Part Information Review and Mismatch Check

adrian95

adrian95

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I reviewed the project metadata, symbol terminals, footprint/assets, and the official onsemi datasheet already set on the part, so no Datasheet URL update was needed. Main issues: the Part Type is misclassified, all terminal Pin Types are still Unspecified, Package or Case Code is missing, and the EP/Pin 19 terminal is a potential mismatch because the datasheet pin table lists 18 leads. Full review is in FUSB340TMX Part Information Review.
Fix part metadata
Fix EP mismatch
Run ERC/DRC
Check land pattern

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FUSB340TMX Part Information Review
Scope
Reviewed available project information for the published part project FUSB340TMX against the official onsemi datasheet already set in the project property:
No web search/update was needed because the Datasheet URL property is already populated and points to the official onsemi PDF.
Project Metadata Currently Available

Table

FieldProject valueDatasheet value / check
Manufacturer Part NumberFUSB340TMXMatches
Manufacturer NameON SemiconductorDatasheet branding is onsemi / Semiconductor Components Industries, LLC; acceptable but could be normalized to onsemi
Designator PrefixICAcceptable, though many Flux IC parts use U by convention
Datasheet URLhttps://www.onsemi.com/pub/Collateral/FUSB340-D.PDFOfficial onsemi datasheet URL
Part TypeElectromechanical ComponentsMismatch / weak classification: datasheet describes this as a USB 3.1 SuperSpeed 2:1 data switch IC, not an electromechanical component
DescriptionUSB 3.1 SuperSpeed 5Gbps and 10 Gbps Switch; 10 GHz Typical Bandwidth; -1.0 dB Typical Insertion Loss at 2.5 GHz; Low Active Power of 12 uA Typical; Low Shutdown Power of < 1 uA Max.; 2 kV HBM ESD Protection; Small Packaging, 18 Lead TMLP; Wide VDD Operating Range, 1.5 V-5.0 VMatches key datasheet claims, with minor formatting issue: “and10” missing a space
Datasheet-Derived Key Specs

Table

SpecDatasheet value
FunctionUSB 3.1 SuperSpeed 2:1 data switch for 5 Gbps and 10 Gbps data, targeting mobile devices and USB Type-C reversible cable applications
Package18-Lead Quad Ultra-ultrathin Molded Leadless Package, TMLP / X2QFN18, Case 722AB
Body size2.0 mm × 2.8 mm × 0.375 mm
Pin count18 package leads
Operating temperature−40°C to +85°C
VDD operating range1.5 V to 5.0 V
Control input voltage0 V to 5.0 V for S and OE
Switch I/O voltage0 V to 2.0 V
Typical bandwidth10 GHz differential, −3 dB
Typical insertion loss−1.0 dB at 2.5 GHz; −1.8 dB at 5.0 GHz
Active current12 µA typical, 30 µA max at 5.0 V
Shutdown / high-Z current< 1 µA max
ESD2 kV HBM all pins; switch pins: IEC contact 8 kV, air 15 kV; CDM 1 kV
Shipping5,000 / Tape & Reel
Datasheet Pin Table vs Schematic Symbol

Table

Pin #Datasheet pin nameDatasheet function/typeProject terminalProject Pin TypeResult
1SSTXCOM−SuperSpeed TX− Common / switchSSTXCOM-UnspecifiedName matches; type missing
2SSTXCOM+SuperSpeed TX+ Common / switchSSTXCOM+UnspecifiedName matches; type missing
3GNDGround, connected to die attach padGND_1UnspecifiedFunction matches; name suffix differs; type missing
4SSRXCOM−SuperSpeed RX− Common / switchSSRXCOM-UnspecifiedName matches; type missing
5SSRXCOM+SuperSpeed RX+ Common / switchSSRXCOM+UnspecifiedName matches; type missing
6SSwitch select inputSUnspecifiedName matches; should be Input
7OEOutput enable input, 0 = enabled, 1 = disabled~OEUnspecifiedFunctional match likely; project uses active-low notation while datasheet text extraction shows OE; should be Input
8SSRX2+SuperSpeed RX2+ / switchSSRX2+UnspecifiedName matches; type missing
9SSRX2−SuperSpeed RX2− / switchSSRX2-UnspecifiedName matches; type missing
10SSRX1+SuperSpeed RX1+ / switchSSRX1+UnspecifiedName matches; type missing
11SSRX1−SuperSpeed RX1− / switchSSRX1-UnspecifiedName matches; type missing
12GNDGround, connected to die attach padGND_2UnspecifiedFunction matches; name suffix differs; type missing
13SSTX2+SuperSpeed TX2+ / switchSSTX2+UnspecifiedName matches; type missing
14SSTX2−SuperSpeed TX2− / switchSSTX2-UnspecifiedName matches; type missing
15SSTX1+SuperSpeed TX1+ / switchSSTX1+UnspecifiedName matches; type missing
16SSTX1−SuperSpeed TX1− / switchSSTX1-UnspecifiedName matches; type missing
17VDDDevice powerVDDUnspecifiedName matches; should be Power In
18GNDGroundGND_3UnspecifiedFunction matches; name suffix differs; type missing
—Exposed / die attach padDatasheet notes GND pins are connected to die attach pad; package drawing notes exposed pad coplanarityEP, Pin Number 19UnspecifiedPotential mismatch: project exposes EP as schematic pin 19, but datasheet pin table lists only 18 pins and does not list EP as numbered pin 19
Footprint / Asset Review
Available assets:

Table

AssetTypeRole
FUSB340TMX.kicad_modKiCad footprintMarked as footprint
FUSB340TMX.stpSTEP modelMarked as 3D model
FUSB340TMX Symbol.svgSVGDefault symbol and thumbnail
Layout contains pads for all 18 named datasheet pins plus an EP pad/terminal. The presence of an exposed pad in the footprint is mechanically plausible because the package drawing references an exposed pad and the GND pins are connected to the die attach pad. However, exposing it as schematic Pin Number 19 is potentially inconsistent unless the footprint/package source explicitly treats the exposed pad as an electrical pad requiring a symbol terminal.
The footprint package family appears consistent with the datasheet: X2QFN18 / TMLP, 2.0 mm × 2.8 mm, 0.4 mm pitch. A deeper dimensional audit would require inspecting the actual pad geometry from the footprint asset against the recommended mounting footprint dimensions.
Main Mismatches / Issues Flagged
  1. Part Type is incorrect or overly broad
    Current value: Electromechanical Components
    Recommended value: something like USB Switch, Analog Switch, or Interface IC depending on allowed Flux taxonomy.
  2. All schematic terminal Pin Type properties are Unspecified
    Recommended corrections:
    • VDD: Power In
    • GND_1, GND_2, GND_3: Ground
    • S, ~OE/OE: Input
    • SuperSpeed differential switch pins: Passive or Bi-Directional; Passive is usually the safest Flux type for high-speed analog switch paths.
    • EP: Ground if retained as an exposed/die-attach pad terminal.
  3. Potential extra schematic terminal: EP / Pin Number 19
    Datasheet pin table lists 18 leads only. The package has an exposed/die attach pad, but the extracted datasheet text does not list it as numbered pin 19. This should be verified against the original package drawing/footprint source before keeping it as a visible schematic terminal.
  4. Ground terminal naming differs from datasheet
    Project uses GND_1, GND_2, GND_3 for pins 3, 12, 18. This is acceptable for unique terminal designators, but pin descriptions should clearly state Ground.
  5. OE label notation needs confirmation
    Project uses ~OE, while extracted text shows OE with function “0 = switches enabled, 1 = switches disabled.” The active-low notation is functionally meaningful, but the exact datasheet symbol may use an overbar that text extraction flattened. Keep ~OE only if Flux convention intends to preserve active-low notation.
  6. Package metadata property is missing
    Add or set Package or Case Code to: X2QFN18 / 18-Lead TMLP, Case 722AB, 2.0 mm × 2.8 mm × 0.375 mm.
  7. Useful electrical properties are missing
    Consider adding system properties:
    • Operating Voltage: 5.0 V max recommended VDD
    • Operating Temperature: −40°C to +85°C
    • Implementation Details: concise notes about VDD range, switch I/O voltage max, control input range, and exposed pad/GND handling.
  • Update Part Type and add missing package/electrical properties.
  • Set Pin Type, Pin Description, Section, Pin Group, and Pin Orientation for all terminals.
  • Decide whether EP should remain a schematic terminal. If retained, mark it as Ground and document that it represents the exposed/die-attach pad tied to ground.
  • Optionally normalize Manufacturer Name to onsemi and fix the description spacing typo.

  • Scope

  • Project Metadata Currently Available

  • Datasheet-Derived Key Specs

  • Datasheet Pin Table vs Schematic Symbol

  • Footprint / Asset Review

  • Main Mismatches / Issues Flagged

  • Recommended Next Actions

Documents

  • FUSB340TMX Part Information Review

Assets

stp

FUSB340TMX

FUSB340TMX.stp3D Model
FUSB340TMX-thumb.png

FUSB340TMX-thumb.png

FUSB340TMX-thumbThumbnail
kicad_mod

FUSB340TMX

FUSB340TMX.kicad_modFootprint
FUSB340TMX

FUSB340TMX

FUSB340TMX Symbol.svgDefault

FUSB340TMX

FUSB340TMX thumbnail
USB Switch USB 3.1 USB Interface 18-TMLP (2x2.8)
The FUSB340 is a 2:1 data switch for USB SuperSpeed Gen1 and Gen2, 5 Gbps and 10 Gbps data. It is targeted at the mobile device market and for use in Type−C applications where a reversible cable requires a switch. The FUSB340 data switch offers superior performance various high speed data transmission protocols: • USB 3.1 SuperSpeed (Gen 2), 10 Gbps • PCI Express, Gen 3 • SATA • Fibre Channel • Display Port 1.3 Features • 10 GHz Typical Bandwidth • USB 3.1 SuperSpeed 5 Gbps and10 Gbps Switch • −1.0 dB Typical Insertion Loss at 2.5 GHz • Low Active Power of 12 A Typical • Low Shutdown Power of < 1 A Max. • 2 kV HBM ESD Protection • Small Packaging, 18 Lead TMLP • Wide VDD Operating Range, 1.5 V−5.0 V • This is a Pb−Free Device
#CommonPartsLibrary #IntegratedCircuit #Controller #FUSB340

Properties

FUSB340TMX

onsemi

Integrated Circuit

onsemi.com/pub/Collateral/FUSB340-D.PDF

IC

creativecommons.org/licenses/by/4.0/

parametric-v1

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