Part Specification Review and Mismatch Check

flux

Reviewed the part information for JAE IL-2P-S3FP2-1.
Datasheet
  • A Datasheet URL is already set, so I did not overwrite it.
  • Existing URL points to a stored PDF asset for the part.
Key specs confirmed
  • Manufacturer: JAE / Japan Aviation Electronics
  • MPN: IL-2P-S3FP2-1
  • Type: 2-position wire-to-board pin header
  • Series: IL Series
  • Pitch: 2.5 mm
  • Rows: 1
  • Mounting: Right-angle through-hole
  • Contact type: Male pin
  • Rated current: 3 A
  • Housing: PA66 / Nylon 66, UL94V-0
  • Contact material: Brass
  • Finish: Gold over nickel
  • Body approx.: 5.5 mm L × 12.8 mm W × 6.5 mm H
  • Recommended PCB thickness: 1.6–2.4 mm
Symbol / pin review
  • Symbol has 2 terminals, matching the datasheet’s 2 positions.
  • Pin numbers 1 and 2 match the expected connector pin count.
  • Issue flagged: the live schematic shows both terminal Pin Type values as Unspecified. For a passive connector/header, these should generally be Passive.
Footprint review
  • Footprint exists and has 2 pads, matching the datasheet.
  • Footprint asset name indicates a right-angle 1×2, 2.50 mm pitch style: SHDRRA2W64P0X250_1X2_550X1280X650P.kicad_mod.
  • The accessible layout data confirms pads 1 and 2, but did not expose pad geometry/drill dimensions directly, so I could not fully verify hole size, pad size, or exact pad spacing from the live PCB data.
Mismatches / gaps
  1. Pin Type mismatch/gap: pins are currently shown as Unspecified instead of Passive in the live schematic.
  2. No explicit Package property found in the indexed metadata; footprint asset exists, but package metadata could be clearer.
  3. No explicit part description field found beyond the project description.
  4. Footprint geometry could not be fully cross-checked because pad dimensions/drill sizes were not exposed by the available layout data.
Fix pin types
Add missing metadata
Run full review
Verify footprint geometry
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    Assets

    IL-2P-S3FP2-1-thumb.png

    IL-2P-S3FP2-1-thumb.png

    IL-2P-S3FP2-1-thumbThumbnail
    kicad_mod

    IL-2P-S3FP2-1

    SHDRRA2W64P0X250_1X2_550X1280X650P.kicad_modFootprint
    stp

    IL-2P-S3FP2-1

    IL-2P-S3FP2-1.stp3D Model
    IL-2P-S3FP2-1

    IL-2P-S3FP2-1

    IL-2P-S3FP2-1 Symbol.svgDefault

    IL-2P-S3FP2-1

    IL-2P-S3FP2-1 thumbnail
    Headers & Wire Housings HEADER 2POS 2.5MM
    Connector Header Through Hole, Right Angle 2 position 0.098" (2.50mm)
    IL-2P-S3FP2-1 is a 2-position, 2.50 mm pitch right-angle through-hole header connector from the IL Series by JAE Electronics. It is designed for board-to-wire connections in compact electronic equipment and features a friction-lock mechanism to ensure reliable cable retention. The connector uses gold-plated brass contacts for enhanced conductivity and corrosion resistance, making it suitable for industrial, consumer, and embedded electronic applications.
    Key Features 2-position male header connector 2.50 mm pitch Right-angle through-hole mounting Board-to-wire connection style Friction-lock mating system for secure connection Gold-plated brass contacts for reliable electrical performance Shrouded design with one protective wall Polyamide (PA66/Nylon 6/6) housing UL94 V-0 flame-retardant material Compact single-row configuration Operating temperature range: -40°C to +85°C RoHS compliant and lead-free version available Suitable for power and signal connections in electronic equipment
    #CommonPartsLibrary #JAE #Connector #HeaderConnector #WireToBoard #ThroughHole #RightAngleConnector #ILSeries #2p50mmPitch #FrictionLock #ElectronicComponents #EmbeddedSystems #PCBDesign #HardwareDesign #RoHSCompliant

    Properties

    IL-2P-S3FP2-1

    JAE

    Connectors

    componentsearchengine.com/Datasheets/1/IL-2P-S3FP2-1.pdf

    J

    Wire

    parametric-v1

    creativecommons.org/licenses/by/4.0/

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