I’ll update each terminal with datasheet-based pin metadata: number, name/designator, type, functional group/section, and description, then verify the schematic properties.
Added datasheet-based metadata to all 22 E04-400M16S terminals and verified the updates. Each pin now has Pin Number, Pin Role/name, Pin Type, Pin Group, Section, and Pin Description; I used one primary group per pin and normalized pin types to Flux standard values where available.
Open items:
The symbol is still represented as 22 separate Terminal components rather than one module component.
SPI MISO/MOSI directions follow the EBYTE datasheet wording, which should be rechecked against host/module convention during integration.
Suggested next steps:
Convert these terminals into a single 22-pin module symbol.
Correct and verify the footprint pad coordinates against the official EBYTE package.
Add VCC decoupling and RF/antenna layout constraints.
Reviewed available project part information for EBYTE / Chengdu Ebyte E04-400M16S, including MPN, manufacturer, package/mechanical data, pin count, description, project properties, schematic terminals, symbol pin descriptions, and PCB footprint geometry. Cross-check source was the project Datasheet URL plus official EBYTE/CDEBYTE web product pages found during review.
Receiver sensitivity: down to -130 dBm at 0.3 kbps; commonly -100 to -120 dBm depending conditions
Air data rate: 0.3–250 kbps depending modulation
Modulations: 2(G)FSK, 4(G)FSK, OOK, ASK / SIGFOX support noted
SPI interface: 0–10 Mbps
Operating temperature: -40 to +85 °C
Module size: 20 mm × 14 mm
Package/interface: SMD castellated/stamp-hole, 1.27 mm pitch
RF interface: stamp-hole ANT and/or IPEX, about 50 Ω
Recommended hardware notes: add ceramic filter capacitor at VCC; keep high-frequency/power routing away from/under module; use stable low-ripple supply; keep antenna exposed and avoid metal enclosure shielding.
Datasheet Pinout Cross-Check
Table
Pin
Datasheet name
Datasheet direction
Datasheet function
Project terminal present
Match
1
GND
—
Ground
GND
OK
2
GND
—
Ground
GND
OK
3
GND
—
Ground
GND
OK
4
GND
—
Ground
GND
OK
5
GND
—
Ground
GND
OK
6
GPIO1
I/O
Configurable GPIO
GPIO1
OK
7
GPIO2
I/O
Configurable GPIO
GPIO2
OK
8
GPIO3
I/O
Configurable GPIO
GPIO3
OK
9
VCC
—
2.5–3.6 V supply
VCC
OK
10
GND
—
Ground
GND
OK
11
GND
—
Ground
GND
OK
12
GND
—
Ground
GND
OK
13
GPIO0
I/O
Configurable GPIO
GPIO0
OK
14
SDN
Input
Shutdown control
SDN
OK name, but footprint pad position missing
15
NC
—
No connect
NC
OK
16
MISO
Input
SPI data input pin per datasheet wording
MISO
OK name; verify host/module direction convention before schematic use
17
MOSI
Output
SPI data output pin per datasheet wording
MOSI
OK name; verify host/module direction convention before schematic use
18
SCLK
Input
SPI clock input
SCLK
OK
19
CSN
Input
SPI chip select
CSN
OK
20
GND
—
Ground
GND
OK
21
ANT
—
50 Ω antenna interface
ANT
OK
22
GND
—
Ground
GND
OK
Mismatches / Issues Flagged
Symbol architecture mismatch: The part is modeled as 22 independent Terminal components rather than a single module component. This makes BOM, symbol review, pin properties, pin grouping, and footprint association fragile.
Pin descriptions/types mostly missing: Most terminals only have Pin Type: Unspecified or no descriptive pin metadata. Datasheet direction/function information is not encoded in the symbol properties.
Footprint pad placement error: SDN pad has no explicit position rule and resolves to 0,0, which is inconsistent with the datasheet pinout and the other pads.
Footprint geometry needs verification: Module outline matches 14 × 20 mm and pad size appears plausible, but current pad coordinates do not form a clear 1.27 mm castellated perimeter pattern from the datasheet. Several signal pads appear irregularly placed relative to expected module edges.
Pad numbering/identity is indirect: Pads are named by terminal designator and UID rather than a clean numbered pad map tied to one module footprint, making mechanical/pin verification error-prone.
No schematic nets: There are no nets, so electrical connectivity cannot be validated beyond symbol/terminal presence.
Datasheet URL already existed: Per user instruction, no datasheet property update was required. Official web sources found include EBYTE product page https://www.ebyte.com/product/1047.html and CDEBYTE English product page https://www.cdebyte.com/products/E04-400M16S/2.
Recommended Fixes
Convert the 22 terminals into a single E04-400M16S module component with 22 pins.
Add pin metadata from the datasheet: pin number, pin name, pin direction/type, section/group, and pin description.
Rebuild or correct the footprint against the official EBYTE package/footprint download and datasheet mechanical drawing.
Explicitly position SDN pad and verify all pad coordinates against the 20 × 14 mm, 1.27 mm castellated footprint.
Add VCC decoupling guidance/property notes: ceramic filter capacitor close to VCC/GND.
Treat ANT as a 50 Ω RF node and keep copper/routing around the module/antenna region consistent with EBYTE antenna guidance.
The E04-400M16S is based on STMicroelectronics' S2-LPQTR chip as the
core, it is an ultra-small size chip wireless transceiver RF module independently
developed by Ebyte, working in the 433M/470M frequency band, with a maximum
transmission power of 16dBm. Since this module is a SPI pure hardware radio frequency transceiver module, it
needs to be driven by MCU.
Features
Ultra-small size, only 14x20mm;
The communication distance can reach 1km under ideal conditions;
The maximum transmit power is 16dBm;
The receiving current (RX) is as low as 7mA, and the transmitting current (TX) is as low as 10mA@10dBm;
Low power consumption, suitable for battery-powered applications;
Support 433M/470M frequency band;
Support multiple debugging modes of 2(G)FSK, 4(G)FSK, OOK, ASK;
Support 2.5V~3.6V power supply, power supply greater than 3.3V can guarantee the best performance;
Industrial-grade standard design, supporting long-term use at -40~85℃;
IPEX interface and stamp hole are optional, which is convenient for users to develop and integrate. Application
Smart meeting
Wireless alarm system
Smart door lock
Building automation
Industrial acquisition and control
Intelligent lighting system