Description: 1-Form-A normally-open DC OptoMOS solid-state relay
Key specs: 60 V blocking, 9 A free-air, 22.8 A with 5°C/W heatsink, 0.05 Ω on-resistance, 2500 Vrms isolation, 10 mA input control current
Symbol pin descriptions were missing, so I added:
Pin 1: Load/output +
Pin 2: Load/output −
Pin 3: Input LED/control −
Pin 4: Input LED/control +
Open items / flags:
The footprint appears consistent with a 4-lead ISOPLUS-264 layout, but the exact mechanical drawing should still be visually checked against the datasheet page drawing before release.
No functional mismatch remains in the schematic symbol after adding pin descriptions.
Suggested next steps:
Visually compare the footprint against the datasheet mechanical drawing.
Add/verify 3D model alignment if this part will be used mechanically.
Run a final part-quality review before publishing or reusing in designs.
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Assets
kicad_mod
CPC1709J
CPC1709J_IXY.kicad_modFootprint
CPC1709J-thumb.png
CPC1709J-thumbThumbnail
step
CPC1709J
CPC1709J_IXY.step3D Model
CPC1709J
CPC1709J CPC1709J_0_1 Symbol.svgDefault
CPC1709J
IXYS Integrated Circuits brings OptoMOS®
technology, reliability and compact size to a new family
of high-power Solid State Relays.
As part of this family, the CPC1709J single-pole
normally open (1-Form-A) DC Solid State Power
Relay employs optically coupled MOSFET technology
to provide 2500Vrms of input to output isolation.
The output, constructed with an efficient MOSFET
switch and photovoltaic die, uses IXYS Integrated
Circuits’ patented OptoMOS architecture while the
input, a highly efficient infrared LED, provides the
optically coupled control. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500Vrms isolation but also very low junction-to-case
thermal impedance (0.3 °C/W).
Features
• 22.8ADC Load Current with 5°C/W Heat Sink
• Low 0.05 On-Resistance
• 60VP Blocking Voltage
• 2500Vrms Input/Output Isolation
• Low Thermal Impedance: JC = 0.3 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• No EMI/RFI Generation
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment