Part Review and Datasheet Validation

flux

Completed the part review for TE Connectivity 2286550-1. The 10-pad symbol/footprint count matches 6 connector positions plus 4 shield/mechanical pads, but pin descriptions and pin types are incomplete, and the footprint should still be dimension-checked against TE application spec 114-94381 before release.
Detailed findings are saved in the project document: part-review-results-te-connectivity-2286550-1.
adrian95

adrian95

Fix the missing pin descriptions and pin types based on the TE documents.

flux

I’ll update the terminal metadata now: assign passive connector pin types and add TE-based descriptions for the HSD contacts, MQS contacts, and shield/mechanical pads, then verify the schematic properties.

flux

Updated and verified all 10 terminals. Pins 1–4 are now passive HSD signal contacts, pins 5–6 are passive MQS auxiliary contacts, and MH1–MH4 are passive shield/mechanical solder pads with TE-based descriptions.
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Part Review Results — TE Connectivity 2286550-1
Scope
Reviewed available project part information, official TE Connectivity documentation, schematic symbol terminals, footprint pad set, and pin descriptions for project 2286550-1.
Official datasheet / drawing
Primary official document found:
Additional official references found:
The project’s datasheet lookup for self already returns the TE customer drawing, so no Datasheet URL change was required from the available editable project data.
Key part specs from official TE information

Table

FieldValue
ManufacturerTE Connectivity
MPN2286550-1
TE descriptionHSD+2MQS, HDR ASSY, 90DEG, COD A
Connector family/typeAutomotive HSD 90° + 2 MQS header, shielded mixed/hybrid connector
Keying / codingCode A
Positions6 signal/contact positions
Additional footprint pads4 mechanical/shield/mounting pads observed in project (MH1–MH4)
Total project pads10 pads: 1–6, MH1–MH4
PCB orientationHorizontal / right-angle, board mount
PCB terminationThrough-hole solder
Rows2
Pitch / centerline2 mm per TE product page data
Impedance100 Ω
Operating voltage60 VDC
Max current rating2.5 A
Product length15.65 mm
Product width27.3 mm
Connector height10.95 mm
Weight7.10 g
Contact mating platingGold
Solder-side platingTin, min. 3 µm on contact pins
Shield/body materialZnAL4Cu1 / Cu-DHP / CuZn37 elements per drawing
Insulator / coding cover materialPA4T-GF30 or PA6T/6-GF25 depending item
PackagingTape and reel / reel, 300 qty per TE page data
Symbol review
Project schematic terminals found:
  • Signal/contact terminals: 1, 2, 3, 4, 5, 6
  • Mechanical/shield/mounting terminals: MH1, MH2, MH3, MH4
The terminal count matches the project context of 10 pads and is consistent with a 6-position connector plus 4 shield/mechanical through-hole pads.
Symbol mismatches / gaps
  1. Pin descriptions are missing.
    All schematic terminal components currently show Pin Type: Unspecified, and no meaningful pin descriptions are populated.
  2. Terminal designators are bare pin numbers rather than a connector instance designator.
    The part-project representation uses individual terminals (1, 2, etc.), which is normal for a Flux part definition, but if instantiated into a design the connector should appear as a connector designator such as J1 with pins 1–6 and MH1–MH4.
  3. Functional distinction is not captured.
    The datasheet identifies long/short contact pins, MQS pins, shielding body/tube/cap, and coding cover. The symbol currently does not distinguish HSD contacts vs MQS contacts vs shield/mechanical pads beyond the MH naming.
Footprint review
Observed footprint nodes include pads:
  • 1, 2, 3, 4, 5, 6
  • MH1, MH2, MH3, MH4
Silkscreen/fabrication geometry is present and resembles a horizontal connector outline. The project has a 10-pad footprint, matching the symbol terminal set.
Footprint mismatches / gaps
  1. Pad count is plausible and consistent, but exact pad geometry could not be fully verified from returned layout data.
    The layout tree listed the pad nodes but did not expose pad drill sizes, copper dimensions, or exact pad coordinates in the structured output. The official drawing states that PCB layout must follow TE specification 114-94381.
  2. The TE drawing references the dedicated PCB layout spec 114-94381.
    For manufacturing-grade validation, the footprint should be checked directly against 114-94381, not only the mechanical product drawing.
  3. Mechanical/shield pads appear represented as MH1–MH4, which is good, but their electrical role is not documented.
    These should be described as shield/mechanical solder pads and connected per the target system grounding/shielding strategy when the connector is used.
  • Add pin descriptions for all terminals:
    • 1–6: contact/signal pins; further classify HSD pair/contact vs MQS contacts after confirming the pin-number mapping from TE drawing/application spec.
    • MH1–MH4: shield/mechanical solder pads / mounting tabs.
  • Set pin types more specifically where supported:
    • Signal contacts: Passive or Unspecified/Passive connector contacts.
    • Shield/mechanical pads: Passive/mechanical/shield as appropriate.
  • Verify pad drills, annular rings, pad coordinates, and courtyard/keepout against TE application spec 114-94381 before release.
  • Consider adding the TE customer drawing URL as the Datasheet URL if it is not visible in the part properties UI, even though the internal datasheet query already resolves it.
Overall result
No pad-count mismatch was found: the project has 10 terminals/pads matching 6 connector positions plus 4 mechanical/shield pads. The main issues are metadata completeness: missing pin descriptions, unspecified pin types, and incomplete explicit mapping between terminal numbers and the TE-defined contact/shield functions.

    Scope

    Official datasheet / drawing

    Key part specs from official TE information

    Symbol review

    Symbol mismatches / gaps

    Footprint review

    Footprint mismatches / gaps

    Recommended corrections

    Overall result

Documents

    Part Review Results — TE Connectivity 2286550-1

Assets

stp

2286550-1

2286550-1.stp3D Model
kicad_mod

2286550-1

22865501.kicad_modFootprint
2286550-1

2286550-1

2286550-1 Symbol.svgDefault
2286550-1-thumb.png

2286550-1-thumb.png

2286550-1-thumbThumbnail

2286550-1

2286550-1 thumbnail
2286550-1 is a TE Connectivity Automotive HSD (High-Speed Data) hybrid connector header designed for high-speed data transmission in automotive applications. It is a shielded, right-angle PCB-mounted connector that combines HSD and MQS contacts, making it suitable for Ethernet, LVDS, USB, camera, infotainment, and other vehicle data communication systems. The connector features a 100 Ω controlled impedance design for reliable signal integrity in demanding automotive environments.
Key Features Automotive HSD+2MQS hybrid header connector 6-position interface with A-coding Right-angle (horizontal) PCB mounting Board-to-board and wire-to-board connectivity Shielded construction for EMI protection 100 Ω impedance for high-speed data transmission Through-hole solder termination Operating voltage up to 60 VDC Maximum current rating: 2.5 A Operating frequency range: 0 to 3 GHz Gold-plated signal contacts for reliable performance Operating temperature range: -40°C to +105°C Reflow soldering capable Designed for automotive signal applications
#CommonPartsLibrary #Connector #TEConnectivity #AutomotiveConnector #HSDConnector #DataConnectivity #HighSpeedData #AutomotiveEthernet #WireToBoard #BoardToBoard #ShieldedConnector #PCBConnector #AutomotiveElectronics #22865501

Properties

2286550-1

TE Connectivity

Connectors

te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F2286550%7FD2%7Fpdf%7FEnglish%7FENG_CD_2286550_D2.pdf%7F2286550-1

J

PCB

parametric-v1

creativecommons.org/licenses/by/4.0/

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