LED1 Datasheet Overview

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Organizing queries for LED1 datasheet.

Defining LED specifications.

Here’s what I found and how LED1 (HL-5050RGBW-S1) is specified and used, based on its datasheet.
Sources
What it is and what it does
  • Identity: HONGLITRONIC HL-5050RGBW-S1, a surface-mount 5050 package containing four independent LED dice: Red (AlGaInP), Green (InGaN), Blue (InGaN), and White (InGaN with phosphor).
  • Purpose: Provide full-color (RGB) plus white output from a single compact LED package for decorative/visual lighting.
  • Common applications (from datasheet): Decorative lighting.
Key characteristics (datasheet values at Ta = 25 C unless noted)
Electrical/Optical (per channel at IF = 20 mA)
  • Forward voltage VF:
    • Red: 1.8 V (min) to 2.4 V (max)
    • Green: 2.8 V (min) to 3.4 V (max)
    • Blue: 2.8 V (min) to 3.4 V (max)
    • White: 2.8 V (min) to 3.4 V (max)
  • Dominant wavelength λd:
    • Red: 620 nm to 630 nm
    • Green: 520 nm to 530 nm
    • Blue: 460 nm to 470 nm
  • Luminous intensity (at 20 mA):
    • Red: 600 to 1000 mcd
    • Green: 1800 to 2200 mcd
    • Blue: 300 to 700 mcd
  • White channel:
    • Luminous flux: 7 to 9 lm (at 20 mA)
    • CRI (Ra): 80 (at 20 mA)
Ratings and environment
  • Continuous forward current IF: 20 mA (per die)
  • Pulse forward current IFP: 40 mA (0.1 ms pulse, 1/10 duty)
  • Reverse voltage VR: 5 V
  • ESD (HBM): 2000 V
  • Power dissipation Pd (per die): Red 48 mW; Green 68 mW; Blue 68 mW; White 68 mW
  • Viewing angle (2θ1/2): 120°
  • Operating/storage temperature: -35 C to +85 C
  • Moisture Sensitivity Level: MSL 4
  • Soldering: Note indicates product can withstand up to 260 C reflow, but suggested highest temperature is 240 C
Package and logistics
  • Package class: 5050 SMD (datasheet includes mechanical outline and recommended land pattern)
  • Tape-and-reel; 1000 pcs/reel (per datasheet)
  • RoHS compliant
How it operates in a circuit (from datasheet context)
  • Each die (R, G, B, W) is driven by forward biasing to the specified IF, producing the specified optical output (intensity/flux and wavelength/CCT). White emission is produced by an InGaN blue die with phosphor conversion.
  • The datasheet does not include a pin map for anode/cathode per die; consult the package drawing and your footprint to ensure correct pinout during layout and assembly.
Design guidance (general best practices)
  • Include a current-limiting element per LED channel (e.g., resistor or a constant-current driver). This prevents excessive IF and ensures you stay within the absolute maximum ratings and the intended electrical/optical characteristics.
  • For continuous lighting, consider running LEDs below their maximum current to manage heat and extend lifetime.
  • If using resistors, ensure their dissipation stays at or below 60% of the resistor’s power rating and verify sourcing/sinking capability of your driver.
How this part fits your module
  • In your design, LED1 is a single package that provides the RGB + White outputs used by your R/G/B/W channel nets. Drive each color within the rated IF (20 mA nominal, 40 mA pulse with constraints). The 120° viewing angle and the provided optical bins make it suitable for diffuse decorative illumination as the datasheet indicates.
Family/series and variations (from datasheet)
  • Part code structure: HL-5050-RGBW-S1 where:
    • “HL” = Honglitronic brand
    • “5050” = product size class
    • “RGBW” = emitted colors
    • “S1” = encapsulant type
  • Binning/ordering notes: Labels include ranks for luminous intensity (IV), dominant wavelength (WD), and forward voltage (VF), indicating available bin variations within the same model.
  • Compared to other 5050 family variants by the same vendor, differences typically arise from:
    • Color mix (e.g., RGB only vs. RGBW)
    • Encapsulant/lens type code (e.g., S1) which can affect handling and optical behavior
    • Bins for intensity, wavelength, and VF
  • Typical use cases of other variants (by family differences) align with similar decorative or indicator lighting needs but may target different color requirements or optical output ranges via binning.
Notes and cautions
  • The datasheet includes handling cautions for silicone lenses (softer/more susceptible to mechanical damage).
  • Moisture sensitivity (MSL 4) requires appropriate dry packing and reflow handling.
If you want, I can add the pin-map note to LED1 once you confirm the manufacturer’s recommended pad-to-die mapping for your exact footprint, or help size per-channel current limit elements based on your supply and desired IF.
Size LED resistors
Confirm LED1 pinout
Pick constant-current driver
Thermal and derating check
Update part metadata
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    Properties

    10 mm x 20 mm

    graph LR subgraph R Channel LED_Rp[LED R+] --> R_R[R Resistor] R_R --> Pad_Rp(R+) LED_Rm[LED R-] --> Pad_Rm(R-) end subgraph G Channel LED_Gp[LED G+] --> R_G[G Resistor] R_G --> Pad_Gp(G+) LED_Gm[LED G-] --> Pad_Gm(G-) end subgraph B Channel LED_Bp[LED B+] --> R_B[B Resistor] R_B --> Pad_Bp(B+) LED_Bm[LED B-] --> Pad_Bm(B-) end subgraph W1 Channel LED_W1p[LED W1+] --> R_W1[W1 Resistor] R_W1 --> Pad_W1p(W1+) LED_W1m[LED W1-] --> Pad_W1m(W1-) end subgraph W2 Channel LED_W2p[LED W2+] --> R_W2[W2 Resistor] R_W2 --> Pad_W2p(W2+) LED_W2m[LED W2-] --> Pad_W2m(W2-) end

    Standard 4 Layer

    5050rgbww 5 in 1 patch lamp bead

    R: 2.0-2.2v G: 3.0-3.2v B: 3.0-3.2v WW: 2.8-3.0v W: 2.8-3.0v

    V

    100

    mA

    0.3

    W

    5.0 * 5.0 * 1.6

    mm

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    Qty 1

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    $0.06

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