Part Data Review and Validation

2:04

Considering.

Analyzing the schematic.

Checking the bill of materials.

Analyzing the PCB layout.

Searching.

Reading https://www.te.com/en/product-7-534206-5.html.

I reviewed the part project for TE Connectivity 7-534206-5 and the datasheet URL was already present, so no property update was needed.

Part project summary

Field	Result
MPN	7-534206-5
Manufacturer	TE Connectivity
Project description	50 MODII VRT DR CE 100/115
Product description	PCB Mount Receptacle, Vertical, Board-to-Board, 50 Position, 2.54 mm centerline, Gold, Through Hole - Solder
Series	AMPMODU / Modu Connector System
Type	Vertical PCB mount receptacle, socket contacts
Positions / rows	50 positions / 2 rows
Pitch	2.54 mm
Row spacing	2.54 mm
Orientation	Vertical
Termination	Through Hole - Solder
Board retention	Without
Board standoff	Yes
Contact plating	Gold mating area, Tin termination area
Housing / contact features	Closed entry housing, phosphor bronze contacts, top entry

Symbol / footprint structure found in the project

Item	Result
Symbol pin count	50 symbol terminals present
Footprint pad count	50 pads present
Footprint asset	`RHDR50W76P254_2X25_6350X503X813P.kicad_mod`
3D model	Present: `7-534206-5.stp`
Footprint pattern encoded by asset name	2 x 25, 63.50 x 5.03 x 8.13 mm class
Pad numbering	Pads 1...50 exist and map to symbol terminal IDs

Datasheet metadata extracted

Electrical characteristics

Parameter	Value
Current rating	3 A max single contact, 2 A per contact fully energized connector
Voltage rating	333 VAC
Low level contact resistance	12 mΩ max
Insulation resistance	5000 MΩ min initial
Withstanding voltage	750 V rms at sea level for .100 CL system
Operating temperature	Product page: -65 to 105 °C
Temperature rise vs current	30 °C max at specified current
Durability	200 cycles for 30 µin gold, 100 cycles for 15 µin gold, 25 cycles for 10 µin gold, 75 cycles for 100 µin tin

Absolute maximum / ratings

Recommended operating / application conditions

Parameter	Value
PCB thickness	1.40 mm to 2.40 mm in application spec
Product page operating temp	-65 to 105 °C
Placement accuracy for automation	0.25 mm
Max PCB bow	0.03 mm over connector length
Wave solder concerns	Prevent bridging, prevent wicking into receptacles, remove flux after soldering
Solderability	95% minimum solder coverage

Mechanical / package data

Parameter	Value
Positions / rows	50 / 2
Pitch	2.54 mm
Row spacing	2.54 mm from official product page
Connector height	5.03 mm [.198 in] from official product page
Termination post length	2.92 mm [.115 in]
Footprint naming dimensions	63.50 x 5.03 x 8.13 mm encoded in footprint filename

Pin descriptions

Item	Result
Pin names	Numeric only: 1...50
Pin functional descriptions	No per-pin unique electrical functions found, which is expected for this connector family
Numbering note	Customer drawing notes contact numbering is for reference

Manufacturing / assembly notes

Topic	Result
Solder mask	Recommended between all lands
Trace between adjacent lands	Must be solder-mask covered
Storage caution	Avoid chemicals that can cause stress corrosion / cracking
UV caution	Prolonged UV exposure may degrade housing material
Reflow / process	Trial runs recommended under actual manufacturing conditions
Through-hole process	Hold-down recommended until soldering completes

Cross-check: symbol and footprint vs datasheet

Good matches

Check	Result
Total pin count	Match: symbol 50, footprint 50, product page 50
Row count	Match: footprint asset is 2 x 25, datasheet says 2 rows
Pitch family	Match: 2.54 mm
Orientation / termination	Match: vertical, through-hole receptacle
Overall footprint width class	Match with product page height/width class around 5.03 mm

Issues flagged

Severity	Finding	Why it matters
High	Symbol pins are reported as undefined with Pin Type: Unspecified for all 50 terminals	This can degrade ERC quality and increase risk of incorrect symbol behavior in downstream designs
Medium	Project-level designator prefix is J, but symbol terminal properties show Designator Prefix: P	Not a manufacturing failure by itself, but can cause library inconsistency and confusion when instantiating the part
High, needs manual confirmation	Footprint file uses 0.95 mm drill and 1.425 mm pad size, while the extracted customer drawing data reported 1.02 mm ± 0.05 mm hole and 1.55 mm min pad diameter	If the drawing extraction is correct, the current footprint may be undersized, creating assembly risk, poor annular ring, or insertion problems
Medium	Datasheet sources are internally inconsistent on max operating temperature: product page 105 °C vs spec 125 °C	This is a part-documentation discrepancy that should be resolved before using the part at elevated temperature limits

Bottom line

The symbol-to-footprint pin count and numbering coverage look structurally correct.
The largest possible manufacturing risk is the plated through-hole geometry: current footprint uses 0.95 mm drill / 1.425 mm pad, which may be too small if the official drawing requirement is really 1.02 mm hole / 1.55 mm pad min.
The symbol metadata quality needs cleanup because all terminals are effectively untyped/undefined.
I do not see evidence of a catastrophic pin-count mismatch, wrong row count, or wrong connector family.

If you want, I can next produce a concise fix list for this part project.

Create fix checklist

Verify footprint dimensions

Review part issues

57 days