LTE subsystem: SIM7500E and pi-match network (L2, L3, C9, C10, C15, C16) wired to U.FL-R-SMT-1(10); ESD on SIM lines.
Unused portals and parts removed.
Tasks remaining
Rename CC nets (to CC1/CC2) and other nets for clarity.
Wire SIM7500E power and data pins to the nano-SIM connector (J2).
Hook up the remaining test points (TP7–TP13) to their nets.
Success criteria review
✅ GND merges corrected and power-tree complete
✅ USB ESD, DP/DM, CC wiring (nets not yet renamed)
✅ ESP32 integration (power, pogo, LED)
✅ VBAT_SENSE divider and testpoint
✅ Audio (DFPlayer → amp → speaker)
⚠️ LTE SIM power/data to J2 not yet wired
⚠️ Net renaming incomplete
Next step
Rename the CC and nets, complete the SIM7500E-to-SIM connector wiring, and connect the remaining test points. Then rerun ERC to verify schematic integrity.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant