Cryptographic Coprocessor Design

Created VRM blocks for each rail

2:03

Started: Create VRM blocks for each rail: 0.9V @ 120A, 1.2V @ 50A, 1.0V @ 40A, 1.1V @ 30A, 3.3V @ 20A, and 5V @ 10A with proper sequencing and telemetry.
  • Connected U10:VFB, U10:IMON, C9:P1
  • Connected U11:VFB1, U11:PGOOD1, C10:P1
  • Connected U12:VOUT, U12:IMON, C11:P1
  • Connected U13:FB1, U13:ISENS, C12:P1
  • Connected U14:VCC to C13:P1
  • Connected U15:VOUT, U15:ISUM, C14:P1
  • Connected U10:SCL, U12:SCL, U13:SCL, U14:SCL, U15:SCL, J3:PIN_2
  • Connected U10:SDA, U12:SDA, U13:SDA, U14:SDA, U15:SDA, J3:PIN_1
  • Connected U11:RUN1, U12:EN, U14:PS#, U13:EN, U10:EN, U15:CTRL

Integrated heavy copper planes

0:32

Started: Integrate heavy copper planes, local decoupling, fusing, and TVS protection appropriate for high-current application..

Added internal data bus connectors

0:33

Started: Add connectors for internal data buses (polynomial, ciphertext, proof) and make net connections between these connector pins and their respective bus nets.

Added multi-pin status/GPIO header

0:24

Started: Add a multi-pin status/GPIO header and make net connections from each component’s status and GPIO pins to the corresponding header pins.

Implemented thermal management zones

0:30

Started: Implement thermal management zones within the OAM outline and place cooling-related components.

Applied placement rules

0:29

Started: Apply placement rules for EMI and thermal performance.

Ran ERC and DRC reviews

0:23

Started: Run ERC and DRC reviews to verify electrical and mechanical constraints.
J7
J9
U10 EN - U11 RUN1
U10 SCL - U12 SCL
C12 P2 - C3 P2
U10 SDA - U12 SDA
U14 IN - C1 P1
U13 FB1 - U13 ISENS
U10 SCL - U12 SCL
U10 SDA - U12 SDA
U10 SDA - U12 SDA
U11 PGOOD1 - C10 P1
U12 VOUT - U12 IMON
U12 VOUT - U12 IMON
U14 VCC - C3 P1
U10 EN - U11 RUN1
U15 VOUT - U15 ISUM
GND GND - U11 GND
U14 VCC - C3 P1
U10 SCL - U12 SCL
U10 SDA - U12 SDA
U14 VCC - C3 P1
U12 VOUT - U12 IMON
U10 EN - U11 RUN1
U10 EN - U11 RUN1
U13 FB1 - U13 ISENS
U14 IN - C1 P1
U10 IMON - C9 P1
C4 P2 - C14 P2
U15 VOUT - U15 ISUM
U10 SDA - U12 SDA
U10 SCL - U12 SCL
U10 EN - U11 RUN1
GND GND - U11 GND
GND GND - U11 GND
U11 PGOOD1 - C10 P1
GND GND - U11 GND
U13 FB1 - U13 ISENS
C4 P2 - C14 P2
U15 VOUT - U15 ISUM
C12 P2 - C3 P2
GND GND - U11 GND
GND GND - U11 GND
U10 SCL - U12 SCL
U10 EN - U11 RUN1
U10 IMON - C9 P1
J8, J9, J10
U2
J8, J9, J10
J8, J9, J10
U14
U11
U3
C7
Capacitance
Capacitance
C12
Capacitance
Capacitance
C1
Capacitance
Capacitance
C13
Capacitance
Capacitance
C8
Capacitance
Capacitance
C14
Capacitance
Capacitance
C11
Capacitance
Capacitance
C3
Capacitance
Capacitance
C9
Capacitance
Capacitance
C10
Capacitance
Capacitance
C4
Capacitance
Capacitance
C5
Capacitance
Capacitance
C6
Capacitance
Capacitance
C2
Capacitance
Capacitance
U1
U10
J16
D2
J3
J3
U12
J6
J5
J4
D1
J4
J17
J2
J2
J2
J1
J1
F1, F2
U13
J8
U2
F1, F2
U15
GND
U3

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    Pat6

    Pat6 thumbnail
    Dual-GPU OAM Accelerator Module with PCIe Gen5, CXL, Advanced Power Sequencing, and Integrated Management Interfaces

    Properties

    Baseline PCIe Gen5 compliance

    Specify OAM envelope keepouts within 312 mm × 111.15 mm × 38 mm dual-slot limit; define 38 mm max enclosure height

    graph TB subgraph High_Power_Zone direction TB HP_Loads["High-Current VRM & Power Distribution Blocks"] HP_Connectors["12V Auxiliary Power & PCIe Gen5/CXL Edge Connectors"] end subgraph Logic_Zone direction TB Logic_MCU["Management Bus, Control Logic & Monitoring"] Mem_Placeholders["HBM3/SRAM Memory Packages"] Fan_Headers["PWM Fan Headers & Thermal Sensors"] end %% Isolated Grounds HP_Zone_GND((GND_HP)) Logic_Zone_GND((GND_L)) HP_Loads --> HP_Zone_GND HP_Connectors --> HP_Zone_GND Logic_MCU --> Logic_Zone_GND Mem_Placeholders --> Logic_Zone_GND Fan_Headers --> Logic_Zone_GND

    Define 38 mm max enclosure height

    Pricing & Availability

    Distributor

    Qty 1

    Arrow

    $9.35–$12.59

    Digi-Key

    $24.22–$25.69

    LCSC

    $62.35

    Mouser

    $36.89

    TME

    $5.17

    Verical

    $4.90–$8.45

    Controls