Datasheet scan and metadata extraction (from the linked PDF)
Note: This PDF is a Molex customer/product drawing and packaging drawing for the 505066 series, not a full electrical-spec datasheet. It provides mechanicals, recommended land pattern, stencil, and ordering/circuits info. Electrical ratings and materials are not in this document.
Mate with: 505070-**22 / 505070-**42 (plug/headers indicated on drawing)
Packaging: Embossed tape; quantity 8000 pcs/reel (noted in the drawing)
Dimensions table excerpt (for 505066-1422): A = 2.10 mm, B = 4.90 mm (context labels “A” and “B” shown in the drawing alongside order number and circuits)
Recommended PCB land pattern (reference)
Contact pad pitch: 0.35 ± 0.03 mm
Contact pad width: 0.18 ± 0.03 mm
Inner pad gap (between pad rows): 0.62 ± 0.03 mm
Overall contact row height (row-to-row span): 1.54 ± 0.03 mm
Outer clearances: 0.36 mm (noted)
Fitting nail pad size: 0.40 ± 0.03 mm by 0.58 ± 0.03 mm
Fitting nail horizontal offset (datum to nail centerline): 1.28 ± 0.03 mm
Pattern length: B ± 0.03 (with note “(B + 0.53) MIN.” also shown)
Recommended stencil information
Recommended metal mask (stencil) thickness: t = 0.08 mm
Recommended open aperture ratio: 80%
Recommended metal mask layout: Dimensions repeated in the figure; includes values consistent with land pattern geometry listed above
Other notes visible on the drawing
“PROHIBITED AREA OF PATTERN WIRING AND SOLDER” zones are indicated (keep-out around the connector)
Tails and fitting nail coplanarity: 0.08 mm maximum
Compliance, materials/plating, and electrical ratings: Not found in this document
Formal “pin description” text; the drawing focuses on circuits/pad numbering and land pattern
Safety/compliance (RoHS/halogen-free/UL)
Cross-check: schematic symbol and footprint vs. datasheet/drawing
Symbol-level checks
Circuit count: The project symbol exposes 14 signal terminals, which matches the 14-circuit 505066-1422 variant. Good.
Mechanical terminals: The symbol includes 4 mechanical “MP” terminals. The drawing shows “fitting nail” pads and provides dimensions; while the count is not explicitly listed in text, the recommended pattern depicts fitting nail pads consistent with multiple anchors. The presence of 4 mechanical anchors/pads in this project is plausible. No hard mismatch detected.
Numbering/orientation: The drawing does not provide a text callout for “Pin 1” orientation in the search results, but it shows circuit/order tables and dimensional references. Ensure your symbol’s circuit numbering matches Molex’s numbering scheme in the figure. If the intended board system depends on a defined pin-1 convention, verify that the symbol’s numeric order and left/right/top/bottom arrangement match the Molex drawing orientation.
Footprint-level checks
Pad count: 14 signal pads + fitting nail pads are present in the footprint; matches the 14-circuit configuration. Good.
Pad pitch and size: The drawing specifies 0.35 mm pitch and 0.18 mm pad width. Pad geometry values were not returned by the layout query, so I cannot confirm the exact pad sizes/spacing in the footprint data here. Action suggested: verify your footprint’s signal pad pitch is 0.35 mm and pad width is 0.18 mm, with 1.54 mm row-to-row span and 0.62 mm inner gap to match the drawing.
Fitting nail pads: Drawing lists 0.40 × 0.58 mm with 1.28 mm horizontal offset. The layout tool did not expose pad dimensions, so I cannot confirm sizing/position from the project data. Action suggested: confirm your fitting nail pad size and position against these values.
Keep-out: The drawing shows “prohibited area of pattern wiring and solder” around the connector. Ensure the footprint includes/communicates this keep-out in courtyard/assembly layers or documentation for PCB layout.
Pin-1 indicator: Not visible from the layout query results. Action suggested: ensure a clear Pin-1 indicator (assembly/silkscreen/Doc layer) consistent with the drawing orientation.
Stencil: The drawing recommends 0.08 mm stencil thickness and 80% aperture ratio. Ensure your paste apertures reflect this recommendation or your process capability.
Project property consistency checks (could cause ordering/manufacturing confusion)
Package/Case Code: The project property lists “TO”. “TO” is a transistor outline code and does not apply to this low-profile board-to-board connector. Action suggested: update package/case metadata to a connector-appropriate description (e.g., “SlimStack 0.35 mm receptacle, 2-row, 14-circuit, 0.60 mm mated height”) or leave blank if your workflow does not require a standardized case code.
Description: The current description string includes “Circuits” but does not specify the number. Action suggested: include the explicit circuit count, e.g., “14 Circuits”.
Datasheet completeness: This drawing is excellent for land pattern and packaging, but it lacks electrical/materials/environmental specs. If you need those, consult Molex’s product specification for the 505066 series (often a PS- document) or the online product page.
If you want, I can:
Verify pad geometries by extracting exact pad sizes/positions from the footprint,
Normalize the metadata (package/case string, description with explicit circuit count),
Add a pin-1 indicator note on the footprint documentation layer,
Locate and summarize the full product specification with electrical and material ratings.