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    MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm.png

    MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm.png

    MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mmThumbnail
    MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm

    MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm

    defaultDefault
    kicad_mod

    MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm.kicad_mod

    F_MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mmFootprint
    step

    MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm.step

    3D_MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm3D Model

    MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm

    MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm thumbnail
    MSOP-10-1EP is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 3 mm (L x W) with 10 pins. The lead pitch between the pins is typically 0.5 mm. The package features an exposed pad (EP) with dimensions of approximately 1.68 mm x 1.88 mm (L x W). The EP is used for thermal management and should be connected to a heat sink or PCB pad for optimal heat dissipation. The package is also known as Mini Small Outline Package 10-1EP or MSOP-10EP. #part #template

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    creativecommons.org/licenses/by/4.0/

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    Qty 1

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