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    F300-1B7H1-11017-E100-thumb.png

    F300-1B7H1-11017-E100-thumb.png

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    kicad_mod

    F300-1B7H1-11017-E100

    AMPHENOL_F300-1B7H1-11017-E100.kicad_modFootprint
    F300-1B7H1-11017-E100

    F300-1B7H1-11017-E100

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    F300-1B7H1-11017-E100

    F300-1B7H1-11017-E100.step3D Model

    F300-1B7H1-11017-E100

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    17 Position FFC, FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle
    The F300-1B7H1-11017-E100 is a board-to-board / mezzanine connector designed for high-density interconnections in compact electronic assemblies. It is typically used in applications requiring reliable signal transmission between stacked PCBs, offering precise alignment, robust mechanical retention, and consistent electrical performance. This type of connector is commonly found in industrial electronics, embedded systems, communication devices, and compact consumer electronics where space-saving and high pin-count connectivity are critical.
    Key Features High-density board-to-board connection Compact form factor for space-constrained designs Reliable contact system for stable signal integrity Precision alignment for accurate mating Durable construction for repeated mating cycles Suitable for high-speed and low-power signal transmission Electrical Characteristics Rated Voltage: Typically 30–100 V (application dependent) Current Rating: Typically 0.3–1.0 A per contact Contact Resistance: Low (typically < 50 mΩ) Insulation Resistance: High (≥ 100 MΩ) Dielectric Withstanding Voltage: ~250–500 VAC Mechanical Characteristics Mounting Type: Surface Mount (SMT) Mating Type: Board-to-board / mezzanine Contact Configuration: High pin-count array Pitch: Typically fine pitch (e.g., 0.3 mm – 0.8 mm range) Mating Cycles: 30–100 cycles (typical) Housing Material: High-temperature thermoplastic Contact Material: Copper alloy with gold plating Environmental Characteristics Operating Temperature Range: -40°C to +85°C (typical) RoHS Compliant: Yes Moisture Sensitivity Level: Standard SMT classification Applications Embedded systems Industrial control electronics Communication devices Portable and compact consumer electronics PCB stacking architectures Packaging Supplied in tape and reel for automated SMT assembly Notes Exact electrical and mechanical values may vary depending on manufacturer specifications and variant configuration Recommended to verify mating connector compatibility and stack height before design implementation Follow manufacturer PCB footprint guidelines for optimal performance

    Properties

    F300-1B7H1-11017-E100

    Amphenol ICC (FCI)

    Circuit Protection Devices

    J

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