Part Verification and Datasheet Update
Thought for 4 sec
I’ll review the existing part metadata, find and set the official datasheet URL if missing, then compare the symbol, footprint, and pin descriptions against the datasheet.
Worked for 2 mins 9 sec
I found the official TI datasheet URL and am checking it against the current symbol/footprint; the existing Datasheet URL points to an uploaded copy rather than TI’s canonical PDF.
Worked for 1 min 13 sec
Completed the TPS259540DSGT part review and updated the Datasheet URL to TI’s official PDF: https://www.ti.com/lit/ds/symlink/tps2595.pdf. I created the detailed report here:
tps259540dsgt-part-verification-report.Open items:
- Package property is mismatched: currently
TO, should beDSG/WSON-8. - Pin types/descriptions are mostly unspecified and should be enriched from the datasheet.
- Footprint pad count matches, but exact pad geometry could not be fully verified from the available inspection output.
Suggested next steps:
- Fix the package metadata to
DSG / WSON-8. - Add datasheet-accurate pin types and pin descriptions.
- Verify or adjust the footprint land pattern against TI DSG0008A dimensions.
Fix metadata and verify
Fix identified issues
Verify footprint geometry
Run ERC/DRC
Export part data
Refine this doc
Ask about this doc
TPS259540DSGT Part Verification Report
Source data reviewed
- Project/part:
TPS259540DSGT - Manufacturer: Texas Instruments
- Current project description:
2.7V to 18V, 4A, 34m eFuse with fast overvoltage protection - Published part UID:
095133d0-f61a-4d21-b258-df5a48e9fc84 - Official datasheet found: https://www.ti.com/lit/ds/symlink/tps2595.pdf
- TI product page: https://www.ti.com/product/TPS2595/part-details/TPS259540DSGT
Datasheet property update
The existing Datasheet URL pointed to an uploaded PDF copy. I updated the project-level
Datasheet URL property to TI's canonical datasheet URL:Key datasheet specs
Table
| Item | Datasheet value |
|---|---|
| Device family | TPS2595xx eFuse |
| Orderable MPN | TPS259540DSGT |
| Status | Active / production |
| Function | 2.7 V to 18 V, 4 A, 34 mΩ eFuse with fast overvoltage protection |
| Package | DSG / WSON, 8 pins plus exposed thermal pad |
| Body size | 2.0 mm × 2.0 mm nominal |
| Pitch | 0.5 mm |
| Max package height | 0.8 mm |
| Recommended VIN | 2.7 V to 18 V |
| Continuous current | 4 A max over -40°C to 125°C; 5 A max over -40°C to 105°C |
| Typical RON | 34 mΩ |
| Output OV clamp for TPS25954x | 13.7 V typ |
| Thermal shutdown response for TPS259540 | Latch-off |
| Enable polarity | Active high |
| Quick output discharge | No |
| Operating junction temperature | -40°C to 125°C |
| Thermal pad | Must be soldered to PCB and connected to GND |
Datasheet pinout cross-check
Table
| Datasheet pin | Datasheet name | Function | Project symbol terminal | Result |
|---|---|---|---|---|
| 1 | dVdt | Slew-rate capacitor pin; leave floating for fastest turn-on | DVDT pin number 1 | Match; naming case differs only |
| 2 | EN/UVLO | Active-high enable / UVLO programming; do not leave floating | EN/UVLO pin number 2 | Match |
| 3 | IN | Power input | IN_1 pin number 3 | Match |
| 4 | IN | Power input | IN_2 pin number 4 | Match |
| 5 | OUT | Power output | OUT pin number 5 | Match |
| 6 | FLT | Open-drain fault output; external pull-up required | ~FLT pin number 6 | Match; tilde correctly implies active-low |
| 7 | ILM | Current limit / monitor; resistor to GND required for current limit | ILM pin number 7 | Match |
| 8 | GND | Ground | GND_1 pin number 8 | Match |
| Exposed pad | GND / thermal pad | Thermal pad, solder to PCB and connect to GND | GND_2 pin number 9 | Functionally match, but see mismatch note below |
Footprint cross-check
Datasheet mechanical/package expectation:
- TI package drawing: DSG0008A, WSON-8, 2.0 mm × 2.0 mm body
- 8 perimeter terminals plus exposed thermal pad
- 0.5 mm terminal pitch
- Example land pattern: eight 0.25 mm × 0.5 mm pads plus 1.6 mm × 0.9 mm exposed pad
- Exposed pad must be soldered to PCB for thermal/mechanical performance and tied to GND
Project footprint observations:
- Project reports 9 pads:
DVDT,EN/UVLO,IN_1,IN_2,OUT,~FLT,ILM,GND_1,GND_2. - This corresponds to 8 pins plus one exposed pad, which is expected for DSG WSON-8.
- The layout data exposed by the inspection tool lists pad designators but did not expose pad dimensions/coordinates in the tree output; the flat SVG showed the 2 mm body/silkscreen but did not render detailed copper pad geometry. Therefore, footprint pad count and naming pass, but exact land-pattern dimensions could not be fully verified from the available layout inspection output.
Mismatches / issues flagged
Package or Case Codeis currently set toTO, which is incorrect. Datasheet package isDSG/WSON-8, 2 mm × 2 mm.- Exposed pad is represented as schematic pin number
9/GND_2. This is acceptable for CAD mapping, but the datasheet treats it as an exposed thermal pad rather than a numbered signal pin. Its pin description should explicitly say exposed thermal pad / connect to GND. - Symbol terminals have
Pin Type: Unspecified. Recommended pin types are:DVDTanalog I/O,EN/UVLOanalog input,IN_1andIN_2power input,OUTpower output,~FLTopen-drain digital output,ILManalog I/O,GND_1ground,GND_2exposed thermal pad / ground. - The symbol/terminal entries do not include detailed pin descriptions even though the datasheet provides terminal functions. Adding these would improve downstream part usability.
- Exact copper pad geometry could not be confirmed from the available inspection output; verify against TI land pattern if publishing/using for production.
Overall result
The symbol pin numbers and names align with the TI TPS259540DSGT datasheet. The footprint pad count aligns with the expected 8-pin WSON plus exposed pad. The main metadata issue is the incorrect package property (
TO instead of DSG/WSON-8), and pin descriptions/types should be enriched to match the datasheet.Source data reviewed
Datasheet property update
Key datasheet specs
Datasheet pinout cross-check
Footprint cross-check
Mismatches / issues flagged
Overall result
