Part Review: RM1262 / 453-00139R
Reviewed: 2026-06-16
Project metadata
- Project/part name: 453-00139R
- Description: Sub-GHz Modules Module, RM1262, SX1262, MHF4, Tape and Reel
- Published as part: yes
- Part UID: d003b2fd-0d39-4e52-8a86-924625b671f1
- Manufacturer Part Number: 453-00139R
- Manufacturer Name: Laird / Ezurio
- Datasheet URL: https://www.lairdconnect.com/documentation/datasheet-rm126x-lorawan-module
- Designator Prefix: IC
- Pads/terminals in project: 47
The Datasheet URL was already present, so no Datasheet property update was required.
Official datasheet source
- Title: RM126x LoRaWAN Module Datasheet
- Datasheet file/revision indicated by official page: EZ-DS-RM126x_v2_5.pdf / Version 2.5
- Ordering table confirms 453-00139R = Module, RM1262, SX1262, MHF4, Tape / Reel packaging version.
Key specifications from datasheet
- Module: RM1262 LoRaWAN module based on Silicon Labs EFR32 SoC and Semtech SX1262 radio
- RF connector: MHF4
- Frequency support listed: 863–870 MHz and 902–928 MHz; RM1262 certifications called out for USA, Canada, Australia, New Zealand / 902–928 MHz regions
- LoRaWAN: LoRaWAN 1.0.4 End Device; classes A, B, and C; RP002-1.0.3 regional parameters
- MCU resources: Cortex-M33, 512 kB Flash, 32 kB RAM
- Interfaces: up to 16 GPIO/SWD/UART/I2C/SPI/analog/PWM/frequency functions depending firmware mode
- Operating supply: datasheet recommended supply pins 2.0–3.7 V, typ. 3.3 V; RM1262 needs 3.3 V minimum on VDD_SX1262 for full 22 dBm TX
- TX power: RM1262 up to 22 dBm conducted at MHF4 at 3.3–3.6 V; programmable down to -9 dBm
- Peak TX current: approximately 107–111 mA at 22 dBm, frequency-dependent; typical RX current 8.1 mA LoRa / 7.6 mA FSK
- Sleep current: about 2.1–2.6 µA depending sleep mode
- Physical dimensions: 14 mm x 13 mm x 2 mm; weight 0.9 g
- Operating/storage temperature: -40 °C to +85 °C
- MSL: MSL4
Pinout cross-check
The project symbol has 47 terminal components, matching the 47-pin module pinout in the datasheet. Pin-number/name mapping observed in the schematic matches the datasheet top-view pinout:
- 1 GND
- 2 GND
- 3 VDD_RADIO
- 4 GND
- 5 PD02
- 6 PD03
- 7 GND
- 8 VMCU
- 9 GND
- 10 VDD_IO
- 11 GND
- 12 PC05
- 13 PC04
- 14 PC03
- 15 PC02
- 16 PC01
- 17 PC00
- 18 PC07
- 19 PC06
- 20 RESETN / RESETn
- 21 GND
- 22 NC
- 23 NC
- 24 GND
- 25 GND
- 26 GND
- 27 NC
- 28 GND
- 29 GND
- 30 GND
- 31 GND
- 32 PB04
- 33 PB03
- 34 PB02
- 35 GND
- 36 VDD_SX1262
- 37 PA01
- 38 PA02
- 39 PA03
- 40 GND
- 41 GND
- 42 GND
- 43 GND
- 44 GND
- 45 GND
- 46 GND
- 47 GND
Footprint cross-check
The project layout contains a default footprint with 47 pad nodes and associated fab/silk/text shapes. The 47 pad count matches the datasheet pin count. The datasheet states host PCB land pattern guidance is in Section 7.2 and notes no exposed copper under the module, but the extracted layout data did not expose individual pad geometry/dimensions, so dimensional land-pattern verification could not be completed from the available readout.
Mismatches / issues flagged
- Project property missing: Part Type is not set. The component review check reports this as a warning.
- Terminal Pin Type is Unspecified on every terminal. This is not a pin-number mismatch, but pin electrical types/descriptions are incomplete compared with datasheet functions.
- Pin Description properties appear absent from terminals. Datasheet comments such as supply tie requirements, NC do-not-connect notes, RESETn 1.8 V limitation, BOOT behavior, and SWD/UART functions are not captured in the symbol terminal properties.
- Footprint pad count matches, but pad geometry/land-pattern dimensions were not available in the layout inspection output, so footprint dimensions remain unverified.
- Datasheet uses RESETn capitalization; project uses RESETN. This is a harmless naming/case difference, not a functional pin mismatch.
Recommended fixes
- Set project Part Type to an appropriate module/IC classification.
- Populate terminal Pin Type and Pin Description fields from the datasheet pin definitions, especially for power, ground, NC, reset, boot, SWD, UART, and supply-tie constraints.
- Verify the footprint against the official RM126x Section 7.2 land pattern using pad dimensions/coordinates from the footprint editor or imported official footprint files.