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22
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22
18
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18
12
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12
49
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49
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14
8
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8
45
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45
34
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34
17
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17
50
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50
31
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31
48
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48
39
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39
32
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32
11
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11
46
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46
24
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28
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28
36
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36
3
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3
26
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26
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27
6
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6
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7
2
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2
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35
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43
13
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13
42
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33
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33
25
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25
5
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5
37
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37
4
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4
47
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47
16
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16
21
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21
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23
15
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15
38
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20
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41
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41
10
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10
1
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1
44
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44
19
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19
9
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9
29
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29
40
Pin Number
40

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    Assets

    kicad_mod

    DF40HC_2.5_-50DS-0.4V_51_

    DF40HC2550DS04V51.kicad_modFootprint
    step

    3D_DF40HC(2.5)-50DS-0.4V(51).STEP

    3D_DF40HC(2.5)-50DS-0.4V(51)
    DF40HC_2.5_-50DS-0.4V_51_

    DF40HC_2.5_-50DS-0.4V_51_

    DF40HC_2.5_-50DS-0.4V_51_ Symbol.svgDefault
    stp

    DF40HC_2.5_-50DS-0.4V_51_

    DF40HC_2.5_-50DS-0.4V_51_.stp3D Model
    DF40HC(2.5)-50DS-0.4V(51)-thumb.png

    DF40HC(2.5)-50DS-0.4V(51)-thumb.png

    DF40HC(2.5)-50DS-0.4V(51)-thumbThumbnail

    DF40HC(2.5)-50DS-0.4V(51)

    DF40HC(2.5)-50DS-0.4V(51) thumbnail
    50 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold
    The DF40HC series connector is a high-density, low-profile board-to-board interconnect solution designed for compact electronic assemblies requiring reliable signal integrity and mechanical robustness. This connector is intended for parallel board stacking applications where space constraints demand minimal height and fine contact pitch. It provides secure mating with precise alignment features and is optimized for high-speed signal transmission in advanced electronic systems such as portable devices, embedded modules, and industrial electronics.
    Mechanical Characteristics
    The connector features a slim, rectangular form factor suitable for high-density PCB layouts. It incorporates a fine-pitch contact arrangement to maximize signal routing efficiency within a limited footprint. The housing is constructed from high-temperature thermoplastic material to support standard reflow soldering processes. Contacts are designed to ensure consistent normal force, enabling stable electrical connection under vibration and mechanical stress. The mating interface includes polarization features to prevent incorrect insertion and to guide proper alignment during assembly.
    Electrical Characteristics
    The connector is engineered to support reliable signal transmission across multiple contact points with low contact resistance and stable impedance characteristics. It is suitable for both signal and low-power applications. Contact plating is optimized to maintain conductivity and minimize wear over repeated mating cycles. The design supports high-speed data transfer by reducing crosstalk and maintaining signal integrity across adjacent contacts.
    Environmental Characteristics
    The component is designed to operate within standard industrial temperature ranges and is compatible with lead-free reflow soldering processes. Materials used in construction comply with common environmental and regulatory standards for electronic components. The connector maintains performance under typical environmental stresses such as humidity, temperature variation, and mechanical vibration.
    Materials and Finishes
    The insulating housing is manufactured from a high-performance thermoplastic with appropriate flammability rating. Contacts are formed from copper alloy and plated with a noble metal finish over a suitable underlayer to ensure durability, corrosion resistance, and consistent electrical performance.
    Application Notes
    This connector is intended for use in applications requiring compact stacking of printed circuit boards with reliable electrical interconnection. Proper PCB layout, including pad design and solder mask considerations, is essential to ensure optimal performance. Care should be taken during handling and assembly to avoid damage to fine-pitch contacts. Designers should follow recommended land patterns and assembly guidelines provided by the manufacturer to achieve consistent solder joints and mechanical stability.

    Properties

    DF40HC(2.5)-50DS-0.4V(51)

    Hirose

    Connectors

    J

    Surface Mount

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