Part Datasheet Review and Verification
Thought for 7 mins 3 sec
Step 1-3: part review and datasheet scan
Extracted feature summary
Absolute maximum ratings
Recommended operating conditions / electrical characteristics
Pin descriptions
Package / mechanical data
Step 4: symbol and footprint cross-check
Cross-check result
Issues / risks flagged
Bottom line
The part already has a datasheet URL set, so step 2 was not needed. I used the existing datasheet source and a mirrored copy to extract what was available.
Part metadata
Table
| Field | Value |
|---|---|
| Part | APA102-2020 |
| Description | RGB LED with integrated control IC, two-wire clock/data interface, cascaded pixel device |
| MPN | APA102-2020 |
| Package | 2020 SMD, 2.0 mm x 2.0 mm x 0.75 mm in the PDF summary |
| Variant noted in datasheet | APA-102-2020-256-8A |
| Pin count | 8 pins |
| Datasheet | |
| Key project properties | Manufacturer: Shenzhen LED Color Opto Electronic CO., LTD.; Designator Prefix: LED |
Table
| Category | Extracted data |
|---|---|
| Interface | Two-wire serial interface: DATA and CLK |
| Dimming | 256 grayscale levels, plus 32-level global brightness adjustment |
| Output type | Integrated RGB LED + driver IC |
| PWM | 20 kHz PWM frequency |
| Cascade support | Yes, with clock and data forwarding |
| Supply | 5.0 V to 5.5 V operating supply from extracted electrical table |
| LED current | Max LED output current listed as 18 mA in max ratings |
| Viewing angle | 120 deg |
| Manufacturing notes | RoHS, compatible with automatic placement and IR reflow, JEDEC level 3 preconditioning |
Table
| Parameter | Value |
|---|---|
| IC power supply voltage | -0.4 V to +5.5 V |
| Logic input voltage | -0.4 V to VDD + 0.4 V |
| Data signal rate | 15 MHz |
| ESD | 2000 V |
| Max LED output current | 18 mA |
| Soldering temperature | 260 C |
| Operating temperature range | -40 C to +85 C |
| Storage temperature range | -40 C to +105 C |
Table
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| Supply voltage VDD | 5.0 | 5.5 | V | |
| Data signal rate FCLK | 5 | MHz | ||
| Input high voltage VIH | 0.7 x VDD | V | ||
| Input low voltage VIL | 0.3 x VDD | V | ||
| Clock high width TCLKH | 30 | ns | ||
| Clock low width TCLKL | 30 | ns | ||
| Data setup time TSETUP | 10 | ns | ||
| Data hold time THOLD | 5 | ns | ||
| PWM frequency FPWM | 20 | kHz | ||
| Static power consumption IDD | 0.7 | mA |
The mirrored PDF OCR was imperfect, but enough data was available to reconstruct the functional pin map used by this part project.
Table
Table
| Item | Value |
|---|---|
| Body size | 2.00 mm x 2.00 mm |
| Height | 0.75 mm from PDF mirror |
| Tolerance | +-0.1 mm unless otherwise specified |
| Recommended pad layout | Present in datasheet |
| Reflow compatibility | Yes |
Table
| Check | Result | Notes |
|---|---|---|
| Pin count | Pass | Project has 8 symbol pins and PCB pads |
| Pin naming | Pass | CO, CI, DO, DI, VDD_1, VDD_2, GND_1, GND_2 align with the 8-pin package concept |
| Pin numbering | Pass | Symbol numbering maps cleanly to the extracted function list |
| Functional directionality | Mostly pass | Clock/data input and output roles are represented correctly |
| Footprint pad count | Pass | PCB footprint exposes 8 pads matching the symbol |
| Footprint land pattern dimensions | Needs manual verification | Current PCB inspection exposed pad identities but not enough geometry detail to prove the land pattern matches the datasheet's recommended pad dimensions |
Table
| Severity | Issue | Why it matters |
|---|---|---|
| Medium | Datasheet source quality is inconsistent | The original URL partly blocked full extraction, and alternate mirrors have imperfect OCR. That increases the risk of small mechanical or ordering details being missed. |
| Medium | Package height conflict across sources: 0.75 mm vs 0.9 mm | This usually will not break PCB assembly, but it can matter for enclosure clearance and exact MPN matching. |
| High if unverified before release | Recommended pad geometry not fully confirmed against the project footprint | A wrong 2020 land pattern can cause tombstoning, poor solder fillets, skew, or assembly yield problems. |
| Medium | Project MPN is APA102-2020, while datasheet variant text is APA-102-2020-256-8A | Ordering ambiguity could lead to the wrong sub-variant if the manufacturer/distributor listing is not matched carefully. |
- I found no confirmed symbol pinout mismatch in the current part project.
- I found no confirmed pin-count mismatch between symbol and footprint.
- The main remaining risk is footprint land pattern verification and exact ordering-code ambiguity.
If you want, I can next produce a pin-by-pin validation checklist for the footprint against the datasheet mechanical drawing.
Footprint pin check
Pull review checks
Find exact variant
