Project Start Prompt

"FKNRUN Schematic ERC" completed.

flux

I’m reconciling the completed schematic/ERC work against the live project now. If the schematic gate is genuinely clear, I’ll continue through placement cleanup and pre-routing checks without pausing.
Thought for 10 mins 38 sec
Thought for 11 sec
Checking FKNRUN Schematic ERC progress…
Thought for 11 sec
Reading FKNRUN Schematic ERC's report…
Thought for 14 sec — Revising configuration plan
Checking Placement and Mechanical Cleanup progress…
Thought for 11 sec — Considering execution processes
Awaiting 1 background task
"PCB Placement Repair" completed.

flux

The schematic executor reduced ERC from 218 floating pins and 8 single-pin nets to 2 floating pins and 1 single-pin net. It completed most supply, ground, ADC, connector, CAN, protection, and unused-pin wiring.
Two electrical decisions remain before routing:
  • Select the MAX9926 crank/cam threshold mode for U10.
  • Remap VSS_GPIO; the current Teensy symbol exposes GPIO0–41, so the planned GPIO42 assignment is unavailable.
The placement-repair executor also completed, but I could not retrieve and reconcile its final report. Therefore the four overlap/access repairs, mounting-hole keepouts, CMC clearance, and Teensy service access are not yet independently accepted.
Routing has not started. Next session should reconcile placement, resolve the two schematic items, rerun ERC/DRC, remove stale traces, and then begin routing. Execution stopped because your ACUs ran out.
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Schematic

Layout

3D View

ECU PCB Layout Checklist
Mechanical baseline
  • Board: 180 × 120 mm, 4 copper layers, 3 mm corner radius.
  • Remove the obsolete onboard MAP sensor, vacuum port, and MAP edge reservation.
  • External MAP sensor uses the main 80-way Molex CMC harness.
  • Add four non-plated 3.2 mm finished M3 mounting holes at board coordinates relative to the lower-left corner:
    • MH1: (7, 7) mm
    • MH2: (173, 7) mm
    • MH3: (7, 113) mm
    • MH4: (173, 113) mm
  • Maintain an 8 mm diameter keepout around every mounting hole, free of components, copper, traces, vias, and silkscreen text.
External MAP interface
  • Sensor: external GM-style 40–304 kPa absolute MAP sensor, suitable for typical applications up to approximately 25 psi boost.
  • Pin A: SENSOR_GND.
  • Pin B: MAP_SIGNAL.
  • Pin C: +5V_SENSOR.
  • Sensor supply: nominal 5.1 V ratiometric interface.
  • Input circuit must safely scale and clamp the published possible 5.044 V maximum output below the Teensy 4.1 3.3 V ADC limit.
  • Firmware must use the sensor’s published transfer curve rather than a generic 3-bar calibration.
Placement priorities
  • Keep the Molex CMC connector accessible at an enclosure-facing edge.
  • Keep the Teensy USB connector accessible at the opposite enclosure-facing edge.
  • Preserve vertical and lateral clearance to remove and replace the socketed Teensy.
  • Group battery protection, regulators, injector drivers, relay drivers, and high-current returns in the noisy power/output zone.
  • Group knock, ADC/reference, MAP/TPS/temperature inputs, and crank/cam conditioning in the quiet analog zone.
  • Place connector protection components directly behind the corresponding connector pins.
  • Place every decoupling capacitor immediately beside its IC supply pin.
  • Completion gate: zero body overlaps, zero out-of-bounds components, zero keepout violations, and verified connector/USB service access.
Stackup and routing order
  • L1: components and critical/local signals.
  • L2: continuous ground plane.
  • L3: power distribution and secondary signals.
  • L4: remaining signals.
  • Route in order: battery/protection/regulators; grounds and power; injectors and relays; knock; crank/cam; analog sensors; CAN; coil/tach/speed outputs; SPI and remaining digital nets.
  • Keep high-current return paths out of the sensor-ground area and do not split the ground plane beneath critical signals.
Final validation
  • Run schematic ERC before routing release.
  • Remove dangling traces before autorouting.
  • Verify all footprints, connector cavity mapping, and Teensy pin allocation.
  • Run placement DRC before routing.
  • Finish with zero unintentional airwires and zero blocking DRC errors.
  • Review voltage/current ratings, thermal paths, automotive transient protection, enclosure clearances, and manufacturability before export.

  • Mechanical baseline

  • External MAP interface

  • Placement priorities

  • Stackup and routing order

  • Final validation