Part Datasheet Review and Verification

Thought for 2 mins 36 sec

Part audit for BD34301EKV-E2 1) Available part information Project metadata

Table

Field	Value
MPN	BD34301EKV-E2
Manufacturer	Rohm
Description	DAC, Audio 32 b 768kHz DSD, I2C, PCM 64-HTQFP (10x10) #CommonPartsLibrary #IntegratedCircuit #MUS-IC™
Part type	Integrated Circuit
Datasheet URL	Present
Package from datasheet	HTQFP64BV
Package size from datasheet	12.0 mm x 12.0 mm x 1.0 mm
Datasheet pin count	64 pins + exposed pad
Part-project symbol terminals present	65 terminals total

2) Datasheet URL status

A datasheet URL was already set on the part, so step 2 was not needed.

3) Datasheet summary Device overview

Table

Item	Summary
Part	32-bit high sound quality stereo audio D/A converter
PCM support	32 kHz to 768 kHz
PCM word length	16-bit to 32-bit
DSD support	2.8224 MHz to 22.5792 MHz
Control interface	2-wire interface, up to 400 kHz
Selectable I2C addresses	38h, 3Ah, 3Ch, 3Eh
Audio modes	Stereo (2ch) and Mono (1ch)
Filters	Sharp Roll-Off and Slow Roll-Off
Typical audio performance	SNR 130 dB, THD+N -115 dB

Absolute maximum ratings

Table

Parameter	Symbol	Rating
Supply voltage	AVCC	7.0 V
Supply voltage	DVDDIO	7.0 V
Supply voltage	DVDD	2.1 V
Input voltage	Vin	-0.3 V to DVDDIO + 0.3 V
Storage temperature	Tstg	-55 °C to +150 °C
Maximum junction temperature	Tjmax	150 °C

Recommended operating conditions

Table

Parameter	Symbol	Min	Typ	Max
Analog supply	AVCC	4.5 V	5.0 V	5.5 V
Digital I/O supply	DVDDIO	3.0 V	3.3 V	3.6 V
Digital core supply	DVDD	1.4 V	1.5 V	1.6 V
Operating temperature	Topr	-25 °C	+25 °C	+85 °C

Electrical characteristics Supply current

Table

Parameter	Conditions	Typ	Max
AVCC current	PCM, no signal	30.5 mA	45.0 mA
DVDDIO current	PCM, no signal	10 µA	100 µA
DVDD current 1	PCM, no signal	10 mA	20 mA
DVDD current 2	PCM, 0 dBFS, 44.1 kHz	11 mA	22 mA
DVDD current 3	PCM, 96 kHz	18 mA	36 mA
DVDD current 4	PCM, 192 kHz	17 mA	34 mA
DVDD current 5	PCM, 384 kHz	10 mA	20 mA
DVDD current 6	PCM, 44.1 kHz, max DVDD current setting	21 mA	42 mA

PCM performance

Table

Parameter	Min	Typ	Max
SNR	126 dB	130 dB	-
THD+N	-	-115 dB	-100 dB
Dynamic range	126 dB	130 dB	-
Channel gain mismatch	-0.5 dB	0 dB	+0.5 dB
Output center current	4.6 mA	5.3 mA	6.0 mA
Peak output current	8.5 mApp	9.8 mApp	11.1 mApp
Sampling frequency	32.0 kHz	44.1 kHz	768.0 kHz

DSD performance

Table

Parameter	Min	Typ	Max
SNR	115 dB	125 dB	-
THD+N	-	-113 dB	-103 dB
Dynamic range	107 dB	120 dB	-
Output center current	4.6 mA	5.3 mA	6.0 mA
Peak output current	4.6 mApp	5.3 mApp	6.0 mApp
DSD clock	2.8224 MHz	-	22.5792 MHz

Package information

Table

Item	Value
Package name	HTQFP64BV
Package size	12.0 mm x 12.0 mm x 1.0 mm
Ordering code	BD34301EKV-E2
Package code in ordering	EKV = HTQFP64BV
Packing spec	E2 = Embossed tape and reel
Exposed pad requirement	Connect the EXP-PAD to AGND

Special features

Table

Feature	Value
Series	MUS-ICTM Series
FIR filters	2 kinds
Address selection	4 device addresses
Audio controls	LR swap, stereo/mono, polarity inversion
Interfaces	PCM I/F, DSD I/F, 2-wire I/F, MCLK
Applications	CD/SACD player, DAP, USB-DAC and others

Pin descriptions Pins 1-16

Table

Pin	Name	I/O	Function
1	RESETB	Input	Reset, L: Reset
2	DGND1	-	Digital ground
3	SDA	I/O	2-wire data, open-drain in 2-wire operation
4	SCL	Input	2-wire clock
5	ADDR1	Input	Device address selector 1
6	ADDR2	Input	Device address selector 2
7	DVDD1	-	Digital core power supply 1.5 V
8	TEST1	Input	Test pin, datasheet says open
9	DGND1	-	Digital ground
10	TEST2	Input	Test pin, datasheet says open
11	DVDDIO1	-	Digital I/O power supply 3.3 V
12	BCLK/DSDCLK	Input	PCM bit clock / DSD clock
13	LRCLK/DSD2	Input	PCM LR clock / DSD2 data
14	DIN/DSD1	Input	PCM serial data / DSD1 data
15	DGND1	-	Digital ground
16	TEST3	Input	Test pin, datasheet says open

Pins 17-32

Table

Pin	Name	I/O	Function
17	DVDD1	-	Digital core power supply 1.5 V
18	TEST4	Input	Test pin, datasheet says open
19	TEST5	Input	Test pin, datasheet says open
20	TEST6	Input	Test pin, datasheet says open
21	TEST7	Input	Test pin, datasheet says open
22	N.C.	-	No connection, datasheet says open
23	AGND3_R	-	Right-channel analog ground
24	N.C.	-	No connection, datasheet says open
25	AVCC3_R	-	Right-channel analog power 5.0 V
26	AVCC2_R	-	Right-channel analog power 5.0 V
27	N.C.	-	No connection, datasheet says open
28	AGND2_R	-	Right-channel analog ground
29	IOUT_RN	Output	Right-channel negative output
30	IOUT_RP	Output	Right-channel positive output
31	AGND1_R	-	Right-channel analog ground
32	N.C.	-	No connection, datasheet says open

Pins 33-48

Table

Pin	Name	I/O	Function
33	AVCC1_R	-	Right-channel analog power 5.0 V
34	AVCC_R	-	Right current-segment analog power 5.0 V
35	AVCC_R	-	Right current-segment analog power 5.0 V
36	AVCC_R	-	Right current-segment analog power 5.0 V
37	AVCC_R	-	Right current-segment analog power 5.0 V
38	VREF_R	Output	External capacitor, recommended 0.1 µF + 100 µF
39	AGND	-	Analog ground
40	EXT_RES_R	Output	External resistor, recommended 910 Ω
41	EXT_RES_L	Output	External resistor, recommended 910 Ω
42	AVCC	-	Analog power 5.0 V
43	VREF_L	Output	External capacitor, recommended 0.1 µF + 100 µF
44	AVCC_L	-	Left current-segment analog power 5.0 V
45	AVCC_L	-	Left current-segment analog power 5.0 V
46	AVCC_L	-	Left current-segment analog power 5.0 V
47	AVCC_L	-	Left current-segment analog power 5.0 V
48	AVCC1_L	-	Left-channel analog power 5.0 V

Pins 49-64 and exposed pad

Table

Pin	Name	I/O	Function
49	N.C.	-	No connection, datasheet says open
50	AGND1_L	-	Left-channel analog ground
51	IOUT_LP	Output	Left-channel positive output
52	IOUT_LN	Output	Left-channel negative output
53	AGND2_L	-	Left-channel analog ground
54	N.C.	-	No connection, datasheet says open
55	AVCC2_L	-	Left-channel analog power 5.0 V
56	AVCC3_L	-	Left-channel analog power 5.0 V
57	N.C.	-	No connection, datasheet says open
58	AGND3_L	-	Left-channel analog ground
59	DGND2	-	Digital ground for MCLK
60	MCLK	Input	Master clock
61	DVDDIO2	-	Digital I/O power for MCLK 3.3 V
62	N.C.	-	No connection, datasheet says open
63	DVDD2	-	Digital power for MCLK 1.5 V
64	DVDD1	-	Digital core power 1.5 V
EP	EXP-PAD	-	Connect to AGND

4) Symbol and footprint cross-check What matches

Table

Check	Result	Notes
Pin count	Match	Datasheet shows 64 pins + exposed pad; part project contains 65 terminals/pads
Pin numbering	Match	Symbol terminals include pins 1-64 and 65 for exposed pad
Pin naming	Match	Signal names in the symbol align with datasheet naming, including duplicated supply names and separate grounds
Exposed pad presence	Match	Project includes EP and datasheet requires EXP-PAD
Footprint existence	Present	DRC does not report a missing footprint

Issues flagged

Table

Severity	Issue	Why it matters
High	The exposed pad EP is present, but I could not verify from the accessible PCB data that it is explicitly tied to AGND in the footprint definition or symbol intent	The datasheet explicitly requires the exposed pad to be connected to AGND. If left floating or mapped incorrectly, this can cause thermal and analog performance problems
Medium	All symbol terminals are currently typed as Unspecified in the project data, including pins like SDA, SCL, RESETB, IOUT_LP, and grounds like AGND	This will not change manufacturing output directly, but it weakens ERC and makes integration mistakes more likely
Medium	TEST pins TEST1 through TEST7 and N.C. pins such as N.C._1 are present as normal terminals	The datasheet says TEST pins and N.C. pins must be left open. If later connected in a design, that can cause board failure or undefined behavior
Medium	Package text in project description says 64-HTQFP (10x10), while the datasheet package is HTQFP64BV, 12.0 mm x 12.0 mm x 1.0 mm	This can cause incorrect part ordering or a wrong footprint selection if someone relies on the description instead of the datasheet
Low	I could confirm pad presence but not exact pad geometry, lead pitch, courtyard, or exposed-pad dimensions from the available layout output	A dimensional footprint error could still exist even though the pad count/name mapping looks correct

Bottom line Overall assessment

Table

Area	Status
Metadata completeness	Good
Datasheet availability	Good
Pin-map consistency	Good
Manufacturing-risk items	Needs review

Most important corrections

Table

Priority	Recommendation
1	Ensure EP is mapped and documented as AGND-connected exposed pad
2	Update the package description to HTQFP64BV, 12.0 mm x 12.0 mm x 1.0 mm
3	Set proper pin electrical types for SDA, SCL, RESETB, MCLK, outputs, power pins, and grounds
4	Mark TEST and N.C. pins as intentionally open in the part definition notes/properties

If you want, I can next produce a pin-by-pin verification matrix for every terminal in the part project.

Pin verification matrix

Check EP mapping

Review package mismatch

Inspect part properties

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