Wearable EMG Acquisition PCB — High-Level Execution Plan
Scope
Create a new wearable EMG acquisition PCB in Flux with:
- 16 EMG electrode inputs implemented as 8 differential pairs through one 16-pin flex connector
- One 4-pin flex connector carrying I2C, power, and ground
- EMG analog front end feeding an ADC suitable for EMG, with programmable gain and lead/impedance checking capability
- SPI link from ADC/AFE to an nRF52840 variant with USB PHY
- nRF52840 also connected to the external I2C connector
- RF output through a chip resistor and matching network
- USB connector, USB charging circuitry, USB ESD protection
- LiPo battery connector
- 4.2V LiPo to 3.3V buck supply
- PCB target: common JLC 6-layer stackup with 50-ohm coplanar microstrip guidance for RF
High-Level Execution Plan
1. Lock system architecture and unresolved interfaces
- Confirm whether the EMG front end is a dedicated biopotential AFE with integrated ADC, lead-off detection, and impedance measurement, or a separate analog front end plus standalone ADC.
- Confirm whether USB is only for charging, or also for data/debug/DFU.
- Confirm whether the radio path is for 2.4 GHz BLE only and whether an external RF test connector is needed.
- Confirm channel performance targets: sample rate per channel, resolution, input noise, CMRR, bandwidth, and electrode drive/reference strategy.
2. Select critical silicon first
- Select the EMG AFE/ADC as the architecture-driving part.
- Select the nRF52840 package/module variant that satisfies USB, RF, antenna, and assembly constraints.
- Select the LiPo charger / power-path topology.
- Select the 3.3 V buck regulator appropriate for battery input range, noise, efficiency, and load current.
- Select USB ESD, connector family, and flex connectors.
3. Capture key constraints before drawing the schematic
- Freeze connector pin counts, cable orientations, and mating part families.
- Define battery charge current, expected runtime, and maximum system current.
- Define whether the design must operate while charging.
- Define whether patient isolation or medical compliance is in scope.
- Define board size / shape / flex placement constraints for the wearable enclosure.
- Define whether the antenna is onboard, module-based, or via RF feed to an external antenna.
4. Build the project structure in Flux
- Create the project description and a permanent requirements/spec document.
- Organize the design into functional blocks:
- EMG input connectors
- Input protection / bias / reference network
- AFE/ADC
- nRF52840
- RF matching / antenna path
- USB + charging
- battery + buck supply
- external I2C connector
- programming / debug / test points
5. Implement the power architecture in the schematic
- Add USB connector, USB ESD, charger, battery connector, buck regulator, and power tree.
- Partition rails clearly (VBUS, BAT, 3V3, analog rails if required).
- Add measurement / enable / status circuitry as needed.
- Add decoupling strategy early and assign capacitor roles.
- Decide whether any analog rail requires filtering or an LDO after the buck.
6. Implement the MCU subsystem
- Add the chosen nRF52840 variant.
- Add required clocking, reset, boot/DFU, SWD/debug, USB data lines if applicable, and decoupling.
- Connect SPI to the AFE/ADC.
- Connect the external I2C flex connector to the nRF, including pull-ups if required.
- Reserve GPIOs for status LEDs, interrupts, charge status, and optional test features.
7. Implement the EMG acquisition front end
- Add the 16-pin EMG flex connector and map all 8 differential pairs explicitly.
- Add input protection, filtering, biasing, reference electrodes, driven reference / right-leg-drive equivalent if required by the chosen AFE.
- Add lead-off / impedance measurement support consistent with the selected AFE.
- Implement anti-alias or EMI filtering only as recommended by the chosen device datasheet/reference design.
- Define analog and digital ground strategy around the AFE.
8. Implement RF and antenna section
- Add the RF feed from the nRF output through the specified chip resistor and matching network.
- Reserve component footprints for tuning flexibility.
- Decide antenna type and placement constraints.
- Capture 50-ohm coplanar microstrip targets for the chosen JLC 6-layer stackup.
- Identify copper keepouts and placement restrictions around the antenna / RF path.
9. Run first-pass schematic reviews
- Check missing decoupling, pull-ups, voltage ratings, and part availability.
- Verify connector pin mapping, SPI/I2C addressing, power domains, and boot/debug access.
- Verify every critical IC has a real MPN, datasheet, and footprint.
10. Prepare the PCB framework before placement
- Set board size/shape and choose the intended JLC 6-layer stackup.
- Define placement regions: analog input zone, AFE/ADC zone, MCU/RF zone, power/charging zone, connectors.
- Define layout rules for analog, power, USB, and RF nets.
- Capture any impedance/routing assumptions as project notes.
11. Place components by functional priority
- Place flex connectors first based on enclosure and cable exit direction.
- Place AFE/ADC immediately adjacent to EMG input connector to minimize sensitive trace length.
- Place analog protection/filtering directly at the connector / AFE boundary.
- Place nRF52840 and RF matching/antenna according to antenna keepout rules.
- Place charger, buck, battery connector, and USB connector in a compact power region away from the sensitive analog front end.
- Place decoupling caps tightly to device power pins.
12. Route in risk order
- Route power first.
- Route the most sensitive analog differential EMG inputs next.
- Route clocks / SPI / USB next.
- Route RF feed with controlled geometry and keepout.
- Route lower-risk GPIO / control signals last.
- Add stitching vias, return paths, and ground strategy deliberately around analog and RF areas.
13. Review, iterate, and de-risk
- Run DRC/ERC repeatedly.
- Re-check parts availability and footprints.
- Review analog noise risks, coupling from buck/USB/RF into AFE, and antenna keepout violations.
- Confirm manufacturability for JLC 6-layer rules and connector footprints.
14. Final output preparation
- Finalize BOM, pick-and-place, fabrication outputs, and assembly notes.
- Create bring-up checklist covering power rails, charger behavior, USB enumeration if used, SPI communication, electrode detect/impedance test, and BLE/RF validation.
Major Ambiguities Requiring User Clarification
EMG / AFE / ADC
- Do you want a dedicated biopotential AFE with integrated ADC, or a discrete front end plus separate ADC?
- What exact EMG performance targets are required?
- Sample rate per channel
- ADC resolution / ENOB
- input-referred noise
- passband
- CMRR / 50-60 Hz rejection
- Is lead-off detection enough, or do you specifically need quantitative electrode impedance measurement?
- Do you need a driven reference / bias electrode connection in addition to the 8 differential pairs?
- Is the design intended only for research / prototyping, or does it need medical / safety compliance planning?
MCU / USB / Firmware Interfaces
- Which nRF52840 variant do you want: bare IC or certified module?
- When you say “with USB PHY,” do you want native USB data implemented, or only charging over USB-C / USB?
- What firmware/debug access is required: SWD header, tag-connect, pogo pads, USB DFU, or all of these?
- What is the role of the external I2C connector: sensor expansion, host interface, accessory bus, or programming?
- What voltage level should the external I2C connector expose, and does it need hot-plug or protection?
RF
- What antenna approach do you want?
- onboard chip antenna
- PCB antenna
- module antenna
- U.FL / external antenna
- Is the “chip resistor and matching network” mandatory as a specific topology, or just a placeholder / tuning network requirement?
- Do you want RF test access or conducted test capability?
Power / Battery / Charging
- What battery capacity range and peak current budget should the design support?
- Must the system run while charging, or may charging be disabled during operation?
- What maximum USB charge current is acceptable?
- Is a buck-only 3.3 V rail acceptable for the analog front end, or do you expect a quieter post-regulated analog rail?
- Do you need battery measurement / fuel gauging?
Connectors / Mechanics
- What exact flex connector pitch, orientation, and mating direction are required for the 16-pin and 4-pin connectors?
- Is the EMG flex connector truly 16 pins for 8 differential inputs only, or are extra pins needed for reference / bias / shield?
- What board outline, size, thickness, and keepout constraints come from the wearable mechanical design?
- Are there shielding, guard ring, or enclosure grounding requirements?
PCB / Manufacturing
- Which specific “common JLC 6-layer stackup” do you want to target?
- Do you want controlled impedance to be treated as design guidance only, or do you want final dimensions derived against a locked stackup table?
- Are there assembly constraints such as all-top placement, minimum component size, hand-assembly prototypes, or no-BGA rules?
Recommended Immediate Next Decisions
- Freeze the AFE/ADC architecture.
- Freeze the exact nRF52840 variant and antenna strategy.
- Freeze USB role: charging only vs charging + data.
- Freeze battery/charger operating mode and current target.
- Freeze both flex connector part families and pin maps.
- Freeze the exact JLC 6-layer stackup to be used for RF guidance.
Suggested First Execution Milestones
- Milestone 1: requirements clarification complete
- Milestone 2: critical parts selected and datasheets attached
- Milestone 3: power + MCU + AFE schematic captured
- Milestone 4: reviews pass for core schematic
- Milestone 5: board stackup/rules defined
- Milestone 6: placement complete
- Milestone 7: routing + review complete
- Milestone 8: manufacturing package and bring-up plan ready