Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll audit the connector part metadata, find or verify the official datasheet, compare the symbol/footprint/pin descriptions against it, then create a concise review report with any mismatches flagged.
The official Amphenol Conan datasheet URL is already present on the library part, so no datasheet-property update was needed. I’m writing the audit notes now.
Summary: the official Amphenol Conan datasheet URL was already set, the symbol has the correct 11 passive contacts, and the footprint includes 11 signal pads plus SH1/SH2 retention pads. I flagged non-blocking metadata issues: connector subtype appears wrong, terminal pin descriptions are missing, terminal prefix metadata is inconsistent, and the +125 °C temperature claim should be verified against Amphenol’s detailed product spec before treating it as authoritative.
11 Position Connector Receptacle, Outer Shroud Contacts Surface Mount Gold or Gold, GXT™
91921-31111LF is a 1.00 mm pitch board-to-board mezzanine connector from the Conan™ / MezzSelect™ series by Amphenol ICC. It is an 11-position vertical receptacle designed for compact, high-density PCB interconnect applications such as embedded systems, industrial electronics, and compact computing devices.
Key Features
1.00 mm fine-pitch board-to-board connector
11-position vertical receptacle
Surface-mount (SMT) termination
Dual-row configuration
Gold/GXT™ contact plating for reliable electrical performance
Multiple stacking height support (4.15 mm to 7.52 mm)
Solder retention tabs for improved mechanical stability
Operating temperature range: −55 °C to +125 °C
Current rating: 1 A per contact
Designed for industrial and compact embedded applications
Compatible with IR reflow and vapor-phase soldering processes
RoHS compliant and low-halogen material construction
Typical Applications
Embedded computing modules
Industrial control boards
Compact SBCs and SOMs
Communication equipment
Consumer electronics requiring low-profile mezzanine interconnects