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Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    step

    User Library-lfcsp-8-2.STEP

    3D_User Library-lfcsp-8-23D Model
    LFCSP-8_2x2mm_P0.5mm.png

    LFCSP-8_2x2mm_P0.5mm.png

    LFCSP-8_2x2mm_P0.5mmThumbnail
    kicad_mod

    LFCSP-8_2x2mm_P0.5mm.kicad_mod

    F_LFCSP-8_2x2mm_P0.5mmFootprint
    LFCSP-8_2x2mm_P0.5mm

    LFCSP-8_2x2mm_P0.5mm

    defaultDefault

    LFCSP-8_2x2mm_P0.5mm

    LFCSP-8_2x2mm_P0.5mm thumbnail
    LFCSP-8 is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 2 mm x 2 mm (L x W) with 8 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Lead Frame Chip Scale Package 8 or LFCSP-8. #part #template

    Properties

    U

    creativecommons.org/licenses/by/4.0/

    Pricing & Availability

    Distributor

    Qty 1

    Controls