Part Review and Datasheet Analysis
Table
| Field | Current value | Datasheet cross-check |
|---|---|---|
| Manufacturer | Diodes | Matches |
| MPN | AP63357QZV-7 | Matches |
| Description | Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 3.5A 13-PowerVFDFN | Consistent |
| Datasheet URL | Set | Present already, so no update was needed |
| Package in description | 13-PowerVFDFN | Datasheet gives V-DFN3020-13/SWP (Type A1), 3 mm x 2 mm, wettable flanks |
Table
| Terminal | Pin number | Current pin type | Datasheet function |
|---|---|---|---|
| VIN | 1 | Unspecified | Power input |
| EN | 2 | Unspecified | Enable / UVLO input |
| FB | 3 | Unspecified | Feedback input |
| COMP | 4 | Unspecified | Compensation node |
| PG | 5 | Unspecified | Open-drain power-good output |
| BST | 6 | Unspecified | Bootstrap supply |
| NC | 7 | Unspecified | No connect |
| GND | 8 | Unspecified | Power ground |
| SW | 9 | Unspecified | Switching node |
Table
| Item | Current footprint |
|---|---|
| Footprint asset | AP63357QZV7.kicad_mod |
| 3D model | AP63357QZV-7.stp present |
| Functional pad count | 9 pads |
| Functional pad names | VIN, EN, FB, COMP, PG, BST, NC, GND, SW |
| Footprint package text | V-DFN3020-13/SWP (Type A1) |
Table
| Parameter | Value |
|---|---|
| Device | AP63357Q |
| Function | Automotive-compliant synchronous buck converter |
| Input range | 3.8 V to 32 V |
| Output current | 3.5 A continuous |
| Reference voltage | 0.8 V ±1% |
| Switching frequency | 450 kHz typ |
| Package | V-DFN3020-13/SWP (Type A1) |
| Body size | 3.00 mm x 2.00 mm |
| Feature note | Wettable flanks |
Table
| Feature | Datasheet detail |
|---|---|
| Light-load mode | PFM/PWM |
| EMI reduction | Frequency Spread Spectrum |
| Low IQ | 22 µA typ |
| Enable threshold | 1.18 V typ |
| Soft-start | 4 ms typ |
| PG output | Open-drain with 5 MΩ internal pull-up |
| Protection | UVLO, UVP, cycle-by-cycle peak current limit, thermal shutdown |
| Low-dropout mode | Supported |
Table
| Parameter | Rating |
|---|---|
| VIN | -0.3 V to +35.0 V DC, -0.3 V to +40.0 V for 400 ms |
| EN | -0.3 V to +35.0 V |
| FB | -0.3 V to +6.0 V |
| COMP | -0.3 V to +6.0 V |
| PG | -0.3 V to +6.0 V |
| BST | VSW - 0.3 V to VSW + 6.0 V |
| SW | -0.3 V to VIN + 0.3 V DC, -2.5 V to VIN + 2.0 V for 20 ns |
| Storage temp | -65 °C to +150 °C |
| Junction temp | +170 °C |
| Lead temp | +260 °C |
| ESD HBM | ±2000 V |
| ESD CDM | ±1000 V |
Table
| Parameter | Min | Max |
|---|---|---|
| VIN | 3.8 V | 32 V |
| VOUT | 0.8 V | VIN |
| Ambient temperature | -40 °C | +125 °C |
| Junction temperature | -40 °C | +150 °C |
Table
| Parameter | Min | Typ | Max |
|---|---|---|---|
| Shutdown current | - | 0.6 µA | - |
| Quiescent current | - | 22 µA | - |
| POR rising threshold | 3.3 V | 3.5 V | 3.6 V |
| UVLO falling threshold | - | 3.08 V | - |
| High-side MOSFET RDS(on) | - | 74 mΩ | - |
| Low-side MOSFET RDS(on) | - | 40 mΩ | - |
| HS peak current limit | 4.0 A | 5.0 A | 6.0 A |
| LS valley current limit | 3.2 A | 4.2 A | 5.2 A |
| Oscillator frequency | 400 kHz | 450 kHz | 500 kHz |
| Minimum on-time | - | 100 ns | - |
| Feedback voltage | 0.792 V | 0.800 V | 0.808 V |
| EN high threshold | 1.15 V | 1.18 V | 1.21 V |
| EN low threshold | 1.02 V | 1.08 V | 1.14 V |
| EN input current at 1.5 V | - | 5.5 µA | - |
| EN input current at 1.0 V | 1.0 µA | 1.5 µA | 2.0 µA |
| Soft-start time | - | 4 ms | - |
| Thermal shutdown | - | +170 °C | - |
| Thermal shutdown hysteresis | - | +25 °C | - |
Table
| Pin | Number | Description |
|---|---|---|
| VIN | 1 | Power input for IC and MOSFETs; bypass to GND with suitable capacitor |
| EN | 2 | Enable input; high = on, low = off; can be tied to VIN or left floating; used for UVLO programming |
| FB | 3 | Feedback sensing terminal for output divider |
| COMP | 4 | Compensation node; tie to GND for internal compensation or use external RC network |
| PG | 5 | Open-drain power-good output with internal 5 MΩ pull-up |
| BST | 6 | Bootstrap supply for high-side gate driver; use 100 nF from BST to SW |
| NC | 7 | No internal connection; may be tied to another pin or left floating |
| GND | 8 | Power ground |
| SW | 9 | Switching node; connect output LC filter from here to load |
Table
| Dimension | Value |
|---|---|
| D | 2.00 mm BSC |
| E | 3.00 mm BSC |
| A | 0.80 mm to 0.90 mm |
| A1 | 0.00 mm to 0.05 mm |
| b | 0.15 mm to 0.25 mm |
| e | 0.45 mm BSC |
| L | 0.35 mm to 0.45 mm |
| L1 | 0.55 mm to 0.65 mm |
| L2 | 1.475 mm to 1.575 mm |
Table
| Layout parameter | Value |
|---|---|
| C | 0.45 mm |
| G | 0.175 mm |
| X | 0.60 mm |
| X1 | 0.80 mm |
| X2 | 0.30 mm |
| X3 | 2.30 mm |
| Y | 0.30 mm |
| Y1 | 1.450 mm |
| Y2 | 1.725 mm |
| Y3 | 2.825 mm |
Table
| Check | Result | Notes |
|---|---|---|
| MPN | Pass | AP63357QZV-7 matches datasheet ordering info |
| Package family | Pass | Footprint text matches V-DFN3020-13/SWP (Type A1) |
| Functional pin count | Pass | Datasheet functional pins are 9, and project symbol/footprint both implement 9 |
| Pin-number mapping | Pass | 1 VIN, 2 EN, 3 FB, 4 COMP, 5 PG, 6 BST, 7 NC, 8 GND, 9 SW all match |
| Pad geometry | Pass | Current footprint pad sizes align with datasheet suggested values: 0.30 x 0.60 mm, 0.80 x 1.450 mm, 0.30 x 1.725 mm |
| 3D asset presence | Pass | STEP model exists |
Table
| Severity | Finding | Why it matters |
|---|---|---|
| Medium | All symbol terminals are set to Unspecified pin type | This weakens ERC quality and can hide connection mistakes, especially for PG, EN, VIN, GND, and SW |
| Low | Package naming can look inconsistent: project description says 13-PowerVFDFN, datasheet says V-DFN3020-13/SWP | This could confuse part selection or review, even though the footprint itself appears correct |
| Low | No richer per-pin descriptions are encoded in the current symbol | Not a manufacturing issue, but it makes reuse and review weaker |
Table
| Item | Conclusion |
|---|---|
| “13-pin package” vs 9 implemented pads | Not necessarily a defect. The datasheet’s functional pin table contains 9 electrical pins, and the current symbol/footprint implements those 9 correctly. The package designation includes the SWP/wettable-flank package style, so I do not see evidence of a missing electrical pad from the current data. |
Table
| Area | Verdict |
|---|---|
| Datasheet availability | Good |
| Metadata completeness | Good, but package naming could be normalized |
| Symbol pin mapping | Correct |
| Footprint/package match | Correct from the available footprint data |
| Manufacturing risk | No obvious pad-count or pin-map issue found |
| Main improvement needed | Assign correct pin electrical types and add fuller symbol metadata |
Table