Part Information Review and Datasheet Update

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
a day

4:20

Assessing project updates.

Searching the project.

Reviewing the bill of materials.

Analyzing the schematic.

Analyzing the PCB layout.

Searching for project components.

Searching 2 domains.

Searching for terminals.

Searching 4 domains.

Considering data organization.

Search complete — 305 results across 2 domains.

Running multiple web searches.

Found 1 results.

Found 1 results.

Looking for "Extract the ordering code details, connector description, available positions, lead style 03.5, plating L, 4 row option, termination -2, alignment pin A, packaging TR, and any pin/row count information for ADF6-100-03.5-L-4-2-A-TR." in adf6.pdf

Looking for "Extract product specification key specs for ADM6/ADF6 connectors: current rating, voltage rating, operating temperature range, insulation resistance, contact resistance, dielectric withstanding voltage, material/plating, processing/reflow recommendations, and mating information." in adx6.pdf

Looking for "Extract the mechanical drawing information relevant to ADF6-100-03.5-L-4-2-A-TR: number of contacts, rows, row/column naming or pin numbering convention, footprint pad pattern, ball termination, alignment pins, and critical dimensions." in adf6-xxx-xx.x-xxx-4-x-x-xr-mkt.pdf

Analyzing the PCB layout.

Review complete. I set the part’s Datasheet URL to Samtec’s official ADF6 catalog PDF, confirmed the schematic has the expected 400 terminals for the 4-row × 100-position connector, and flagged the main gaps: missing recommended metadata properties, missing pin descriptions, and footprint geometry items that need manual confirmation against the Samtec print. Full analysis is in the Part Datasheet Review project file.
Fix metadata gaps
Review footprint geometry
Check land pattern
Run ERC/DRC
a day

Set Datasheet URL to "https://suddendocs.samtec.com..."

0:01

Set Datasheet URL to "https://suddendocs.samtec.com/catalog_english/adf6.pdf"

a day

Refine this doc
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Part Datasheet Review — ADF6-100-03.5-L-4-2-A-TR
Scope
Reviewed available project metadata, schematic terminal elements, PCB footprint nodes/assets, and official Samtec documentation for the current part project.
Documents consulted
Datasheet property
The project did not expose a usable Datasheet URL in the queried project metadata, so I set the project Datasheet URL property to the official Samtec ADF6 catalog PDF:
https://suddendocs.samtec.com/catalog_english/adf6.pdf

Project metadata observed


FieldProject value / statusDatasheet / official source checkResult
Manufacturer Part NumberADF6-100-03.5-L-4-2-A-TRMatches ordering code structure in Samtec ADF6 catalogOK
Manufacturer NameSamtecMatches official sourceOK
Designator PrefixJAppropriate for connectorOK
Datasheet URLSet during this reviewOfficial Samtec ADF6 catalog PDFOK
Part TypeNot observed as a project propertyShould be ConnectorMissing / recommended
Package or Case CodeNot observed as a project propertyShould describe ADF6 0.635 mm 4-row SMD socket, 400-position, 3.5 mm lead style, ball terminationMissing / recommended
Max CurrentNot observed as a project property1.34 A per contact with 4 contacts poweredMissing / recommended
Operating VoltageNot observed as a project propertyVoltage rating 155 VAC; catalog also lists 155 VAC / 219 VDCMissing / recommended
Operating TemperatureNot observed as a project propertyProduct spec: -65°C to +125°C; catalog lists -55°C to +125°CMissing / needs source choice
Implementation DetailsNot observed as a project propertyReflow, stencil, placement, and standoff recommendations available in product specMissing / recommended

Key specs from official documentation


SpecValue
SeriesADF6, Samtec AcceleRate HD high-density 4-row socket
Pitch0.635 mm / .025 in
Positions100 per row
Rows4
Total contacts400
Lead style-03.5 = 3.5 mm
Plating-L = 10 µin gold on contact area, matte tin on tail
Termination-2 = SAC solder ball option, 96.5% Sn / 3.0% Ag / 0.5% Cu, available with -S or -L plating
Alignment option-A = alignment pin
Packaging-TR = tape and reel
Current rating1.34 A per contact with 4 contacts powered
Voltage rating155 VAC; catalog also gives 219 VDC
Operating temperatureProduct specification: -65°C to +125°C; catalog: -55°C to +125°C
Withstanding voltage480 VAC
Insulation resistance45,000 MΩ; test requirement 1000 MΩ minimum
Contact resistanceΔ15 mΩ maximum, no damage
High-speed claimUp to 64 Gbps PAM4 / 32 Gbps NRZ; product spec notes 100 Ω differential system impedance and 18 GHz at -3 dB insertion loss for 5.00 mm stack height
ReflowLead-free reflow compatible; J-STD-020 peak 260°C, 30 s above 255°C; maximum three reflow passes at 260°C
Stencil0.005 in / 0.127 mm
PlacementMachine placement strongly recommended
Mechanical robustnessBoard-to-board standoffs recommended
Schematic symbol audit
What was found
  • The schematic contains 400 Terminal components.
  • Terminal designators follow the expected A/B/C/D row naming with positions 01–100.
  • Terminal Pin Number properties match the terminal labels, for example A01, B01, C01, D01 through A100, B100, C100, D100.
  • Terminal Pin Type is set to Passive on sampled terminals, which is appropriate for a connector contact.
  • The symbol is split into four sub-symbols:
    • ADF6-100-03.5-L-4-2-A-TR_1_0
    • ADF6-100-03.5-L-4-2-A-TR_2_0
    • ADF6-100-03.5-L-4-2-A-TR_3_0
    • ADF6-100-03.5-L-4-2-A-TR_4_0
Datasheet comparison
  • Datasheet/catalog configuration: 100 positions per row × 4 rows = 400 contacts.
  • Mechanical print shows row labels A, B, C, D and calls out PIN A01 and PIN D01, consistent with the project’s row/position naming.
Symbol mismatches / gaps
  1. Pin count matches — no missing/extra terminal count detected.
  2. Pin names / pin numbers match the row-position convention — no mismatch detected at the naming-pattern level.
  3. Pin descriptions are missing — sampled terminals do not show Pin Description. For connector contacts, recommended description is concise, e.g. Row A contact, Row B contact, etc., or simply Mezzanine contact if per-row descriptions are not needed.
  4. No Section / Pin Group observed — optional for this simple connector, but could be useful for organization: Section = Contacts, Pin Group = Row A / Row B / Row C / Row D.
  5. Sub-symbol grouping is broad — four 100-pin sub-symbols exist. This is usable for a 400-pin connector, though large sheets may benefit from grouping by row or by position ranges depending on how the connector is used.
Footprint audit
What was found
  • The project has a footprint asset: SAMTEC_ADF6-100-03.5-L-4-2-A-TR.kicad_mod.
  • PCB layout inspection found 400 pad nodes plus footprint/container nodes.
  • Pad designators match the schematic terminal naming pattern.
Datasheet/mechanical-print comparison
  • Mechanical print confirms a 4-row pattern with row labels A–D, 0.635 mm pitch, and row/column reference features.
  • The project footprint pad count matches the 400-contact requirement for ADF6-100-03.5-L-4-2-A-TR.
Footprint mismatches / gaps
  1. Pad count matches — no pad-count mismatch detected.
  2. Pad labels match schematic pattern — no naming-pattern mismatch detected.
  3. Geometry not fully verified — the layout data available in this review showed pad nodes but did not expose enough pad geometry detail to fully validate pad size, solder mask, paste, alignment pin holes, or exact row spacing against the Samtec print. A human visual/mechanical check against the Samtec print is still recommended before publishing/fabrication.
  4. Alignment pin geometry needs explicit confirmation — the MPN includes -A, and the print specifies alignment pins. I could not confirm from available layout data whether the footprint contains the required alignment pin holes/features.
  5. Solder-ball termination geometry needs explicit confirmation — the MPN includes termination -2; the print shows the solder-ball option and 0.41 mm typical ball-related detail. The pad count is correct, but the available layout extract did not confirm pad dimensions.
These are recommended but were not applied automatically because the user requested review and mismatch flagging, except for setting the Datasheet URL.
  1. Add project property Part Type = Connector.
  2. Add Package or Case Code / package descriptor such as: ADF6 0.635mm 4-row SMD socket, 400-position, 3.5mm lead style, SAC solder ball, alignment pin.
  3. Add Max Current = 1.34 A.
  4. Add Operating Voltage = 155 V and note VAC in implementation details if the property only accepts a numeric voltage.
  5. Add Operating Temperature = -65°C to +125°C using the product specification, or -55°C to +125°C if you prefer the catalog page as the controlling source.
  6. Add implementation details:
    • Lead-free reflow compatible; peak 260°C per J-STD-020.
    • Maximum three reflow passes at 260°C.
    • Recommended stencil thickness 0.127 mm / 0.005 in.
    • Machine placement strongly recommended.
    • Board-to-board standoffs recommended.
  7. Add short Pin Description properties to terminals if library quality requirements expect them.
  8. Manually verify the footprint geometry against the Samtec mechanical print, especially alignment pins and solder-ball land pattern.
Overall result
The part is structurally close: MPN/manufacturer/designator metadata is present, Datasheet URL is now set, schematic terminal count matches the 400-contact datasheet configuration, and the footprint pad count matches the schematic. The main issues are missing metadata properties, missing pin descriptions, and incomplete machine-verifiable footprint geometry confirmation for alignment-pin and solder-ball details.

    Scope

    Documents consulted

    Datasheet property

    Project metadata observed

    Key specs from official documentation

    Schematic symbol audit

    What was found

    Datasheet comparison

    Symbol mismatches / gaps

    Footprint audit

    What was found

    Datasheet/mechanical-print comparison

    Footprint mismatches / gaps

    Recommended follow-up edits

    Overall result

Documents

    Part Datasheet Review — ADF6-100-03.5-L-4-2-A-TR

Assets

ADF6-100-03.5-L-4-2-A-TR

ADF6-100-03.5-L-4-2-A-TR

ADF6-100-03.5-L-4-2-A-TR ADF6-100-03.5-L-4-2-A-TR_2_0 Symbol.svg
ADF6-100-03.5-L-4-2-A-TR

ADF6-100-03.5-L-4-2-A-TR

ADF6-100-03.5-L-4-2-A-TR ADF6-100-03.5-L-4-2-A-TR_3_0 Symbol.svg
ADF6-100-03.5-L-4-2-A-TR-thumb.png

ADF6-100-03.5-L-4-2-A-TR-thumb.png

ADF6-100-03.5-L-4-2-A-TR-thumbThumbnail
ADF6-100-03.5-L-4-2-A-TR

ADF6-100-03.5-L-4-2-A-TR

ADF6-100-03.5-L-4-2-A-TR ADF6-100-03.5-L-4-2-A-TR_4_0 Symbol.svg
ADF6-100-03.5-L-4-2-A-TR

ADF6-100-03.5-L-4-2-A-TR

ADF6-100-03.5-L-4-2-A-TR ADF6-100-03.5-L-4-2-A-TR_1_0 Symbol.svg
kicad_mod

ADF6-100-03.5-L-4-2-A-TR

SAMTEC_ADF6-100-03.5-L-4-2-A-TR.kicad_modFootprint

ADF6-100-03.5-L-4-2-A-TR

ADF6-100-03.5-L-4-2-A-TR thumbnail
The ADF6-100-03.5-L-4-2-A-TR is a high-density board-to-board mezzanine connector from the Samtec AcceleRate® HD series. It is designed for high-speed and high-performance interconnect applications requiring compact size, excellent signal integrity, and high pin density. This connector features a fine 0.635 mm pitch with a 4-row socket configuration, making it suitable for advanced embedded systems, networking equipment, data communication devices, industrial electronics, and high-speed computing platforms. Key Features High-density mezzanine connector system 0.635 mm fine pitch design 4-row socket configuration Supports high-speed data transmission up to 64 Gbps PAM4 / 32 Gbps NRZ Optimized Edge Rate® contact system for improved signal integrity Surface-mount (SMD) mounting style Gold-plated contacts for reliable electrical performance Compact low-profile design Designed for board-to-board stacking applications Compatible with multiple stacking heights Suitable for PCIe®, CXL®, networking, AI, telecom, and embedded systems applications Tape-and-reel packaging for automated assembly processes #Connector

Properties

ADF6-100-03.5-L-4-2-A-TR

Samtec

Connector

J

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