This project is a vehicle display subsystem (from a Tesla Roadster open-source design) intended to show how to optimize cost and supply-chain risk in a real, fairly complex mixed-signal + power PCB.
Purpose (what it’s trying to do)
Provide a compute/control core for a display system using a microcontroller + external parallel memories.
Interface out to a display panel/cable harness and supporting vehicle I/O.
Generate multiple power rails from an automotive supply and drive peripherals like backlight and audio.
Core building blocks (what’s on the board)1) Compute + memory subsystem
The nets indicate a classic parallel memory bus (address lines, data lines, chip-enables, OE/WE, byte-lane controls) between U1 and the memories (e.g., U4, U5, U6, U8, U9).
A small logic decoder helps expand chip-selects: U7
2) Display / external connectivity
High-pin-count FFC/FPC to panel or subassembly: J3
Additional headers/connectors for harness/debug/peripherals:
Power net portals show multiple rails (e.g., VDD/VCC/+12 variants) distributed to logic and peripherals. The DC/DC parts (U13, U16, U17) generate those rails; protection parts (F1, F2, D18) help survive vehicle transients.
Pros: High bandwidth, deterministic access (useful for display pipelines with big SRAM).
Trade-offs: Many address/data/control lines increase routing complexity, layer count pressure, and EMI sensitivity. It also increases connector/pin-count needs.
Automotive power approach
Multiple switchers (U13, U16, U17) suggest a “generate what you need” rail strategy, which is typical for mixed loads (digital + backlight + analog).
Optimization lever (cost/supply): Consolidating rails or selecting higher-integration PMICs can reduce BOM line items, but may worsen EMI/thermal or constrain sequencing.
Supply-chain red flags already visible in the BOM
Several key ICs show lifecycle risk (example: U4 is flagged obsolete at some distributors; U19 appears obsolete).
This aligns with the project’s “cost optimization” theme: you’d typically replace these with available, pin-compatible (or near) alternatives and re-verify.
Layout + manufacturability snapshot (from PCB)
Board size rule: 84.7 mm x 67.5 mm (from the Layout rules).
Current DRC/implementation state indicates it’s not “production ready” yet:
These issues are consistent with an educational/example project or an in-progress PCB rather than a finished layout.
Potential challenges + performance considerations
Signal integrity / timing: Parallel memory + display timing signals can be sensitive to skew, ringing, and crosstalk; routing topology and return paths matter a lot.
EMI/EMC: Automotive supply + switching regulators + long connectors can create conducted/radiated EMI issues; CAN also has strict EMC expectations (helped by L6).
Thermals: Switchers (U13, U16, U17) and audio (U20) are typical hotspots.
Reliability / transients: Proper protection (already present via D18, F1, F2) must be validated against the real vehicle environment.
Real-world applications
Retrofit or OEM-like display controller modules
Instrument clusters / infotainment subassemblies
Any embedded HMI needing deterministic memory bandwidth and rugged power input
Areas for improvement / scalability / future enhancements
Close out correctness first
Fix the ERC items (NC pin connection on U4, undriven rail on U1).
Resolve DRC shorts/airwires/floating copper before evaluating performance.
Supply-chain hardening
Prioritize replacements for parts with “Obsolete/EOL/NRND” signals such as U4 and U19.
Replace “template no MPN” passives with sourced equivalents to eliminate the MPN review errors.
Architecture scaling options
If you need more graphics throughput or want fewer high-speed parallel nets: migrate toward a more integrated SoC/display pipeline (trade-off: software complexity, different power/EMI profile).
If you need modularity: keep the compute+memory local and push panel-specific analog/backlight onto a separate mezzanine connected via J3.
If you want, tell me whether your focus is (A) making this manufacturable as-is or (B) doing a cost/supply-chain redesign, and I’ll outline the highest-impact next steps in that direction.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
Tesla Vehicle Display System | AI Cost Optimization Tutorial [Example]
Learn how to optimize your project for cost with this Vehicle Display System project that was open sourced from the Tesla Roadster. Optimizing your BOM for cost can take forever to research component alternatives and understand the supply chain. Learn how to optimize for cost in seconds with Flux Copilot.
Properties
Properties describe core aspects of the project.
Pricing & Availability
Distributor
Qty 1
Arrow
$19.03–$29.52
Digi-Key
$37.80–$40.36
LCSC
$33.64–$33.82
Mouser
$40.82–$41.15
TME
$14.32
Verical
$9.12–$34.04
Controls
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