions. It is compatible with modern PCB manufacturing processes and supports integration into space-constrained electronic assemblies. Electrical and acoustic characteristics are engineered to maintain reliable performance across varying operating conditions.
    The component complies with standard electronic manufacturing and handling requirements for moisture sensitivity, electrostatic discharge protection, and reflow soldering compatibility. Proper PCB layout, grounding practices, and acoustic port alignment are recommended to achieve optimal system-level performance.

    Properties

    Microphone

    Infineon Technologies

    IM69D130V01XTSA1

    MK

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