电子戒指FPC设计要求
Thought for 1 sec
- Set Layout's sizeX to "72.26mm"
- Set Layout's sizeY to "5.5mm"
- Set Layout's boardShape to "rectangle"
- Set Layout's cornerRadius to "2.75mm"
- Set Layout's stackup to "Standard 2 Layer"
- Set Layout's boardInsetMargin to "0.15mm"
- Set Layout's keepOut to "0.15mm"
Thought
Work done
- Started the ring FPC redesign: removed the charging socket/header-class parts and bulky feedback items from the schematic/BOM, including the JST battery socket, SWD header, buzzer, vibration motor, extra switches, and larger LEDs.
- Added smaller ring-FPC-oriented parts: U4 NRF52832-CIAA-R7 WLCSP BLE MCU, SW4 EVQPUJ02K single microswitch, D4 LNJ347W83RA 0402 LED, direct low-profile battery pads P3/P4, and SWD test pads P5/P6/P7.
- Reclassified existing P1/P2 as magnetic charging contacts and kept them wired as CHG_5V and GND.
- Updated passives to 0402 metadata, rewired the new MCU power/reset/SWD/button/LED/charger-status nets, added R9 as the MCP73831 STAT pull-up, and set the board outline request to 72.26 mm × 5.5 mm with 0.15 mm keepout.
- ✅ Charging sockets removed from the active BOM/schematic; magnetic charging contacts are present as P1/P2.
- ✅ Component count and footprint area were substantially reduced; BOM is now focused on compact MCU/charger/LDO/passives/button/LED/contact pads.
- ⚠️ Button centering was not completed in PCB placement; SW4 is wired but still needs physical placement at the FPC centerline.
- ⚠️ Dual-sided anti-interference placement was not completed; the PCB needs final top/bottom distribution and rolled-ring clearance verification.
- ⚠️ ERC/DRC validation was not completed; routing and review remain to be run after placement.
Credits ran out before I could finish placement, routing, and validation. The next pass should place all components on the 72.26 mm × 5.5 mm FPC with SW4 centered on the width, distribute small passives on both sides to avoid rolled-ring interference, route the nets, then review ERC/DRC and remaining mechanical constraints.
