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    Assets

    step

    DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm.step

    3D_DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm3D Model
    kicad_mod

    DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm.kicad_mod

    F_DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mmFootprint
    DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm.png

    DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm.png

    DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mmThumbnail
    DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm

    DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm

    defaultDefault

    DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm

    DFN-10-1EP_3x3mm_P0.5mm_EP1.7x2.5mm thumbnail
    DFN-10-1EP is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 3 mm (L x W) with 10 pins. The lead pitch between the pins is typically 0.5 mm. The package features an exposed pad (EP) with dimensions of approximately 1.7 mm x 2.5 mm (L x W). The EP is used for thermal management and should be connected to a heat sink or PCB pad for optimal heat dissipation. The package is also known as Dual Flat No-leads 10-1EP or DFN-10EP. #part #template

    Properties

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    creativecommons.org/licenses/by/4.0/

    Pricing & Availability

    Distributor

    Qty 1

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