Part Datasheet Analysis and Verification

Thought for 1 min 44 sec

I completed the review for this part project.

1) Available part information Project metadata

Table

Field	Value
Description	WL-SMTW SMT Mono-color TOP LED, waterclear, 5050 red
MPN	150505RS73300
Manufacturer	Würth
Mount	Surface Mount
Part type	Optoelectronic Devices
Designator prefix	LED
Datasheet	Datasheet

Schematic symbol state

Table

Symbol terminal	Mapped pin number	Intended polarity from datasheet	Current symbol metadata
K1	1	Cathode	Pin type = Unspecified, pin name undefined
A1	2	Anode	Pin type = Unspecified, pin name undefined
K2	3	Cathode	Pin type = Unspecified, pin name undefined
A2	4	Anode	Pin type = Unspecified, pin name undefined
K3	5	Cathode	Pin type = Unspecified, pin name undefined
A3	6	Anode	Pin type = Unspecified, pin name undefined

Footprint state

Table

Item	Observed
Footprint asset	`150505RS73300.kicad_mod`
3D model asset	`150505RS73300.stp`
Pad count	6 SMD pads
Pad numbering	1 to 6
Pad size in footprint	1.0 mm x 2.8 mm
Pad row span from copper edge to copper edge	7.2 mm
Package body drawing in datasheet	5.0 mm x 5.0 mm x 1.6 mm

2) Datasheet URL check

A datasheet URL was already set, so no update was required.

3) Datasheet scan and extracted metadata General metadata

Table

Category	Datasheet value
Device type	SMT mono-color TOP LED
Lens	Waterclear
Chip technology	AlInGaP
Emitting color	Red
Internal structure	3 LED chips, ratings specified for all 3 chips in parallel circuit
Package size	5050
Dimensions	5.0 ± 0.1 mm x 5.0 ± 0.1 mm x 1.6 ± 0.1 mm
Terminals	6
Polarity marking	Cathode polarity mark
Viewing angle	120° typ.
Compliance	RoHS compliant, REACh conform/declared, halogen-free

Electrical and optical characteristics

Table

Parameter	Conditions	Datasheet value
Peak wavelength $\lambda_{Peak}$	60 mA	630 nm typ.
Dominant wavelength $\lambda_{Dom}$	60 mA	625 nm typ.
Luminous intensity $I_V$	60 mA	2050 min / 2300 typ mcd
Forward voltage $V_F$	60 mA	2.0 typ / 2.4 max V
Spectral bandwidth $\Delta \lambda$	60 mA	20 nm typ.
Reverse current $I_{REV}$	5 V	10 µA max
Viewing angle $2\theta_{50\%}$	60 mA	120° typ.

Absolute maximum ratings

Table

Parameter	Conditions	Datasheet value
Power dissipation $P_{Diss}$	Ambient 25 °C	156 mW
Continuous forward current $I_F$	Ambient 25 °C	65 mA
Peak forward current $I_{F,Peak}$	duty/10 @ 1 kHz	100 mA
Reverse voltage $V_{REV}$		5 V
ESD threshold, HBM $V_{ESD}$		2000 V

Recommended operating and handling conditions

Table

Parameter	Datasheet value
Operating temperature	-40 to +85 °C
Storage, single parts	-40 to +85 °C
Storage, original packaging	< 40 °C, < 90 % RH
Moisture sensitivity level	MSL 3
Reflow standard	IPC/JEDEC J-STD-020E
Reflow cycles	2 cycles max.
Peak package temperature	Depends on package thickness; for < 1.6 mm, 260 °C

Pin descriptions from the datasheet

Table

Pin	Function
1	Cathode of chip 1
2	Anode of chip 1
3	Cathode of chip 2
4	Anode of chip 2
5	Cathode of chip 3
6	Anode of chip 3

Package / land pattern data found

Table

Item	Datasheet value
Body length	5.0 ± 0.1 mm
Body width	5.0 ± 0.1 mm
Body height	1.6 ± 0.1 mm
Terminal dimensions shown	0.9 ± 0.2 mm, 0.6 ± 0.2 mm
Spacing values shown	3.3 ± 0.2 mm, 1.05 typ., 3.9 typ.
Recommended land pattern values shown	1.6 mm, 2.8 mm, 7.2 mm, 1.0 mm, 4.0 mm, 0.5 mm

Special features / cautions

Table

Topic	Datasheet note
Assembly	Pad pattern is a general recommendation; high-density applications should optimize it
Cleaning	Washing agents may damage body, marking, or plating; brushing is not recommended
Potting	Shrink/expansion can damage device or sealing
Storage time	Use within 12 months of shipment recommended
Handling	Pressure on top surface can affect function and reliability
ESD	ESD prevention methods required during handling

4) Symbol and footprint cross-check Findings

Table

Area	Result	Risk	Details
Pin count	Pass	Low	Symbol exposes 6 pins and footprint has 6 pads, matching the datasheet
Pin numbering	Pass	Low	Symbol terminal numbers 1-6 align with footprint terminal IDs 1-6
Pin polarity mapping	Pass	Low	K1, K2, K3 map to cathodes; A1, A2, A3 map to anodes, consistent with the datasheet
Footprint pad size	Pass	Low	Footprint uses 1.0 x 2.8 mm pads, matching the datasheet land-pattern values
Footprint overall pad span	Pass	Low	Copper span is 7.2 mm, matching the datasheet land-pattern value
Package family	Pass	Low	Footprint is clearly built for a 5050 6-pad LED package
Symbol pin names	Flag	Medium	The symbol metadata shows pin names as undefined; datasheet functions should be explicit as K1/A1/K2/A2/K3/A3 or C1/A1/C2/A2/C3/A3 in the actual pin properties
Symbol pin electrical types	Flag	Medium	All pins are currently Unspecified. For ERC clarity and downstream reuse, these should be set explicitly, typically as passive LED terminals or clearly labeled anode/cathode terminals
Datasheet property naming	Minor flag	Low	Project property is Datasheet URL. If your library workflow expects a canonical Datasheet field, consistency may matter for automation, but functionally the URL is present

Bottom line

No footprint-to-datasheet mismatch was found that would obviously cause manufacturing failure.
No pin-count or pad-mapping issue was found that would obviously cause incorrect ordering.
The main issues are symbol metadata quality, not geometry:
- pin names are not formally defined
- pin types are unspecified

Those two should be cleaned up so this part is safer to reuse and less likely to be miswired later.

@review check ERC

Inspect pad geometry

Find exact pin data

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