Part Review and Datasheet Verification

I’ll update each terminal with datasheet-based pin metadata: number, name/designator, type, functional group/section, and description, then verify the schematic properties.
Metadata was applied; I’m normalizing a few fields to Flux standard property names/options where possible while keeping the datasheet grouping intent.
Added datasheet-based metadata to all 22 E04-400M16S terminals and verified the updates. Each pin now has Pin Number, Pin Role/name, Pin Type, Pin Group, Section, and Pin Description; I used one primary group per pin and normalized pin types to Flux standard values where available.
Open items:
  • The symbol is still represented as 22 separate Terminal components rather than one module component.
  • SPI MISO/MOSI directions follow the EBYTE datasheet wording, which should be rechecked against host/module convention during integration.
Suggested next steps:
  1. Convert these terminals into a single 22-pin module symbol.
  2. Correct and verify the footprint pad coordinates against the official EBYTE package.
  3. Add VCC decoupling and RF/antenna layout constraints.
Fix symbol and footprint
Create module symbol
Fix footprint pads
Add support circuitry
Run design review
GND
Pin Number
5
GND
Pin Number
11
SCLK
Pin Number
18
GND
Pin Number
2
GPIO0
Pin Number
13
GND
Pin Number
12
GND
Pin Number
20
GND
Pin Number
1
GND
Pin Number
22
MOSI
Pin Number
17
VCC
Pin Number
9
SDN
Pin Number
14
NC
Pin Number
15
GND
Pin Number
4
CSN
Pin Number
19
GPIO1
Pin Number
6
ANT
Pin Number
21
GPIO3
Pin Number
8
GND
Pin Number
3
MISO
Pin Number
16
GND
Pin Number
10
GPIO2
Pin Number
7

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Part Information Review — E04-400M16S
Date: 2026-06-23
Scope
Reviewed available project part information for EBYTE / Chengdu Ebyte E04-400M16S, including MPN, manufacturer, package/mechanical data, pin count, description, project properties, schematic terminals, symbol pin descriptions, and PCB footprint geometry. Cross-check source was the project Datasheet URL plus official EBYTE/CDEBYTE web product pages found during review.
Current Project Part Information
Project-level properties
Schematic representation
  • Current schematic is represented as 22 separate Terminal components rather than one integrated module symbol.
  • All 22 terminal entries use the same Terminal part UID.
  • No nets are currently defined.
  • Pin numbers present: 1 through 22.
  • Pin names/designators present: GND pins, GPIO0, GPIO1, GPIO2, GPIO3, VCC, SDN, NC, MISO, MOSI, SCLK, CSN, ANT.
PCB footprint representation
  • Footprint uses 22 top-layer rectangular SMD pads.
  • Global pad rule: rectangular pad, 1.7 mm × 1.0 mm.
  • Body/silk outline: rectangle from approximately -7,-10 mm to +7,+10 mm, matching a 14 mm × 20 mm module outline.
  • Pad placement is incomplete/irregular: most pads are positioned, but SDN has no explicit position rule and computes to 0,0.
Datasheet / Official Source Key Specs
  • Part: E04-400M16S
  • Manufacturer: Chengdu Ebyte Electronic Technology Co., Ltd / EBYTE
  • Core RF IC: ST S2-LP / S2-LPQTR
  • Function: 433/470 MHz low-power SMD RF transceiver module, SPI-controlled
  • Frequency range: 413–479 MHz
  • Typical frequency: 433 MHz
  • Operating voltage: 2.5–3.6 V, typ. 3.3 V; ≥3.3 V recommended for guaranteed output power
  • Logic level: 3.3 V; 5 V TTL risks damage unless protected
  • TX current: typ. 10 mA at 10 dBm
  • RX current: typ. 7 mA
  • Sleep current: typ. 2.5 nA
  • Max TX power: up to 16 dBm
  • Receiver sensitivity: down to -130 dBm at 0.3 kbps; commonly -100 to -120 dBm depending conditions
  • Air data rate: 0.3–250 kbps depending modulation
  • Modulations: 2(G)FSK, 4(G)FSK, OOK, ASK / SIGFOX support noted
  • SPI interface: 0–10 Mbps
  • Operating temperature: -40 to +85 °C
  • Module size: 20 mm × 14 mm
  • Package/interface: SMD castellated/stamp-hole, 1.27 mm pitch
  • RF interface: stamp-hole ANT and/or IPEX, about 50 Ω
  • Recommended hardware notes: add ceramic filter capacitor at VCC; keep high-frequency/power routing away from/under module; use stable low-ripple supply; keep antenna exposed and avoid metal enclosure shielding.
Datasheet Pinout Cross-Check

Table


PinDatasheet nameDatasheet directionDatasheet functionProject terminal presentMatch
1GNDGroundGNDOK
2GNDGroundGNDOK
3GNDGroundGNDOK
4GNDGroundGNDOK
5GNDGroundGNDOK
6GPIO1I/OConfigurable GPIOGPIO1OK
7GPIO2I/OConfigurable GPIOGPIO2OK
8GPIO3I/OConfigurable GPIOGPIO3OK
9VCC2.5–3.6 V supplyVCCOK
10GNDGroundGNDOK
11GNDGroundGNDOK
12GNDGroundGNDOK
13GPIO0I/OConfigurable GPIOGPIO0OK
14SDNInputShutdown controlSDNOK name, but footprint pad position missing
15NCNo connectNCOK
16MISOInputSPI data input pin per datasheet wordingMISOOK name; verify host/module direction convention before schematic use
17MOSIOutputSPI data output pin per datasheet wordingMOSIOK name; verify host/module direction convention before schematic use
18SCLKInputSPI clock inputSCLKOK
19CSNInputSPI chip selectCSNOK
20GNDGroundGNDOK
21ANT50 Ω antenna interfaceANTOK
22GNDGroundGNDOK
Mismatches / Issues Flagged
  1. Symbol architecture mismatch: The part is modeled as 22 independent Terminal components rather than a single module component. This makes BOM, symbol review, pin properties, pin grouping, and footprint association fragile.
  2. Pin descriptions/types mostly missing: Most terminals only have Pin Type: Unspecified or no descriptive pin metadata. Datasheet direction/function information is not encoded in the symbol properties.
  3. Footprint pad placement error: SDN pad has no explicit position rule and resolves to 0,0, which is inconsistent with the datasheet pinout and the other pads.
  4. Footprint geometry needs verification: Module outline matches 14 × 20 mm and pad size appears plausible, but current pad coordinates do not form a clear 1.27 mm castellated perimeter pattern from the datasheet. Several signal pads appear irregularly placed relative to expected module edges.
  5. Pad numbering/identity is indirect: Pads are named by terminal designator and UID rather than a clean numbered pad map tied to one module footprint, making mechanical/pin verification error-prone.
  6. No schematic nets: There are no nets, so electrical connectivity cannot be validated beyond symbol/terminal presence.
  7. Datasheet URL already existed: Per user instruction, no datasheet property update was required. Official web sources found include EBYTE product page https://www.ebyte.com/product/1047.html and CDEBYTE English product page https://www.cdebyte.com/products/E04-400M16S/2.
  1. Convert the 22 terminals into a single E04-400M16S module component with 22 pins.
  2. Add pin metadata from the datasheet: pin number, pin name, pin direction/type, section/group, and pin description.
  3. Rebuild or correct the footprint against the official EBYTE package/footprint download and datasheet mechanical drawing.
  4. Explicitly position SDN pad and verify all pad coordinates against the 20 × 14 mm, 1.27 mm castellated footprint.
  5. Add VCC decoupling guidance/property notes: ceramic filter capacitor close to VCC/GND.
  6. Treat ANT as a 50 Ω RF node and keep copper/routing around the module/antenna region consistent with EBYTE antenna guidance.
  • Scope

  • Current Project Part Information

  • Project-level properties

  • Schematic representation

  • PCB footprint representation

  • Datasheet / Official Source Key Specs

  • Datasheet Pinout Cross-Check

  • Mismatches / Issues Flagged

  • Recommended Fixes

Documents

  • Part Information Review — E04-400M16S

Assets

E04-400M16S-thumb.png

E04-400M16S-thumb.png

E04-400M16S-thumbThumbnail

E04-400M16S

E04-400M16S thumbnail
Transceiver 433MHz IPEX interface -100dBm 1km SPI SMD,20x14mm RF Transceiver Modules and Modems RoHS
The E04-400M16S is based on STMicroelectronics' S2-LPQTR chip as the core, it is an ultra-small size chip wireless transceiver RF module independently developed by Ebyte, working in the 433M/470M frequency band, with a maximum transmission power of 16dBm. Since this module is a SPI pure hardware radio frequency transceiver module, it needs to be driven by MCU.
Features  Ultra-small size, only 14x20mm;  The communication distance can reach 1km under ideal conditions;  The maximum transmit power is 16dBm;  The receiving current (RX) is as low as 7mA, and the transmitting current (TX) is as low as 10mA@10dBm;  Low power consumption, suitable for battery-powered applications;  Support 433M/470M frequency band;  Support multiple debugging modes of 2(G)FSK, 4(G)FSK, OOK, ASK;  Support 2.5V~3.6V power supply, power supply greater than 3.3V can guarantee the best performance;  Industrial-grade standard design, supporting long-term use at -40~85℃;  IPEX interface and stamp hole are optional, which is convenient for users to develop and integrate. Application  Smart meeting  Wireless alarm system  Smart door lock  Building automation  Industrial acquisition and control  Intelligent lighting system

Properties

E04-400M16S

EBYTE

Module

U

parametric-v1

C5333990

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